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Texas Instruments TMS32C6416EZLZA6E3
- Part No.:
- TMS32C6416EZLZA6E3
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 532-BFBGA, FCBGA
- Datasheet:
-
TMS32C6416EZLZA6E3.pdf
- Description:
- IC DSP FIXED-POINT 532-FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,196
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Product details
Overview
TMS32C6416EZLZA6E3 from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) featuring a 600-MHz VelociTI.2™ VLIW core, 1024KB L2 unified RAM/cache, dual external memory interfaces (64-bit EMIFA + 16-bit EMIFB), and integrated Viterbi & Turbo decoder coprocessors (VCP/TCP). It delivers 4800 MIPS and 3840 MMACS for real-time baseband processing in 3G/UMTS infrastructure equipment.
For engineers reviewing the TMS32C6416EZLZA6E3 datasheet, TMS32C6416EZLZA6E3 pinout, TMS32C6416EZLZA6E3 application, or TMS32C6416EZLZA6E3 equivalent, key selection criteria include its 532-pin ZLZ BGA package, 3.3-V I/O / 1.4-V core voltage, PCI 2.2 interface support, UTOPIA Level 2 slave capability, and coprocessor acceleration for AMR voice and 3GPP turbo decoding.
Technical Context
The TMS32C6416EZLZA6E3 implements an eight-functional-unit VelociTI.2™ DSP core with six ALUs (supporting quad-8-bit/dual-16-bit/32-bit arithmetic) and two multipliers (enabling four 16×16-bit or eight 8×8-bit MACs/cycle). Its non-aligned load-store architecture and 64 general-purpose 32-bit registers enable high instruction-level parallelism.
It integrates dedicated hardware accelerators - the VCP decodes >600 AMR 7.95-Kbps channels at CPU/4 clock rate, while the TCP handles up to seven 2-Mbps or 43 × 384-Kbps 3GPP frames (6 iterations) at CPU/2 - both interfacing via the 64-channel EDMA controller without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Rate | 600 MHz - enables 4800 MIPS throughput and real-time execution of complex telecom algorithms. |
| L2 Memory Size | 1024 KB unified RAM/cache - configurable as mapped memory or mixed cache/mapped space for flexible program/data allocation. |
| EMIF Interfaces | 64-bit EMIFA + 16-bit EMIFB - supports glueless connection to SDRAM, ZBT SRAM, FIFO, and asynchronous memories with 1280 MB total address space. |
| VCP/TCP Coprocessors | VCP + TCP present - offloads Viterbi and turbo decoding from main CPU, reducing latency and freeing 90%+ core cycles for higher-layer protocol stack. |
| PCI Interface | 32-bit, 33-MHz PCI Master/Slave v2.2 - enables direct host-system integration without bridge logic in base station control cards. |
| UTOPIA Interface | 8-bit UTOPIA Level 2 Slave - supports up to 400 Mbps ATM cell transport for backhaul interface in DSLAMs and MSANs. |
| Package | 532-pin ZLZ BGA, 23×23 mm, 0.8-mm ball pitch - Pb-free soldered balls; requires controlled-impedance PCB layout with 10+ power/ground layers for signal integrity. |
Pinout & Package
532-pin ZLZ plastic ball grid array (BGA) package with 0.8-mm ball pitch and 23×23 mm footprint. Lead-free soldered balls; bottom-view layout per TI SPRS146N mechanical drawing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Input clock reference | Accepts 50–100 MHz crystal or oscillator input; feeds PLL multiplier (×6 or ×12) to generate 600-MHz core clock. |
| EMIFA[63:0] | 64-bit external memory data/address bus | Direct interface to SDRAM/ZBT SRAM; supports burst transfers, programmable wait states, and synchronous/asynchronous timing modes. |
| HPI[31:0] | Host-port interface bus | User-configurable 16-/32-bit parallel interface for host CPU firmware loading, debug access, or real-time parameter updates. |
| PCI_AD[31:0] | PCI address/data multiplexed bus | 32-bit multiplexed address/data lines compliant with PCI Specification 2.2; supports memory-mapped I/O and DMA transfers. |
| UTOPIA_DATA[7:0] | UTOPIA parallel data bus | 8-bit bidirectional cell-data path operating up to 50 MHz per direction; supports user-defined cell formats up to 64 bytes. |
