My Inquiry
My Account
Texas Instruments TMS5701115CZWTQQ1
- Part No.:
- TMS5701115CZWTQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 337-LFBGA
- Datasheet:
-
TMS5701115CZWTQQ1.pdf
- Description:
- IC MCU 16/32B 1MB FLASH 337NFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,090
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS5701115CZWTQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 1 MB ECC-protected flash, 128 KB ECC RAM, and integrated safety features including BIST, error signaling, and voltage/clock monitoring - deployed in electric power steering and ABS systems.
For engineers reviewing the TMS5701115CZWTQQ1 datasheet, TMS5701115CZWTQQ1 pinout, TMS5701115CZWTQQ1 application, or TMS5701115CZWTQQ1 equivalent, key selection criteria include ASIL-D compliance support, N2HET timing coprocessor count (44 channels), ePWM deadband generation capability, FlexRay dual-channel interface, and ZWT 337-ball BGA package compatibility.
Technical Context
The TMS5701115CZWTQQ1 implements a dual-core lockstep architecture where both Cortex-R4F CPUs execute identical instructions and compare results in real time to detect transient faults. It integrates two independent N2HET modules (N2HET1 with 32 channels, N2HET2 with 18 channels) for deterministic I/O timing control, each with dedicated HTU for DMA-style memory transfers protected by MPU.
Its safety-critical peripheral set includes three DCAN controllers compliant with CAN 2.0A/B, dual 12-bit MibADCs with 24 total inputs and parity-protected 64-word buffers, and seven ePWM modules supporting high-side/low-side switching with trip-zone protection synchronized to ADC triggers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F, 1.66 DMIPS/MHz, up to 180 MHz → delivers 298 DMIPS real-time compute for ASIL-D motor control loops. |
| Flash Memory | 1 MB with ECC → ensures bit-error correction and double-bit error detection for program storage integrity in automotive environments. |
| RAM | 128 KB SRAM with ECC → provides fault-tolerant data workspace for safety-critical runtime variables and stack operations. |
| N2HET Channels | 44 total (32 + 18) → enables precise, software-defined timing for up to 44 sensor/actuator signals without CPU intervention. |
| ePWM Modules | 7 modules with deadband & trip zones → supports full-bridge inverter gate drive with hardware-enforced shoot-through prevention. |
| MibADC Inputs | 24-channel dual 12-bit ADC with 64-word parity buffers → allows synchronized sampling of motor phase currents and DC-link voltage with error-detectable buffering. |
| Communication | 3× DCAN, 2× FlexRay, 3× MibSPI, LIN, I2C, UART → meets redundancy and bandwidth requirements for distributed vehicle networks. |
Pinout & Package
Package: 337-ball NFBGA (ZWT), 16.0 mm × 16.0 mm, 0.8 mm ball pitch, green RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nERROR | Error signaling output | Active-low open-drain fault indicator tied to external safety monitor; asserts on uncorrectable ECC, BIST failure, or clock/voltage violation. |
| VCCIO | I/O supply rail | 3.0–3.6 V domain powering all digital I/Os, FlexRay transceivers, and CAN PHY interfaces; decoupling required per TI layout guidelines. |
| VCC | Core supply rail | 1.14–1.32 V domain powering Cortex-R4F cores, L1 cache, and internal buses; requires ultra-low-noise regulation and tight tolerance. |
| ECLK | External clock monitor | Programmable frequency-divided output of VCLK; used externally to verify device clock operation during startup and runtime diagnostics. |
| GIOA[7:0] | General-purpose I/O bank A | 8 configurable pins supporting interrupt generation, GPIO, or N2HET/GIO multiplexing; individually controllable via GIO registers. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CPU Lockstep | Real-time comparison of instruction execution between two identical Cortex-R4F cores detects transient faults with zero-latency fail-safe response. |
| ECC on Flash & RAM | Single-bit correction and double-bit detection across 1 MB flash and 128 KB RAM prevents silent data corruption in safety-critical firmware and variables. |
