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Texas Instruments TMS5703135CPGEQQ1
- Part No.:
- TMS5703135CPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMS5703135CPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 3MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,121
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Product details
Overview
TMS5703135CPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 3MB ECC-protected flash, 256KB ECC RAM, and integrated safety features including BIST, parity-protected peripherals, and error signaling for ASIL-D systems. It targets brake control, electric power steering, and battery management in harsh environments.
For engineers reviewing the TMS5703135CPGEQQ1 datasheet, TMS5703135CPGEQQ1 pinout, TMS5703135CPGEQQ1 application, or TMS5703135CPGEQQ1 equivalent, key selection criteria include dual-CPU lockstep operation, FlexRay + 3× CAN 2.0B interfaces, N2HET timing coprocessors, 2× 12-bit MibADCs with 24-channel support, and 144-pin LQFP package with -40°C to 125°C operation.
Technical Context
The TMS5703135CPGEQQ1 implements a safety-critical architecture with two identical ARM Cortex-R4F cores executing identical instructions in lockstep, with continuous comparison and fault detection. Its memory subsystem includes ECC on 3MB flash and 256KB RAM, plus parity protection on peripheral memories (MibADC buffers, N2HET RAM, message RAM) and built-in self-test for CPU and SRAM.
Real-time control is enabled by two Next Generation High-End Timer (N2HET) modules-N2HET1 with 32 programmable channels and N2HET2 with 18 channels-each backed by a dedicated Memory Protection Unit (MPU) and High-End Transfer Unit (HTU) for DMA-like data movement. The device integrates three DCAN controllers compliant with CAN 2.0B up to 1 Mbps, a dual-channel FlexRay controller with FTU, and two 12-bit multibuffered ADCs supporting up to 24 total inputs with 64-word parity-protected result buffers each.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F 32-bit RISC with FPU, 1.66 DMIPS/MHz, up to 180 MHz (298 DMIPS) |
| Flash Memory | 3MB program flash with ECC; supports single-bit correction/double-bit detection; 3.3-V I/O supply compatible |
| RAM | 256KB data RAM with ECC; 64KB flash-emulated EEPROM with ECC |
| Safety Features | Dual lockstep CPUs, CPU/RAM BIST, ECC on flash/RAM, parity on peripheral memories, ESM with ERROR pin |
| ADC | Two 12-bit MibADCs: ADC1 with 24 channels, ADC2 with 16 shared channels; 64-word parity-protected buffer per module |
| Timers | N2HET1 (32 channels), N2HET2 (18 channels); each with hardware angle generator and dedicated HTU/MPU |
| Communication | 3× DCAN (CAN 2.0B, up to 1 Mbps), 1× FlexRay (dual-channel, 10 Mbps/channel), 3× MibSPI, 2× SPI, 1× LIN, 1× SCI, 1× I²C |
| Package | LQFP-144 (PGE), green RoHS-compliant, 20.0 mm × 20.0 mm body size, -40°C to 125°C ambient rating |
Pinout & Package
Package: 144-pin LQFP (PGE), 20.0 mm × 20.0 mm, exposed pad, RoHS-compliant, rated for -40°C to 125°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core supply input | 1.2 V nominal (1.14–1.32 V range); powers CPU, internal logic, and SRAM |
| VCCIO | I/O supply input | 3.3 V nominal (3.0–3.6 V range); powers GPIO, CAN transceivers, SPI, SCI, and other digital I/O |
| VCCAD | ADC analog supply | 3.0–5.25 V; independent rail enabling high-precision conversion across wide sensor voltage ranges |
| nRST | Warm reset input | Active-low asynchronous reset; minimum pulse width 2256 × tOSC; initiates controlled restart without power cycle |
| nERROR | Error signaling output | Open-drain active-low signal asserted by ESM on detected fault (e.g., CPU mismatch, memory ECC double-bit error) |
| GIOA[7:0] | General-purpose I/O bank A | Eight configurable pins supporting GPIO, interrupt, or peripheral multiplexing (e.g., CAN1_RX/TX, SCI_RX/TX) |
| MIBSPI1_nCS[5:0] | Chip select outputs | Six independent chip selects for daisy-chained or parallel SPI peripherals; each with programmable polarity and timing |
