Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments TMS5702125CPGEQQ1

Part No.:
TMS5702125CPGEQQ1
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixTMS5702125CPGEQQ1.pdf
Description:
IC MCU 16/32BIT 2MB FLSH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,762

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TMS5702125CPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 2MB ECC-protected flash, 192KB ECC-protected RAM, and integrated safety features including BIST, parity-protected peripherals, and error signaling for ASIL-D systems. It targets brake control, electric power steering, and battery management in harsh environments.

For engineers reviewing the TMS5702125CPGEQQ1 datasheet, TMS5702125CPGEQQ1 pinout, TMS5702125CPGEQQ1 application, or TMS5702125CPGEQQ1 equivalent, key selection criteria include functional safety certification (ISO 26262), dual-CPU lockstep execution, FlexRay/CAN/LIN interface support, N2HET timer resolution, and 144-pin LQFP package compatibility with industrial temperature range (-40°C to 125°C).

Technical Context

The device implements a dual-core lockstep architecture where both Cortex-R4F CPUs execute identical instructions and compare results in real time; mismatch triggers ESM fault response. Memory subsystem includes ECC on flash and RAM, parity on peripheral memories (MibADC buffers, N2HET RAM, message RAM), and dedicated MPUs for DMA, HTU, and FTU.

Real-time peripherals include two N2HET modules (N2HET1 with 32 channels, N2HET2 with 18 channels), two 12-bit MibADCs (24 total inputs, 64-word parity-protected buffers each), three DCAN controllers compliant with CAN 2.0B up to 1 Mbps, and a dual-channel FlexRay controller with autonomous FTU transfers.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-R4F dual-core lockstep, 1.66 DMIPS/MHz at up to 160 MHz (198 DMIPS)
Flash Memory2MB program flash with ECC and single-bit correction/double-bit detection
RAM192KB data RAM with ECC and single-bit correction/double-bit detection
N2HET ChannelsN2HET1: 32 programmable channels; N2HET2: 18 programmable channels
ADC ResolutionTwo 12-bit MibADC modules, 24 total analog inputs, 64-word parity-protected result buffers each
Communication InterfacesThree DCAN (CAN 2.0B, up to 1 Mbps), one FlexRay (dual-channel, 10 Mbps/channel), one LIN (v2.1), one SCI, one I2C, three MibSPI, two SPI
Operating Temperature-40°C to +125°C ambient, qualified for automotive safety-critical applications
Package144-pin LQFP (PGE), 20.0 mm × 20.0 mm, green RoHS-compliant

Pinout & Package

The TMS5702125CPGEQQ1 uses a 144-pin LQFP (PGE) package with 0.5 mm pitch, designed for automotive PCB layouts requiring thermal robustness and mechanical reliability under vibration and thermal cycling.

Pin/TerminalCircuit RoleDesign Meaning
nRSTReset InputActive-low asynchronous reset; initiates warm reset sequence and clears CPU registers
nERRORError OutputOpen-drain fault indicator driven by Error Signaling Module upon detected internal error
GIOA[7:0]General-Purpose I/OEight configurable GPIO pins with interrupt capability and programmable pull-up/down
N2HET1[31:0]N2HET Timer I/O32 dedicated pins for high-resolution timing functions including PWM, capture, compare, and GPIO
DCAN1_TX/DCAN1_RXCAN Transceiver InterfaceDifferential pair supporting CAN 2.0B protocol at up to 1 Mbps with built-in bus arbitration
MIBSPI1_SIMO[1:0]Serial Data OutputDual SIMO lines for simultaneous communication with multiple SPI slaves using chip select multiplexing
AD1IN[7:0]Analog Input Channel GroupEight dedicated ADC1 input pins with programmable sampling window and hardware trigger support

