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Texas Instruments TMS5702125DPGEQQ1
- Part No.:
- TMS5702125DPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMS5702125DPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 2MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,909
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Product details
Overview
TMS5702125DPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 2MB ECC-protected flash, 192KB ECC-protected RAM, and integrated safety features including BIST, parity-protected peripherals, and error signaling for ASIL-D systems. It targets brake control, electric power steering, and battery management in harsh environments.
For engineers reviewing the TMS5702125DPGEQQ1 datasheet, TMS5702125DPGEQQ1 pinout, TMS5702125DPGEQQ1 application, or TMS5702125DPGEQQ1 equivalent, key selection criteria include functional safety certification (ISO 26262), dual-CPU lockstep execution, FlexRay/CAN/LIN interface support, N2HET timer resolution, and 144-pin LQFP package compatibility with industrial temperature range (-40°C to 125°C).
Technical Context
The TMS5702125DPGEQQ1 implements a safety-critical architecture with two identical ARM Cortex-R4F cores executing identical instructions in lockstep, with continuous comparison logic detecting divergence. Its FMPLL provides system clock up to 180 MHz, while separate nonmodulating PLL supports FlexRay timing compliance at 10 Mbps per channel.
Peripheral safety mechanisms include ECC on flash and RAM, parity protection on MibADC buffers, N2HET RAM, and message RAM; dedicated MPUs for HTU, FTU, and DMA; and hardware loopback capability on I/Os for diagnostic coverage. The ESM monitors all error sources and asserts the nERROR pin or triggers interrupts based on configurable fault severity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core lockstep, 1.66 DMIPS/MHz, up to 180 MHz - enables deterministic real-time execution with hardware fault detection. |
| Flash Memory | 2MB with ECC - provides certified nonvolatile storage for safety-critical firmware with single-bit correction/double-bit detection. |
| RAM | 192KB SRAM with ECC - supports safe data handling and runtime variables with memory integrity assurance. |
| ADC | Two 12-bit MibADC modules (24 total channels, 64-word parity-protected buffer each) - delivers high-resolution sensor acquisition for motor control and battery monitoring. |
| N2HET Modules | N2HET1 (32 channels), N2HET2 (18 channels), each with hardware angle generator and HTU - enables precise PWM generation, capture timing, and actuator control without CPU load. |
| Communication | Three DCAN (CAN 2.0B, up to 1 Mbps), FlexRay dual-channel (10 Mbps/channel), LIN 2.1, SCI, I2C, three MibSPI - meets automotive networking requirements with redundancy and protocol flexibility. |
| Safety Features | Built-in self-test (BIST) for CPU/RAM, voltage/clock monitoring, ESM with nERROR output, MPU for DMA/HTU/FTU - satisfies ISO 26262 ASIL-D decomposition requirements. |
Pinout & Package
Package: 144-pin LQFP (PGE), 20.0 mm × 20.0 mm, green RoHS-compliant body. Thermal resistance ΨJT = 1.9°C/W (JEDEC JESD51-2A).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nRST | Warm reset input | Active-low synchronous reset signal; initiates controlled restart without power cycle, essential for fail-safe recovery. |
| nERROR | Error signaling output | Open-drain fault indicator driven by ESM; asserts on detected CPU, memory, or peripheral errors per safety policy. |
| VCCAD / VSSAD | ADC analog supply/ground | Independent 3.0–5.25 V domain isolates analog conversion from digital noise; critical for precision sensor interfacing. |
| GIOA[7:0], GIOB[7:0] | General-purpose I/O banks | 16 pins total (PGE package); configurable as GPIO, N2HET, CAN, or SPI functions with programmable pull-up/down and slew rate. |
| MIBSPI1_nCS[5:0] | Chip select outputs | Six independent CS lines enable daisy-chained or parallel peripheral addressing without external logic. |
| FRAY_TX1 / FRAY_RX1 | FlexRay Channel 1 interface | Differential pair supporting 10 Mbps deterministic communication; requires external bus driver for physical layer compliance. |
Key Features
| Feature | Design Value |
|---|---|
| Dual lockstep CPU execution | Hardware-enforced instruction-by-instruction comparison between two Cortex-R4F cores ensures immediate fault detection for ASIL-D compliance. |
| ECC-protected memory subsystem | 2MB flash and 192KB RAM both implement SEC-DED ECC, eliminating silent data corruption in safety-critical code and data storage. |
| FlexRay + DCAN dual-network support | Simultaneous operation of FlexRay (10 Mbps/ch) and three CAN controllers (1 Mbps) enables redundant or hierarchical vehicle network architectures. |
| N2HET coprocessors with HTU | Two independent N2HET modules offload timing-critical tasks (PWM, capture, GPIO) and HTU enables zero-CPU DMA transfers to main memory. |
| Integrated safety monitoring | Voltage, clock, and memory BIST monitoring feed into ESM, which drives nERROR pin or interrupt - no external watchdog required for basic fault signaling. |
Applications
| Braking Systems | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time hydraulic pressure modulation and wheel-speed-based slip control in ABS/ESC modules. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software with lockstep CPU verification and dual CAN/FlexRay for actuator command and sensor feedback. Use Value: Deterministic 180 MHz execution and N2HET-driven PWM ensure sub-microsecond response to slip events, meeting ISO 26262 timing constraints. | Use Scenario: Torque assist calculation and motor current control in column-assist or rack-assist EPS systems. IC Role / Device Role / Timing Role: Real-time motor control unit managing FOC algorithms, ADC sampling of phase currents, and CAN communication with vehicle bus. Use Value: Dual 12-bit MibADCs with 64-word parity buffers enable synchronized sampling of 24 motor/sensor signals at ≤1 μs latency. |
| Battery Management Systems | Railway Communications |
Use Scenario: Cell voltage, temperature, and current monitoring in HEV/EV traction battery packs with functional safety requirements. IC Role / Device Role / Timing Role: Safety-certified data acquisition and state-of-charge estimation engine interfacing with isolated ADCs, CAN, and LIN for pack-level coordination. Use Value: ECC RAM and flash prevent corrupted SOC calculations; LIN interface supports low-cost slave node communication in distributed BMS topologies. | Use Scenario: Onboard train control and signaling equipment requiring EN 50128 SIL-4 compliance and deterministic communication. IC Role / Device Role / Timing Role: Safety-critical communication gateway bridging legacy serial protocols (SCI/LIN) and modern fieldbus (FlexRay/CAN) in rolling stock. Use Value: Dual-channel FlexRay with FTU enables autonomous message buffering and transfer, ensuring guaranteed delivery under electromagnetic interference conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS2135PGE | 2MB flash, 256KB ECC RAM (vs. 192KB), same CPU/peripherals/package - higher RAM capacity for larger safety stacks or extended diagnostics. | Preferred where additional RAM is needed for multi-layer safety monitor or extended BIST routines without changing PCB layout. | Select when application requires >192KB safety-certified RAM but retains identical pinout, timing, and qualification status. |
| SPC574K72E5 | Power Architecture e200z4 dual-core lockstep, 2MB flash, 384KB RAM, ASIL-D certified - different ISA, toolchain, and peripheral set (no FlexRay, adds Ethernet MAC). | Used in European automotive platforms requiring STMicroelectronics ecosystem and Ethernet connectivity instead of FlexRay. | Choose for designs committed to SPC5 toolchain and requiring Ethernet PHY interface, accepting different safety library implementation paths. |
Compared with TMS5702125DPGEQQ1, TMS570LS2135PGE offers more RAM within identical footprint and qualification, while SPC574K72E5 provides architectural divergence with Ethernet support but requires full toolchain and safety software requalification.
Availability
TMS5702125DPGEQQ1 is available at Aetrix Electronics and suitable for braking systems, electric power steering, and battery management systems requiring stable component supply across automotive production lifecycles.
Supply support for TMS5702125DPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation history.
The TMS570 Hercules™ family is designed specifically for functional safety applications in automotive, aerospace, and industrial systems, emphasizing lockstep processing, memory protection, and diagnostic coverage to meet ISO 26262 ASIL-D requirements.
FAQ
What safety certifications apply to the TMS5702125DPGEQQ1?
The TMS5702125DPGEQQ1 is qualified for automotive applications per AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D development with built-in safety mechanisms including dual lockstep CPUs, ECC memory, BIST, and ESM. TI provides safety manuals, FMEDA reports, and diagnostic software libraries specifically validated for TMS5702125DPGEQQ1 to accelerate functional safety certification.
Does the TMS5702125DPGEQQ1 support FlexRay communication?
Yes, the TMS5702125DPGEQQ1 integrates a dual-channel FlexRay controller compliant with FlexRay v2.1, supporting 10 Mbps per channel with autonomous data transfer via the FlexRay Transfer Unit (FTU). The FTU includes a dedicated MPU and operates independently of the CPU, enabling deterministic message scheduling essential for TMS5702125DPGEQQ1-based safety gateways.
What is the maximum operating frequency of the TMS5702125DPGEQQ1?
The TMS5702125DPGEQQ1 operates at a maximum system clock frequency of 180 MHz, achieved using its Frequency-Modulated Phase-Locked Loop (FMPLL). This frequency applies to the CPU, memory interfaces, and most peripherals, delivering up to 298 DMIPS performance while maintaining timing predictability required for TMS5702125DPGEQQ1's safety-critical real-time tasks.
How does the TMS5702125DPGEQQ1 handle analog-to-digital conversion?
The TMS5702125DPGEQQ1 features two independent 12-bit Multibuffered ADC (MibADC) modules: ADC1 with 24 channels and ADC2 with 16 shared channels. Each has 64-word parity-protected result buffers and supports grouped sequential conversions. Conversion is triggered by software, timers, or external events, with programmable sample-and-hold timing - critical for accurate current/voltage sensing in TMS5702125DPGEQQ1 motor control applications.
What package and pin count does the TMS5702125DPGEQQ1 use?
The TMS5702125DPGEQQ1 uses a 144-pin LQFP (PGE) package measuring 20.0 mm × 20.0 mm with green RoHS-compliant finish. It provides 16 GPIO pins (GIOA/GIOB), dedicated N2HET, CAN, FlexRay, and debug interfaces. Pinout matches other PGE variants in the TMS570LS21x5 family, enabling hardware reuse across TMS5702125DPGEQQ1 design iterations.
TMS5702125DPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5702125DPGEQQ1 FAQ
1.How can I place an order for TMS5702125DPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5702125DPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5702125DPGEQQ1 reliable?
The price and inventory of TMS5702125DPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5702125DPGEQQ1 is usually 5 days.
3.What payment methods are accepted for TMS5702125DPGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5702125DPGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS5702125DPGEQQ1?
TMS5702125DPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5702125DPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5702125DPGEQQ1?
For technical support, including TMS5702125DPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5702125DPGEQQ1 requirements.
6.How does Aetrix verify that TMS5702125DPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5702125DPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5702125DPGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5702125DPGEQQ1?
All TMS5702125DPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5702125DPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5702125DPGEQQ1 part is unused and in its original packaging.
Return procedure for TMS5702125DPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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