| N2HET1[31:0] | N2HET1 I/O pins | 32 dedicated pins for high-resolution PWM, capture, compare, or GPIO; software-controlled via micromachine instruction set |
Key Features
| Feature | Design Value |
|---|---|
| Dual lockstep CPU execution | Continuous real-time comparison of dual Cortex-R4F cores enables immediate fault detection and fail-safe response for ASIL-D compliance |
| ECC-protected memory hierarchy | 3MB flash and 256KB RAM protected with SEC-DED ECC; prevents silent data corruption in safety-critical code and data storage |
| FlexRay + 3× CAN 2.0B interfaces | Enables deterministic, high-bandwidth communication for distributed vehicle control networks (e.g., brake-by-wire, steer-by-wire) |
| N2HET timing coprocessors | Offloads precise timing tasks (e.g., motor phase control, sensor sampling synchronization) from main CPU, reducing jitter and latency |
| Parity-protected peripheral RAM | 64-word buffers in each MibADC and 8KB message RAM for FlexRay protected with parity bits, ensuring integrity of time-critical I/O data |
| EMIF with SDRAM support | 16-bit external memory interface enables expansion beyond on-chip RAM for logging, diagnostics, or complex algorithm buffers |
Applications
| Braking Systems | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time monitoring of wheel speed sensors, hydraulic pressure, and pedal position in ABS and ESC modules. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D certified braking algorithms with lockstep CPU verification and error signaling. Use Value: Enables sub-100 µs fault detection and safe state transition during critical braking events, meeting ISO 26262 ASIL-D requirements. | Use Scenario: Closed-loop torque control of EPS motor using resolver feedback and current sensing under varying road loads. IC Role / Device Role / Timing Role: Real-time motor control unit coordinating N2HET-driven PWM generation, ADC sampling of motor currents, and CAN-based driver assistance integration. Use Value: Delivers <5 µs jitter on PWM outputs and synchronized 12-bit ADC sampling across 24 channels for precise torque vectoring. |
| Battery Management Systems (BMS) | Railway Communications |
Use Scenario: Monitoring cell voltages, temperatures, and pack currents in high-voltage traction batteries for EV/HEV platforms. IC Role / Device Role / Timing Role: Central BMS controller interfacing with analog front-ends via MibADC, communicating status over CAN/FlexRay to vehicle gateway. Use Value: Supports up to 24-cell voltage measurements with 12-bit resolution and parity-protected buffering, enabling accurate state-of-charge estimation. | Use Scenario: Safety-critical train control and signaling interlocking systems requiring deterministic communication and fault containment. IC Role / Device Role / Timing Role: SIL-4-certifiable controller managing FlexRay backbone and redundant CAN links between onboard subsystems. Use Value: Dual lockstep execution and ESM-triggered ERROR pin provide hardware-enforced fail-safe behavior required for EN 5012x compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS2135PGE | 2MB flash (vs. 3MB), same 256KB RAM, identical CPU, peripherals, and safety architecture | Lower code footprint requirement; suitable when application fits within 2MB program space | Select when firmware size permits reduced flash capacity to lower cost without sacrificing safety or real-time capability |
| SPC574S40L3 | Power Architecture e200z4 core, 2MB flash, 256KB RAM, ASIL-D certified, dual-core lockstep, but no FlexRay support | Lacks FlexRay; relies on CAN FD and Ethernet for high-speed networking; different toolchain and ecosystem | Choose for CAN FD–centric architectures where FlexRay is not required and ST ecosystem alignment is preferred |
Compared with TMS570LS2135PGE, the TMS5703135CPGEQQ1 provides 1MB additional flash for larger safety firmware or calibration tables; compared with SPC574S40L3, it offers native FlexRay support and TI's Hercules safety software stack, making it preferable for automotive chassis control where FlexRay timing determinism is mandatory.