| VSS/VDD | Power supply terminals | Separate 3.3-V I/O (VDD_IO) and 1.4-V core (VDD) rails; requires ≥12 decoupling capacitors per rail with <100-ps rise time handling. |
Key Features
| Feature | Design Value |
|---|---|
| VelociTI.2™ VLIW Core | Eight independent functional units (6 ALUs + 2 multipliers) executing up to eight 32-bit instructions/cycle with full conditional execution and instruction packing. |
| VCP Hardware Accelerator | Offloads Viterbi decoding for >600 AMR 7.95-Kbps voice channels; supports K=5–9, R=1/2–1/4, soft/hard decision outputs via EDMA. |
| TCP Hardware Accelerator | Executes max-log-map turbo decoding for up to 43 × 384-Kbps 3GPP frames; fully programmable interleaver, iteration count, and stopping criteria. |
| Dual EMIF Architecture | EMIFA (64-bit) and EMIFB (16-bit) operate concurrently - enables simultaneous SDRAM-based program execution and flash-based data buffering. |
| PCI 2.2 + UTOPIA L2 | Integrated 32-bit/33-MHz PCI master/slave and 8-bit UTOPIA Level 2 slave - eliminates external interface ICs in telecom line cards and packet gateways. |
Applications
| Wireless Baseband Processing | 3G Node B Control Card |
|---|---|
Use Scenario: Real-time channel coding/decoding and modulation/demodulation in WCDMA femtocells and macrocells. IC Role / Device Role / Timing Role: Primary baseband DSP executing physical layer (PHY) stack with hardware-accelerated VCP/TCP offloading convolutional and turbo decoding. Use Value: Achieves 4800 MIPS deterministic processing to meet 3GPP TS 25.212 frame timing constraints (< 10 µs latency per 10-ms frame). |
Use Scenario: Control plane processing and inter-processor communication in distributed Node B architectures. IC Role / Device Role / Timing Role: PCI-connected master processor managing RF resource allocation, OAM signaling, and synchronization with remote radio units. Use Value: 32-bit PCI v2.2 interface enables 132 MB/s host-to-DSP data transfer, eliminating bottlenecks in CPICH power control loop updates. |
| DSLAM Line Card | ATM Edge Switch |
Use Scenario: Multi-channel ADSL2+ framing, echo cancellation, and Reed-Solomon encoding in carrier-class DSLAMs. IC Role / Device Role / Timing Role: High-throughput DSP handling 256-channel G.992.5 processing with McBSP-linked analog front-end and EMIFA-connected packet buffer memory. Use Value: Dual EMIFs allow concurrent 64-bit SDRAM access for FFT computation and 16-bit flash access for firmware storage - no memory arbitration stalls. |
Use Scenario: Cell segmentation/reassembly and QoS policing in metro Ethernet-to-ATM aggregation nodes. IC Role / Device Role / Timing Role: UTOPIA Level 2 slave controller interfacing directly to PHY-layer ATM framer chips at 400 Mbps line rate. Use Value: On-chip UTOPIA interface reduces external logic count by 3 ICs and cuts cell-processing latency to < 200 ns per 53-byte cell. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6416TGLZA7 | 720-MHz core (1.39-ns cycle), 1.4-V core, same ZLZ package - 20% higher MIPS but tighter thermal envelope (2.8 W vs. 2.3 W). | Required for >5000-MIPS PHY layer stacks in LTE-TDD small cells; not drop-in due to higher power delivery and cooling requirements. | Select when raw throughput exceeds 4800 MIPS and system thermal design accommodates +0.5 W dissipation. |
| ADSP-BF537BBCZ-5A | Blackfin 500-MHz dual-core (DSP + MCU), 128 KB L1 SRAM, no VCP/TCP, 176-LQFP - lacks telecom-specific accelerators and PCI/UTOPIA. | Suitable for control-plane-only tasks (e.g., SNMP agent, CLI, diagnostics) where baseband acceleration is handled externally. | Select for cost-sensitive, lower-complexity control cards lacking channel-decoding requirements. |
Compared with TMS32C6416EZLZA6E3, the TMS320C6416TGLZA7 offers higher clock rate but demands stricter thermal management, while the ADSP-BF537BBCZ-5A provides MCU/DSP hybrid functionality at lower integration density and no telecom coprocessors - making TMS32C6416EZLZA6E3 optimal for balanced throughput, acceleration, and interface richness in 3G infrastructure.
