Texas Instruments TMS32C6416EZLZ6E3
- Part No.:
- TMS32C6416EZLZ6E3
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 532-BFBGA, FCBGA
- Datasheet:
-
TMS32C6416EZLZ6E3.pdf
- Description:
- IC FIXED POINT DSP 532-FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS32C6416EZLZ6E3 from Texas Instruments is a fixed-point digital signal processor (DSP) featuring a 600-MHz C64x™ VelociTI.2™ VLIW core, 1024KB L2 unified RAM/cache, dual external memory interfaces (64-bit EMIFA and 16-bit EMIFB), and integrated Viterbi & Turbo decoder coprocessors for real-time channel decoding in wireless baseband processing.
For engineers reviewing the TMS32C6416EZLZ6E3 datasheet, TMS32C6416EZLZ6E3 pinout, TMS32C6416EZLZ6E3 application, or TMS32C6416EZLZ6E3 equivalent, key selection criteria include its 600-MHz clock rate, 4800 MIPS performance, 532-pin ZLZ BGA package with 0.8-mm pitch, PCI 2.2 interface support, and dual coprocessor acceleration for 3GPP-compliant AMR and turbo decoding.
Technical Context
The TMS32C6416EZLZ6E3 implements an eight-functional-unit VelociTI.2™ VLIW architecture with six ALUs and two multipliers-each multiplier delivering four 16×16-bit or eight 8×8-bit operations per cycle. Its non-aligned load-store engine supports byte/half-word/word/doubleword addressing across 64 general-purpose 32-bit registers.
It integrates dedicated hardware accelerators: the VCP decodes >600 AMR voice channels at 7.95 Kbps (K=9, R=1/3), while the TCP handles up to seven 2-Mbps or 43 × 384-Kbps 3GPP turbo streams (6 iterations), both communicating via 64-channel EDMA. The device uses a flexible L1P/L1D/L2 memory hierarchy with configurable cache/mapped RAM allocation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clock Rate | 600 MHz - enables 4800 MIPS execution and 2400 MMACS (16-bit) throughput |
| L2 Memory | 1024 KB unified RAM/cache - configurable as mapped memory, cache, or hybrid for real-time buffer and code storage |
| EMIFs | 64-bit EMIFA + 16-bit EMIFB - glueless interface to SDRAM, ZBT SRAM, FIFO, and asynchronous memories |
| VCP/TCP | Dedicated Viterbi & Turbo coprocessors - offload baseband decoding, freeing CPU for higher-layer protocol stack tasks |
| PCI Interface | 32-bit/33-MHz PCI Master/Slave v2.2 - enables direct host-system data transfer without external bridge logic |
| UTOPIA Slave | 8-bit, up to 50 MHz per direction - supports ATM cell transport in DSLAM and broadband access equipment |
| Package | 532-pin ZLZ BGA, 23×23 mm, 0.8-mm ball pitch - Pb-free soldered balls; requires controlled-impedance PCB layout |
Pinout & Package
532-pin ZLZ plastic ball grid array (BGA) package with 0.8-mm ball pitch, 23 mm × 23 mm body size, and lead-free soldered balls. Thermal and mechanical data conform to TI's GLZ/ZLZ/CLZ family specifications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Input clock reference | Accepts 100 MHz crystal or oscillator; feeds PLL for internal 600-MHz core clock generation |
| EMU0–EMU3 | JTAG emulation interface | IEEE-1149.1 boundary-scan pins for real-time debugging and flash programming |
| HPI[31:0] | Host-port interface bus | User-configurable 16-/32-bit parallel interface for host CPU firmware loading and register access |
| PCI_AD[31:0] | PCI address/data multiplex | 32-bit multiplexed address/data bus supporting memory-mapped I/O and DMA transfers |
| EMIFA_A[22:0] | EMIFA address bus | 23-bit address lines for 1280-MB external memory space on 64-bit EMIFA interface |
| EMIFB_D[15:0] | EMIFB data bus | 16-bit bidirectional data path for low-bandwidth peripherals like EPROM or FPGA configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| VelociTI.2™ VLIW Core | Eight independent functional units execute up to eight 32-bit instructions/cycle - delivers deterministic high-throughput signal processing |
| VCP Acceleration | Hardware-accelerated Viterbi decoding at CPU clock/4 - reduces latency and CPU load for voice channel demodulation |
| TCP Acceleration | Max-log-map turbo decoder running at CPU clock/2 - supports full 3GPP parameter programmability including frame length and interleaver |