Key Features

FeatureDesign Value
Dual CPU LockstepContinuous real-time comparison of instruction execution between two Cortex-R4F cores to detect transient faults
ECC Memory ProtectionSingle-bit error correction and double-bit error detection on 2MB flash and 192KB RAM for data integrity in safety-critical operation
FlexRay FTUAutonomous FlexRay data transfer unit with MPU-enforced memory access boundaries for deterministic communication
N2HET Hardware Angle GeneratorOn-chip angle generation logic synchronized to crankshaft/camshaft position signals for engine timing control
Parity-Protected Peripheral RAM64-word parity-protected buffers in each MibADC and 8KB message RAM for FlexRay ensure data validity during high-noise operation
EMIF Support16-bit external memory interface enabling connection to SDRAM, FPGA, or asynchronous peripherals without CPU overhead

Applications

Braking SystemsElectric Power Steering (EPS)

Use Scenario: Real-time hydraulic pressure modulation and wheel-speed-based slip detection in ABS and ESC modules.

IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D software with lockstep CPU validation and hardware BIST.

Use Value: Enables deterministic <100 µs loop closure for brake actuation while maintaining fault coverage >99% per ISO 26262 requirements.

Use Scenario: Torque assist calculation and motor phase control in column-assist and rack-assist EPS systems.

IC Role / Device Role / Timing Role: Real-time torque computation engine interfacing with dual-resolver sensors and driving 3-phase inverter via N2HET PWM outputs.

Use Value: Delivers sub-microsecond PWM edge placement accuracy and synchronized ADC sampling for precise motor current regulation.

Battery Management SystemsRailway Communications

Use Scenario: Cell voltage monitoring, thermal management, and SOC/SOH estimation in high-voltage traction battery packs.

IC Role / Device Role / Timing Role: Safety-certified data acquisition node with isolated CAN/FlexRay gateways and redundant ADC sampling paths.

Use Value: Supports 24-channel simultaneous sampling with 12-bit resolution and parity-checked result buffers for fault-tolerant cell monitoring.

Use Scenario: Onboard train control unit managing signaling interlocking, door control, and PIS integration over ERTMS/ETCS Level 1 networks.

IC Role / Device Role / Timing Role: Deterministic communication gateway with dual FlexRay channels and three CAN interfaces for legacy and modern rail protocols.

Use Value: Guarantees <500 ns jitter on FlexRay frame transmission and supports SIL-4 certified communication stacks via hardware error signaling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar safety microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMS570LS2135PGE256KB ECC RAM vs. 192KB; same 2MB flash, identical PGE package and pinoutHigher RAM capacity supports larger diagnostic code footprint and extended runtime loggingSelect when additional RAM is required for complex ASIL-D diagnostics without changing PCB layout
SPC574K72E5Power Architecture e200z4 dual-core, 2MB flash, 384KB RAM, AEC-Q100 Grade 0, ISO 26262 ASIL-D certifiedDifferent ISA and toolchain; supports AUTOSAR 4.3+ and has integrated Ethernet MACChoose for new designs requiring Ethernet connectivity or AUTOSAR compliance where TI toolchain independence is preferred

Compared with TMS5702125CPGEQQ1, TMS570LS2135PGE offers +64KB RAM in identical packaging for enhanced diagnostic depth, while SPC574K72E5 provides architectural divergence with Ethernet and AUTOSAR support-neither is pin-compatible, but both serve overlapping ASIL-D automotive domains with distinct ecosystem trade-offs.

Availability

TMS5702125CPGEQQ1 is available at Aetrix Electronics and suitable for braking systems, electric power steering, and battery management requiring stable component supply across automotive production lifecycles.

Supply support for TMS5702125CPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and automotive ICs, with leadership in functional safety microcontrollers and automotive signal chain solutions.

The TMS570 family was designed specifically for ASIL-D automotive safety applications, integrating lockstep CPUs, memory ECC, and hardware self-test to meet ISO 26262 requirements without external safety monitors.

FAQ

What safety certifications does the TMS5702125CPGEQQ1 hold?

The TMS5702125CPGEQQ1 is qualified to AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D system-level development. Its dual lockstep CPU, ECC memory, BIST logic, and error signaling module provide the hardware foundation required for ASIL-D decomposition. TI provides FMEDA reports, safety manuals, and diagnostic software libraries to accelerate certification-TMS5702125CPGEQQ1 itself is not "certified" as a standalone component but is architected for use in ASIL-D systems.