Availability
TMS32C6416EZLZA6E3 is available at Aetrix Electronics and suitable for wireless infrastructure, DSLAM line cards, and ATM edge switching requiring stable component supply across extended product lifecycles.
Supply support for TMS32C6416EZLZA6E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in DSP architecture.
The TMS320C64x™ family was designed specifically for high-throughput, low-latency fixed-point signal processing in telecommunications infrastructure - emphasizing hardware acceleration, multi-interface concurrency, and scalable performance from 500 to 720 MHz.
FAQ
What is the core voltage requirement for TMS32C6416EZLZA6E3?
The TMS32C6416EZLZA6E3 requires a nominal 1.4-V core supply (VDD) with ±3% tolerance and separate 3.3-V I/O supply (VDD_IO). Power sequencing must assert VDD before VDD_IO, and both rails must ramp monotonically within 100 ms. The TMS32C6416EZLZA6E3 datasheet specifies minimum decoupling of 4× 10-µF tantalum + 12× 0.1-µF ceramic capacitors per rail.
Does TMS32C6416EZLZA6E3 support PCI Express?
No, TMS32C6416EZLZA6E3 supports only PCI Specification 2.2 (32-bit, 33-MHz, 132 MB/s peak) - not PCI Express. It implements PCI Master/Slave mode with three address spaces (prefetchable memory, non-prefetchable memory, and I/O) and four-wire EEPROM interface for configuration. PCI Express capability is absent in the C6416 silicon design.
How many McBSP ports does TMS32C6416EZLZA6E3 include?
The TMS32C6416EZLZA6E3 integrates three multichannel buffered serial ports (McBSP0, McBSP1, McBSP2), each supporting up to 256 channels and compatible with T1/E1 framers, AC97 codecs, SPI peripherals, and ST-Bus switches. McBSP1 shares pins with UTOPIA, so enabling UTOPIA disables McBSP1 - a hardware mux confirmed in the TMS32C6416EZLZA6E3 terminal functions table.
Is TMS32C6416EZLZA6E3 pin-compatible with TMS320C6415 devices?
Yes, TMS32C6416EZLZA6E3 is pin-for-pin compatible with TMS320C6415 devices when both are configured in identical peripheral selection mode and the PCI and UTOPIA peripherals on the C6415 are disabled. Pin compatibility also requires proper BEA[9:7] strap configuration per the TMS32C6416EZLZA6E3 device configurations section - mismatched strapping breaks compatibility.
What boot modes are supported by TMS32C6416EZLZA6E3?
The TMS32C6416EZLZA6E3 supports multiple boot modes selected via GPIO pins at reset: HPI boot (host loads code), EMIF boot (from external SDRAM/flash), and ROM boot (internal mask ROM). Boot mode configuration is latched during reset assertion and determines initial memory map and initialization sequence - all modes are documented in Section 7.1 of the TMS32C6416EZLZA6E3 datasheet.
TMS32C6416EZLZA6E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C6414/15/16
- Package/Case:
- 532-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, McBSP, PCI, UTOPIA
- Clock Rate:
- 600MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1.03MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.40V
- Operating Temperature:
- -40°C ~ 105°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 532-FCBGA (23x23)
TMS32C6416EZLZA6E3 FAQ
1.How can I place an order for TMS32C6416EZLZA6E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS32C6416EZLZA6E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS32C6416EZLZA6E3 reliable?
The price and inventory of TMS32C6416EZLZA6E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS32C6416EZLZA6E3 is usually 5 days.
3.What payment methods are accepted for TMS32C6416EZLZA6E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS32C6416EZLZA6E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS32C6416EZLZA6E3?
TMS32C6416EZLZA6E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS32C6416EZLZA6E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS32C6416EZLZA6E3?
For technical support, including TMS32C6416EZLZA6E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS32C6416EZLZA6E3 requirements.
6.How does Aetrix verify that TMS32C6416EZLZA6E3 is sourced from the original manufacturer or authorized distributors?
All TMS32C6416EZLZA6E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS32C6416EZLZA6E3 meets industry standards.
7.What is the process for return or replacement of TMS32C6416EZLZA6E3?
All TMS32C6416EZLZA6E3 units undergo pre-shipment inspection (PSI). If there is an issue with TMS32C6416EZLZA6E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS32C6416EZLZA6E3 part is unused and in its original packaging.
Return procedure for TMS32C6416EZLZA6E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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