Availability
TMS5703135CPGEQQ1 is available at Aetrix Electronics and suitable for braking systems, electric power steering, and battery management systems requiring stable component supply across extended automotive production lifecycles.
Supply support for TMS5703135CPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The TMS570 Hercules family was designed specifically for functional safety applications in automotive and transportation systems, with hardware-level redundancy, diagnostic coverage, and certification support targeting ISO 26262 ASIL-D and IEC 61508 SIL-3.
FAQ
What safety certifications does the TMS5703135CPGEQQ1 support?
The TMS5703135CPGEQQ1 is architected to support ISO 26262 ASIL-D and IEC 61508 SIL-3 certification. It includes dual lockstep CPUs, memory BIST, ECC on flash and RAM, parity on peripheral memories, and an Error Signaling Module (ESM) with external ERROR pin. Texas Instruments provides safety manuals, FMEDA reports, and diagnostic software libraries to accelerate certification of end systems using the TMS5703135CPGEQQ1.
Does the TMS5703135CPGEQQ1 support FlexRay communication?
Yes, the TMS5703135CPGEQQ1 integrates a dual-channel FlexRay controller compliant with FlexRay v2.1, supporting 10 Mbps per channel. It includes a dedicated FlexRay Transfer Unit (FTU) for autonomous data transfers between FlexRay message RAM and main memory, with MPU protection. This makes the TMS5703135CPGEQQ1 suitable for time-triggered chassis and powertrain networks where deterministic latency is critical.
What is the maximum operating frequency of the TMS5703135CPGEQQ1?
The TMS5703135CPGEQQ1 operates at a maximum system clock frequency of 180 MHz. Its ARM Cortex-R4F CPU delivers up to 298 DMIPS (1.66 DMIPS/MHz) at this rate. The device uses a Frequency-Modulated PLL (FMPLL) to generate internal clocks from an external crystal or oscillator, with separate non-modulating PLL for FlexRay to ensure jitter-free timing.
How many ADC channels does the TMS5703135CPGEQQ1 support?
The TMS5703135CPGEQQ1 integrates two 12-bit multibuffered ADC modules: MibADC1 supports 24 input channels, and MibADC2 supports 16 channels shared with MibADC1. Each module has 64-word result buffers with parity protection. Total usable channel count is 24, with flexible grouping and sequencing controlled in software for synchronized sampling.
What package type is used for the TMS5703135CPGEQQ1?
The TMS5703135CPGEQQ1 uses a 144-pin LQFP package (PGE), measuring 20.0 mm × 20.0 mm with an exposed thermal pad. It is RoHS-compliant and rated for operation from -40°C to 125°C ambient temperature. This package variant is pin-compatible with other PGE-packaged TMS570LS family members, including TMS570LS2135PGE and TMS570LS2125PGE.
TMS5703135CPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5703135CPGEQQ1 FAQ
1.How can I place an order for TMS5703135CPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5703135CPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5703135CPGEQQ1 reliable?
The price and inventory of TMS5703135CPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5703135CPGEQQ1 is usually 5 days.
3.What payment methods are accepted for TMS5703135CPGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5703135CPGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS5703135CPGEQQ1?
TMS5703135CPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5703135CPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5703135CPGEQQ1?
For technical support, including TMS5703135CPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5703135CPGEQQ1 requirements.
6.How does Aetrix verify that TMS5703135CPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5703135CPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5703135CPGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5703135CPGEQQ1?
All TMS5703135CPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5703135CPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5703135CPGEQQ1 part is unused and in its original packaging.
Return procedure for TMS5703135CPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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