Texas Instruments TMS32C6713BGDPA200

Overview

TMS32C6713BGDPA200 from Texas Instruments is a high-performance floating-point digital signal processor (DSP) based on the C67x VLIW architecture, operating at 200 MHz with 1600 MIPS / 1200 MFLOPS performance. It integrates dual McASPs for multichannel audio I/O, 256 KB on-chip L2 memory (64 KB cache/mapped RAM + 192 KB SRAM), and a 32-bit glueless EMIF for SDRAM/SRAM/Flash interfacing - deployed in professional audio processing systems requiring real-time multi-format digital audio routing and encoding.

For engineers reviewing the TMS32C6713BGDPA200 datasheet, TMS32C6713BGDPA200 pinout, TMS32C6713BGDPA200 application, or TMS32C6713BGDPA200 equivalent, key selection criteria include its 272-ball BGA (GDP) package, IEEE-754 single/double-precision support, McASP DIT compliance with S/PDIF/IEC60958-1/AES-3, 16-channel EDMA bandwidth, and boot-mode flexibility (HPI or 8/16/32-bit ROM).

Technical Context

The TMS32C6713BGDPA200 implements an eight-functional-unit VLIW core with two fixed-point ALUs, four floating-/fixed-point ALUs, and two floating-/fixed-point multipliers - enabling parallel execution of eight 32-bit instructions per cycle. Its load-store architecture uses thirty-two 32-bit general-purpose registers and supports conditional execution for all instructions.

Memory hierarchy includes 4 KB direct-mapped L1P program cache, 4 KB 2-way set-associative L1D data cache, and 256 KB unified L2 space partitioned into 64 KB configurable cache/mapped RAM and 192 KB dedicated mapped SRAM. The PLL-based clock generator supports programmable prescaler/multiplier/postscaler ratios (×4–×25, ÷1–÷32) to derive SYSCLK2, AUXCLK, and ECLKIN from CLKIN or external sources.

Key Specifications

Pinout & Package

272-ball BGA (GDP) package with exposed thermal pad; 1.2 V core supply (CVDD), 3.3 V I/O supply (DVDD), and ground (VSS) distributed across multiple balls for low-noise operation and thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar floating-point DSP applications.

Compared with TMS32C6713BGDPA200, the ZDP variant shares identical functionality but demands mechanical redesign, while the PYP sacrifices EMIF width and McASP scalability - making GDP the only option delivering full 32-bit memory bandwidth and 16 McASP data pins at 200 MHz.

Availability

TMS32C6713BGDPA200 is available at Aetrix Electronics and suitable for professional audio mixers, broadcast encoders, digital audio workstations, and studio-grade codecs requiring stable component supply across extended product lifecycles.

Supply support for TMS32C6713BGDPA200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation and industrial-grade reliability.

The TMS320C67x DSP family was designed for high-throughput, low-latency floating-point signal processing in multichannel audio, telecom infrastructure, and medical imaging - emphasizing deterministic real-time performance and peripheral integration.

FAQ

What is the maximum operating frequency of the TMS32C6713BGDPA200?

The TMS32C6713BGDPA200 is rated for 200 MHz operation, delivering 1600 MIPS and 1200 MFLOPS. This speed grade is validated across the full industrial temperature range (−40°C to 85°C) with 1.2 V core supply and 3.3 V I/O. Higher-speed variants (225 MHz, 300 MHz) exist but require different part numbers and stricter voltage/thermal conditions.

Does the TMS32C6713BGDPA200 support IEEE-754 single- and double-precision floating-point arithmetic?

Yes, the TMS32C6713BGDPA200 natively supports IEEE-754 single- and double-precision operations through its four floating-/fixed-point ALUs and two floating-/fixed-point multipliers. Instruction set features include saturation, normalization, and bit-field manipulation - all compliant with IEEE-754 standards for bit-accurate algorithm execution.

How many McASP serial data pins does the TMS32C6713BGDPA200 provide?

The TMS32C6713BGDPA200 provides 16 McASP serial data pins - eight per McASP (McASP0 and McASP1), each assignable to independent transmit or receive clock zones. This enables concurrent handling of multiple audio protocols such as I2S, S/PDIF, and AES-3 without external multiplexing.

What package type is used by the TMS32C6713BGDPA200?

The TMS32C6713BGDPA200 uses the 272-ball GDP BGA package with an exposed thermal pad (PowerPAD). It measures 27 × 27 mm, features 1.2 V core supply (CVDD) and 3.3 V I/O (DVDD), and requires controlled-impedance PCB routing for high-speed McASP and EMIF signals.

Can the TMS32C6713BGDPA200 boot from external Flash memory?

Yes, the TMS32C6713BGDPA200 supports 8-bit, 16-bit, or 32-bit ROM boot modes. In 32-bit mode, it executes code directly from external Flash connected to the 32-bit EMIF, enabling fast startup and field-upgradable firmware stored in non-volatile memory.

What is the configuration of on-chip L2 memory in the TMS32C6713BGDPA200?

The TMS32C6713BGDPA200 contains 256 KB of on-chip L2 memory: 64 KB is configurable as unified cache/mapped RAM, and the remaining 192 KB is fixed as mapped SRAM. This architecture allows flexible allocation for instruction caching, data buffering, and real-time audio sample storage without external memory access penalties.