| Flexible Memory Architecture | L1P (16KB direct-mapped), L1D (16KB 2-way set-associative), L2 (1024KB unified) - enables cache-aware algorithm partitioning |
| EDMA Controller | 64 independent channels with QDMA and event chaining - eliminates CPU overhead for memory-to-peripheral transfers |
Applications
| Wireless Baseband Processing | DSLAM Line Card |
|---|---|
Use Scenario: Real-time processing of multiple concurrent 3GPP-compliant voice and data channels in macrocell BTS hardware. IC Role / Device Role / Timing Role: Primary baseband DSP executing channel coding/decoding, equalization, and modulation/demodulation functions. Use Value: Integrated VCP/TCP coprocessors reduce decode latency by >90% versus software-only implementation, enabling 43× 384-Kbps turbo streams within thermal envelope. |
Use Scenario: High-density ADSL2+ line card handling up to 96 simultaneous subscriber lines with dynamic spectrum management. IC Role / Device Role / Timing Role: Central DSP managing DMT symbol processing, echo cancellation, and FEC encoding/decoding per line. Use Value: 64-bit EMIFA interfaces directly to high-speed SDRAM for symbol buffering; UTOPIA slave connects to ATM backplane for aggregated traffic transport. |
| Industrial Video Analytics Edge Node | Medical Ultrasound Beamformer |
Use Scenario: Embedded vision system performing H.264 encode, motion detection, and object classification on 1080p video streams. IC Role / Device Role / Timing Role: Fixed-point DSP co-processing video pipeline alongside ARM host, offloading compute-intensive filtering and transform kernels. Use Value: Non-aligned load/store and quad-8-bit arithmetic accelerate pixel-level operations; 4800 MIPS sustains real-time 60-fps encoding with <50 ms end-to-end latency. |
Use Scenario: Portable ultrasound system requiring real-time beamforming, RF demodulation, and Doppler processing across 128 transducer channels. IC Role / Device Role / Timing Role: Dedicated DSP executing FIR filtering, FFT-based spectral analysis, and adaptive noise cancellation in time-critical signal chain. Use Value: Dual 16-bit MAC capability (2400 MMACS) enables 128-channel synthetic aperture beamforming at 20 MHz sampling with sub-sample delay resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6416TGLZ6E3 | Same core, identical peripherals, but GLZ package (lead-free bump + soldered balls) vs. ZLZ (lead-free soldered only); identical electrical specs | No functional difference; GLZ offers enhanced reliability for high-reliability industrial deployments | Select GLZ if extended temperature operation or long-term solder joint integrity is critical; ZLZ suffices for commercial telecom gear |
| TMS320C6415TGLZ6E3 | Lacks VCP/TCP coprocessors; retains PCI, UTOPIA, EMIFs, and same 600-MHz core; otherwise pin-compatible when peripherals disabled | Suitable for control-plane or non-decoding signal processing (e.g., echo cancellation, tone generation) where coprocessor acceleration is unnecessary | Choose C6415 only when VCP/TCP functionality is unused - avoids over-specification and potential cost premium |
Compared with TMS32C6416EZLZ6E3, the GLZ variant offers identical performance with improved interconnect robustness, while the C6415 trades coprocessor acceleration for lower cost in non-decoding roles - neither is pin-compatible without peripheral configuration alignment.
Availability
TMS32C6416EZLZ6E3 is available at Aetrix Electronics and suitable for wireless infrastructure, broadband access equipment, and medical imaging systems requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for TMS32C6416EZLZ6E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and communications markets.
The TMS320C64x™ DSP product line was designed for high-throughput, low-latency fixed-point signal processing in multichannel wireless, broadband, and real-time imaging applications - emphasizing hardware acceleration, memory bandwidth, and peripheral integration.
FAQ
What is the core clock speed and instruction throughput of the TMS32C6416EZLZ6E3?
The TMS32C6416EZLZ6E3 operates at a guaranteed 600 MHz core clock, delivering 4800 million instructions per second (MIPS) and up to 2400 million multiply-accumulates per second (MMACS) using 16-bit operands. This performance stems from its eight-functional-unit VelociTI.2™ VLIW architecture, which executes up to eight 32-bit instructions per cycle. The TMS32C6416EZLZ6E3 achieves this with a 1.67-ns instruction cycle time and 1.4-V core voltage.
Does the TMS32C6416EZLZ6E3 include hardware accelerators for communication standards?
Yes, the TMS32C6416EZLZ6E3 integrates two dedicated hardware coprocessors: the Viterbi Decoder Coprocessor (VCP) and Turbo Decoder Coprocessor (TCP). The VCP supports over 600 AMR voice channels at 7.95 Kbps, while the TCP handles up to seven 2-Mbps or 43 × 384-Kbps 3GPP turbo streams with full programmability of frame length, interleaver, and iteration count. These accelerators are exclusive to the C6416 variant and are not present in C6414 or C6415.
What external memory interfaces does the TMS32C6416EZLZ6E3 support?
The TMS32C6416EZLZ6E3 features two glueless external memory interfaces: a 64-bit EMIFA supporting SDRAM, ZBT SRAM, and FIFO devices, and a 16-bit EMIFB for asynchronous memories like EPROM or FPGA configuration storage. Together they provide access to a total addressable space of 1280 MB. The EMIFA operates at 133 MHz in 600-MHz devices, while EMIFB runs at CPU/4 (150 MHz), enabling high-bandwidth baseband buffering and low-speed control memory access simultaneously.
Is the TMS32C6416EZLZ6E3 pin-compatible with other C64x devices?
The TMS32C6416EZLZ6E3 is pin-for-pin compatible with TMS320C6414 and TMS320C6415 devices when peripheral selection matches - specifically, PCI and UTOPIA must be disabled on C6415/C6416 to match C6414 pinout, and BEA[9:7] pins must be correctly configured. However, full functional compatibility requires matching peripheral enable states; mismatched configurations may result in undefined pin behavior or contention.
What development tools are supported for the TMS32C6416EZLZ6E3?
Texas Instruments provides a complete C64x™ development ecosystem for the TMS32C6416EZLZ6E3, including the C6000 Code Generation Tools (C compiler, assembler, linker), Code Composer Studio™ IDE with real-time analysis and JTAG debugging, and the C64x™ DSP/BIOS real-time kernel. Hardware tools include XDS560-class emulators and evaluation modules with McBSP, HPI, and EMIF breakout headers - all validated for use with the TMS32C6416EZLZ6E3 in ZLZ BGA packaging.
TMS32C6416EZLZ6E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C6414/15/16
- Package/Case:
- 532-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, McBSP, PCI, UTOPIA
- Clock Rate:
- 600MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1.03MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.40V
- Operating Temperature:
- 0°C ~ 90°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 532-FCBGA (23x23)
TMS32C6416EZLZ6E3 FAQ
1.How can I place an order for TMS32C6416EZLZ6E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS32C6416EZLZ6E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS32C6416EZLZ6E3 reliable?
The price and inventory of TMS32C6416EZLZ6E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS32C6416EZLZ6E3 is usually 5 days.
3.What payment methods are accepted for TMS32C6416EZLZ6E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS32C6416EZLZ6E3 transactions.
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4.How is shipping managed for TMS32C6416EZLZ6E3?
TMS32C6416EZLZ6E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS32C6416EZLZ6E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS32C6416EZLZ6E3?
For technical support, including TMS32C6416EZLZ6E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS32C6416EZLZ6E3 requirements.
6.How does Aetrix verify that TMS32C6416EZLZ6E3 is sourced from the original manufacturer or authorized distributors?
All TMS32C6416EZLZ6E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS32C6416EZLZ6E3 meets industry standards.
7.What is the process for return or replacement of TMS32C6416EZLZ6E3?
All TMS32C6416EZLZ6E3 units undergo pre-shipment inspection (PSI). If there is an issue with TMS32C6416EZLZ6E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS32C6416EZLZ6E3 part is unused and in its original packaging.
Return procedure for TMS32C6416EZLZ6E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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