| N2HET Timing Coprocessors | Two independent N2HET modules (32 + 18 channels) offload complex waveform generation, capture, and I/O sequencing from main CPU. |
| ePWM with Trip Zone | Hardware-enforced deadtime insertion and immediate PWM shutdown upon external fault signal (e.g., overcurrent) prevents inverter shoot-through. |
| FlexRay Dual Channel | 10 Mbps per channel deterministic communication with built-in FTU for autonomous message RAM transfers and MPU-protected access. |
| Parameter Overlay Module (POM) | Runtime redirection of flash reads to RAM or EMIF enables field calibration updates without flash reprogramming or system reset. |
Applications
| Electric Power Steering (EPS) | Braking Systems (ABS/ESC) |
|---|---|
|
Use Scenario: Real-time torque assist calculation and brushless motor commutation in column-assist EPS units. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU verification and ePWM-driven inverter gate signals. Use Value: 7 ePWM modules provide independent high/low-side outputs with synchronized deadband and trip-zone shutdown for 3-phase BLDC drive. |
Use Scenario: Wheel speed acquisition, hydraulic pressure modulation, and yaw rate control in anti-lock braking systems. IC Role / Device Role / Timing Role: Central safety MCU acquiring 4× wheel speed via eQEP modules and commanding solenoid valves through ePWM outputs. Use Value: Dual 12-bit MibADCs sample brake pressure sensors and temperature monitors simultaneously with 64-word parity buffers for fault-detectable data logging. |
| HEV/EV Inverter Control | Railway Traction Control |
|
Use Scenario: High-fidelity current sensing and gate driver control for IGBT/SiC inverters in hybrid electric vehicle traction systems. IC Role / Device Role / Timing Role: Safety-certified real-time controller interfacing with isolated current sensors via MibADC and driving gate drivers via ePWM with hardware trip zones. Use Value: N2HET modules generate precise gate timing waveforms and capture isolated feedback pulses with sub-microsecond resolution, independent of CPU load. |
Use Scenario: Distributed propulsion control across multiple locomotive axles requiring deterministic communication and fault containment. IC Role / Device Role / Timing Role: Safety gateway and motion controller using FlexRay dual-channel for redundant train bus and DCAN for subsystem messaging. Use Value: Three DCAN controllers enable concurrent communication with braking, signaling, and HVAC subsystems while maintaining ASIL-B separation boundaries. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS1227ZWT | Higher memory: 1280 KB flash, 192 KB RAM, same ZWT package and N2HET/ePWM peripherals. | Supports larger AUTOSAR OS images and more complex diagnostic routines without memory constraints. | Select when extended code footprint or additional RAM for multi-tasking RTOS is required; pin-compatible but higher cost. |
| TMS570LS0432PZ | Smaller package: 100-pin QFP, lower performance (80 MHz), reduced peripherals (1× N2HET, 1× MibADC). | Targeted at cost-sensitive ASIL-B subsystems like body control modules rather than ASIL-D powertrain. | Choose for non-powertrain applications where ZWT BGA assembly is impractical and full TMS5701115CZWTQQ1 capability is unnecessary. |
Compared with TMS5701115CZWTQQ1, TMS570LS1227ZWT offers greater memory headroom for complex safety stacks, while TMS570LS0432PZ trades capability for package simplicity and cost - neither is pin-compatible, but both share the same safety architecture and toolchain.
Availability
TMS5701115CZWTQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, and HEV/EV inverter control requiring stable component supply across long-life automotive programs.
Supply support for TMS5701115CZWTQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for automotive, industrial, and communications markets.
The TMS570 Hercules™ family is designed specifically for ASIL-D and SIL-3 safety-critical applications, combining lockstep CPU architectures, memory ECC, and self-test logic to meet ISO 26262 and IEC 61508 requirements.
FAQ
What safety certifications does the TMS5701115CZWTQQ1 support?