Does the TMS5702125CPGEQQ1 support external memory expansion?

Yes, the TMS5702125CPGEQQ1 includes a 16-bit External Memory Interface (EMIF) supporting connection to SDRAM, SRAM, Flash, and FPGA devices. The EMIF provides address/data multiplexing, programmable timing parameters, and bank-select logic. It operates independently of the CPU core, allowing background memory transfers without impacting real-time control loops-critical for TMS5702125CPGEQQ1 applications like logging or firmware updates.

How many CAN interfaces does the TMS5702125CPGEQQ1 integrate?

The TMS5702125CPGEQQ1 integrates three DCAN controllers compliant with CAN 2.0B protocol, each supporting bit rates up to 1 Mbps. All three controllers feature message objects with parity protection, transmit/receive FIFOs, and automatic retransmission. They are fully independent and can operate simultaneously on separate buses-enabling TMS5702125CPGEQQ1 to serve as central gateway in multi-domain vehicle networks (e.g., chassis, powertrain, body).

What is the maximum operating frequency of the TMS5702125CPGEQQ1?

The TMS5702125CPGEQQ1 operates at a maximum system clock frequency of 160 MHz, delivering up to 198 DMIPS performance. This frequency is achieved using the Frequency-Modulated PLL (FMPLL) with external crystal reference. The device maintains full functionality-including ECC checking, N2HET timing, and ADC sampling-at this speed across its full -40°C to +125°C temperature range, as validated in TMS5702125CPGEQQ1 production testing.

Is the TMS5702125CPGEQQ1 pin-compatible with other TMS570 family members in the PGE package?

Yes, all TMS570LS21x5 and TMS570LS31x5 variants in the 144-pin PGE package-including TMS570LS2125PGE, TMS570LS2135PGE, and TMS570LS3135PGE-are pin-compatible. Pin functions, power domains, and peripheral mappings are identical; only flash/RAM capacities and certain peripheral configurations differ. This allows hardware reuse across safety tiers-TMS5702125CPGEQQ1 shares the same PCB footprint as higher-memory variants for scalable design.

TMS5702125CPGEQQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
144-LQFP
Series:
Hercules™ TMS570 ARM® Cortex®-R
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
58
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

TMS5702125CPGEQQ1 FAQ

1.How can I place an order for TMS5702125CPGEQQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS5702125CPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS5702125CPGEQQ1 reliable?

The price and inventory of TMS5702125CPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5702125CPGEQQ1 is usually 5 days.

3.What payment methods are accepted for TMS5702125CPGEQQ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5702125CPGEQQ1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS5702125CPGEQQ1?

TMS5702125CPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS5702125CPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS5702125CPGEQQ1?

For technical support, including TMS5702125CPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5702125CPGEQQ1 requirements.

6.How does Aetrix verify that TMS5702125CPGEQQ1 is sourced from the original manufacturer or authorized distributors?

All TMS5702125CPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5702125CPGEQQ1 meets industry standards.

7.What is the process for return or replacement of TMS5702125CPGEQQ1?

All TMS5702125CPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5702125CPGEQQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS5702125CPGEQQ1 part is unused and in its original packaging.

Return procedure for TMS5702125CPGEQQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TMS5702125CPGEQQ1 Tags

  • TMS5702125CPGEQQ1
  • TMS5702125CPGEQQ1 PDF
  • TMS5702125CPGEQQ1 Datasheet
  • TMS5702125CPGEQQ1 Specifications
  • TMS5702125CPGEQQ1 Images
  • Texas Instruments
  • Texas Instruments TMS5702125CPGEQQ1
  • Buy TMS5702125CPGEQQ1
  • TMS5702125CPGEQQ1 Price
  • TMS5702125CPGEQQ1 Distributor
  • TMS5702125CPGEQQ1 Supplier
  • TMS5702125CPGEQQ1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER