Texas Instruments TMS5702135DPGEQQ1
- Part No.:
- TMS5702135DPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMS5702135DPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 2MB FLSH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,518
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Product details
Overview
TMS5702135DPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 2MB ECC-protected flash, 256KB ECC-protected RAM, and integrated safety features including BIST, ECC, parity protection, and error signaling for ASIL-D functional safety compliance. It delivers 298 DMIPS at 180 MHz and targets brake control, electric power steering, and battery management systems.
For engineers reviewing the TMS5702135DPGEQQ1 datasheet, TMS5702135DPGEQQ1 pinout, TMS5702135DPGEQQ1 application, or TMS5702135DPGEQQ1 equivalent, key selection criteria include dual-CPU lockstep architecture, 3-channel CAN (DCAN), FlexRay dual-channel support, N2HET timing coprocessors, and 144-pin LQFP packaging with automotive temperature range (-40°C to 125°C).
Technical Context
The TMS5702135DPGEQQ1 implements a safety-critical dual-core lockstep execution model where both Cortex-R4F CPUs execute identical instructions and compare results in real time. Its memory subsystem includes ECC on 2MB flash and 256KB RAM, parity on peripheral memories (MibADC buffers, message RAM), and built-in self-test for CPU and SRAM.
Peripheral architecture integrates two Next Generation High-End Timers (N2HET1 with 32 channels, N2HET2 with 18 channels), three DCAN controllers compliant with CAN 2.0B up to 1 Mbps, a dual-channel FlexRay controller with FTU, and two 12-bit MibADCs with 24 total channels and 64-word parity-protected buffers each.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core lockstep, 180 MHz max, 298 DMIPS, FPU with single/double precision |
| Flash Memory | 2MB program flash with ECC and parity protection; supports nonvolatile EEPROM emulation (64KB) |
| RAM | 256KB data RAM with ECC; 8KB message RAM with parity; 160-word instruction RAM per N2HET with parity |
| Safety Features | Built-in self-test (BIST) for CPU and RAM; voltage/clock monitoring; Error Signaling Module (ESM) with ERROR pin |
| Communication | 3× DCAN (CAN 2.0B, up to 1 Mbps); 1× FlexRay (dual-channel, 10 Mbps/channel); 2× SPI, 3× MibSPI, 1× LIN, 1× SCI, 1× I²C |
| Analog Peripherals | 2× 12-bit MibADC modules: ADC1 with 24 channels, ADC2 with 16 shared channels; 64-result buffers each with parity |
| Timing & Control | N2HET1 (32 programmable channels), N2HET2 (18 channels); HTU for DMA transfers; FMPLL with slip detector |
Pinout & Package
Package: 144-pin LQFP (PGE), green, 20.0 mm × 20.0 mm body size, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Core power/ground | 1.2 V nominal core supply (1.14–1.32 V); dedicated power domains for CPU, RAM, peripherals |
| VCCIO, VSSIO | I/O power/ground | 3.3 V nominal I/O supply (3.0–3.6 V); isolated from core domain for noise immunity |
| VCCAD, VSSAD | ADC analog supply/ground | 3.0–5.25 V analog supply; supports external reference (ADREFHI/LO) for precise 12-bit conversion |
| nRST, nPORRST | Reset inputs | Asynchronous reset (nRST) and power-on reset (nPORRST); both trigger full system initialization and safety state entry |
| nERROR | Error signaling output | Open-drain active-low output asserted by ESM on detected fault (CPU, memory, clock, voltage); externally monitored for fail-safe response |
| GIOA[7:0], GIOB[7:0] | General-purpose I/O | 16 GPIO pins (8 on GIOA, 8 on GIOB); configurable as digital input/output, interrupt sources, or N2HET pin enable/disable controls |
| CAN1_TX/RX, CAN2_TX/RX, CAN3_TX/RX | CAN transceiver interfaces | Dedicated differential pairs for three independent CAN buses; require external transceivers; support bus-off recovery and loopback test mode |
| FRAY_TX1/RX1, FRAY_TX2/RX2 | FlexRay physical layer | Two independent differential channel pairs (Ch1 & Ch2); support time-triggered communication with autonomous FTU transfers to memory |
| MIBSPI1_SIMO/SOMI/nCS[5:0] | MibSPI serial interface | 3× MibSPI modules with up to 6 chip-selects each; support high-speed daisy-chain or point-to-point peripheral interfacing with CRC and parity |
| AD1IN[23:0], AD2IN[15:0] | ADC analog inputs | 24 total analog inputs (16 shared between ADC1/ADC2); support simultaneous sampling, grouped sequences, and 10-bit fast mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual CPU Lockstep Architecture | Real-time comparison of instruction execution and data paths between two identical Cortex-R4F cores ensures immediate fault detection for ASIL-D systems |
| ECC-Protected Memory Subsystem | Single-bit error correction and double-bit error detection on 2MB flash and 256KB RAM prevent silent data corruption in safety-critical runtime environments |
| FlexRay Dual-Channel Controller | Supports deterministic, time-triggered communication at 10 Mbps per channel with autonomous FTU transfers-ideal for brake-by-wire and steer-by-wire networks |
| N2HET Timing Coprocessors | N2HET1 (32 channels) and N2HET2 (18 channels) offload complex PWM generation, capture, and GPIO timing tasks from main CPU, reducing jitter and latency |
| Integrated Safety Monitoring | Voltage, clock, and memory BIST monitoring feed into Error Signaling Module (ESM), enabling hardware-triggered fail-safe transitions without software intervention |
Applications
| Braking Systems | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time hydraulic pressure modulation and wheel speed synchronization in ABS and ESC modules. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D software with lockstep CPU validation and redundant sensor processing. Use Value: Enables sub-100 µs control loop closure using N2HET timers and dual CAN/FlexRay for distributed actuator coordination. | Use Scenario: Torque assist calculation, motor phase control, and road feedback compensation in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Central motor control unit managing field-oriented control (FOC), current sensing via dual MibADCs, and torque ripple suppression. Use Value: Achieves <±0.5° motor position accuracy using 12-bit ADCs with 64-word buffered sampling and real-time N2HET-driven PWM updates. |
| Battery Management Systems (BMS) | Railway Communications |
Use Scenario: Cell voltage monitoring, thermal management, and SOC/SOH estimation in high-voltage traction battery packs for EVs/HEVs. IC Role / Device Role / Timing Role: Safety-certified master controller interfacing with analog front-ends, isolators, and CAN/FlexRay gateways for pack-level diagnostics. Use Value: Supports up to 96-cell monitoring via multiplexed ADC inputs and secure firmware updates over DCAN with ECC-verified flash writes. | Use Scenario: Onboard train control unit handling ETCS Level 1/2 signaling, door interlocking, and PIS integration in rolling stock. IC Role / Device Role / Timing Role: SIL-4 certified communication gateway bridging legacy MVB/WTB with modern Ethernet and wireless telemetry links. Use Value: Delivers deterministic 10-ms cycle times using RTI timer and FlexRay for mission-critical train-to-track communication with ESM-monitored fault containment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS3135PGEQQ1 | 3MB flash (vs. 2MB), same RAM, identical package and pinout; higher code density for complex ASIL-D stacks | Preferred for full-featured brake control ECUs requiring larger diagnostic routines and OTA update partitions | Select when >2MB flash is required without changing PCB layout or driver software |
| SPC574K72E5 | Power Architecture e200z4 dual-core, 200 MHz, 2MB flash, 384KB RAM; ISO 26262 ASIL-D certified but no FlexRay | Used in European chassis control modules where CAN FD and SENT interfaces dominate over FlexRay | Choose for CAN FD–centric architectures needing higher RAM and broader automotive qualification history |
Compared with TMS5702135DPGEQQ1, TMS570LS3135PGEQQ1 offers +1MB flash for expanded safety libraries and logging, while SPC574K72E5 trades FlexRay for CAN FD and higher RAM-making the former ideal for flash-constrained FlexRay networks and the latter better suited for CAN FD–based vehicle domains.
Availability
TMS5702135DPGEQQ1 is available at Aetrix Electronics and suitable for braking systems, electric power steering, and battery management systems requiring stable component supply across automotive production lifecycles.
Supply support for TMS5702135DPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for automotive, industrial, and personal electronics markets.
The TMS570 Hercules™ family is designed specifically for ASIL-D and SIL-3 safety-critical applications, integrating hardware-based fault detection, lockstep processing, and memory protection to meet ISO 26262 and IEC 61508 requirements out-of-the-box.
FAQ
What safety certifications does the TMS5702135DPGEQQ1 support?
The TMS5702135DPGEQQ1 is architected to support ISO 26262 ASIL-D and IEC 61508 SIL-3 certification. It includes dual lockstep CPUs, ECC on flash and RAM, BIST for CPU and memory, parity on peripheral buffers, and an Error Signaling Module (ESM) with dedicated nERROR pin. TI provides safety manuals, FMEDA reports, and diagnostic software libraries to accelerate certification of end systems using the TMS5702135DPGEQQ1.
Does the TMS5702135DPGEQQ1 support FlexRay communication?
Yes, the TMS5702135DPGEQQ1 integrates a dual-channel FlexRay controller compliant with FlexRay v2.1, supporting 10 Mbps per channel. It includes a dedicated FlexRay Transfer Unit (FTU) for autonomous data movement between FlexRay message RAM and main memory, protected by a built-in MPU. The device requires external FlexRay transceivers and supports time-triggered communication essential for brake-by-wire and steer-by-wire applications using the TMS5702135DPGEQQ1.
What is the maximum operating frequency and performance of the TMS5702135DPGEQQ1?
The TMS5702135DPGEQQ1 operates at a maximum system clock frequency of 180 MHz, delivering up to 298 DMIPS (1.66 DMIPS/MHz) with its ARM Cortex-R4F CPU. Its floating-point unit supports both single- and double-precision operations, and the 8-stage pipeline enables efficient real-time control execution. Performance is sustained across the full automotive temperature range (-40°C to 125°C), validated under worst-case voltage and process corners for the TMS5702135DPGEQQ1.
How does the TMS5702135DPGEQQ1 handle analog signal acquisition?
The TMS5702135DPGEQQ1 features two 12-bit Multibuffered ADC (MibADC) modules: ADC1 with 24 input channels and ADC2 with 16 channels (shared with ADC1). Each has 64-word result buffers with parity protection, supports grouped sequential conversions, and offers a 10-bit mode for faster sampling. Analog inputs accept 0–VCCAD (3.0–5.25 V), and the device includes dedicated VCCAD/VSSAD pins with external reference support (ADREFHI/LO) for high-accuracy acquisition in systems using the TMS5702135DPGEQQ1.
What package and pin count does the TMS5702135DPGEQQ1 use?
The TMS5702135DPGEQQ1 uses a 144-pin LQFP (PGE) package, green, with 20.0 mm × 20.0 mm body size and 0.5 mm pitch. It is RoHS-compliant and rated for automotive temperature range (-40°C to 125°C). This package provides 16 GPIO pins (GIOA/GIOB), dedicated CAN/FlexRay transceiver interfaces, ADC inputs, and power domains optimized for low-noise operation-matching the mechanical and thermal requirements of engine bay and chassis-mounted ECUs using the TMS5702135DPGEQQ1.
TMS5702135DPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5702135DPGEQQ1 FAQ
1.How can I place an order for TMS5702135DPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5702135DPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5702135DPGEQQ1 reliable?
The price and inventory of TMS5702135DPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5702135DPGEQQ1 is usually 5 days.
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TMS5702135DPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5702135DPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5702135DPGEQQ1?
For technical support, including TMS5702135DPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5702135DPGEQQ1 requirements.
6.How does Aetrix verify that TMS5702135DPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5702135DPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5702135DPGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5702135DPGEQQ1?
All TMS5702135DPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5702135DPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5702135DPGEQQ1 part is unused and in its original packaging.
Return procedure for TMS5702135DPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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