The TMS5701115CZWTQQ1 is architected to support ISO 26262 ASIL-D and IEC 61508 SIL-3 compliance. Its dual lockstep Cortex-R4F CPUs, ECC on flash and RAM, BIST for CPU and memory, and error signaling module (ESM) with nERROR pin provide the hardware foundation required for functional safety certification. Documentation packages including FMEDA reports and safety manuals are provided by Texas Instruments to aid customer certification efforts for TMS5701115CZWTQQ1-based systems.
Does the TMS5701115CZWTQQ1 include hardware support for motor control?
Yes, the TMS5701115CZWTQQ1 includes dedicated hardware for motor control: seven ePWM modules with programmable deadband, trip-zone inputs, and synchronization to MibADC triggers; two eQEP modules for encoder position/speed feedback; six eCAP modules for precise event timing; and two 12-bit MibADCs with 24 total inputs and 64-word parity-protected buffers. These peripherals operate independently of the CPU core, enabling deterministic real-time control essential for TMS5701115CZWTQQ1-based inverter designs.
What is the package type and thermal profile of the TMS5701115CZWTQQ1?
The TMS5701115CZWTQQ1 uses a 337-ball NFBGA (ZWT) package measuring 16.0 mm × 16.0 mm with 0.8 mm ball pitch. Its thermal resistance is ΘJA = 24.5°C/W under JEDEC JESD51-2 conditions (2s2p board), and it operates across –40°C to 125°C ambient temperature. The device requires careful PCB layout with thermal vias under the exposed die pad and proper decoupling for both VCC (1.14–1.32 V) and VCCIO (3.0–3.6 V) supplies to maintain stability in TMS5701115CZWTQQ1 automotive deployments.
Can the TMS5701115CZWTQQ1 interface with FlexRay and CAN networks simultaneously?
Yes, the TMS5701115CZWTQQ1 integrates one dual-channel FlexRay controller (10 Mbps per channel) and three DCAN controllers (CAN 2.0A/B compliant, up to 1 Mbps). All five controllers operate concurrently and independently, with dedicated message RAM (8 KB total) and transfer units (FTU for FlexRay, HTU for N2HET). This enables TMS5701115CZWTQQ1 to serve as a central safety gateway connecting FlexRay backbone networks with CAN-based subsystems such as body electronics or chassis modules.
How does the Parameter Overlay Module (POM) function in the TMS5701115CZWTQQ1?
The Parameter Overlay Module (POM) in the TMS5701115CZWTQQ1 allows runtime remapping of flash memory accesses to internal RAM or external EMIF addresses. This enables field-updatable calibration parameters without reprogramming flash - critical for TMS5701115CZWTQQ1 applications where EEPROM emulation must survive 100k+ write cycles. POM operates transparently to software, using dedicated address comparators and configurable overlay regions, and is supported by TI's HALCoGen configuration tools for TMS5701115CZWTQQ1 projects.
TMS5701115CZWTQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 337-LFBGA
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 101
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5701115CZWTQQ1 FAQ
1.How can I place an order for TMS5701115CZWTQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5701115CZWTQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5701115CZWTQQ1 reliable?
The price and inventory of TMS5701115CZWTQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5701115CZWTQQ1 is usually 5 days.
3.What payment methods are accepted for TMS5701115CZWTQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5701115CZWTQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS5701115CZWTQQ1?
TMS5701115CZWTQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5701115CZWTQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5701115CZWTQQ1?
For technical support, including TMS5701115CZWTQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5701115CZWTQQ1 requirements.
6.How does Aetrix verify that TMS5701115CZWTQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5701115CZWTQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5701115CZWTQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5701115CZWTQQ1?
All TMS5701115CZWTQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5701115CZWTQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5701115CZWTQQ1 part is unused and in its original packaging.
Return procedure for TMS5701115CZWTQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMS5701115CZWTQQ1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
