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Texas Instruments TMS5703135DPGEQQ1
- Part No.:
- TMS5703135DPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMS5703135DPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 3MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,817
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Product details
Overview
TMS5703135DPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 3MB ECC-protected flash, 256KB ECC RAM, and integrated safety features including BIST, parity-protected peripherals, and error signaling for ASIL-D systems. It delivers 298 DMIPS at 180 MHz and supports real-time control in braking, steering, and battery management.
For engineers reviewing the TMS5703135DPGEQQ1 datasheet, TMS5703135DPGEQQ1 pinout, TMS5703135DPGEQQ1 application, or TMS5703135DPGEQQ1 equivalent, key selection criteria include functional safety certification (ISO 26262), dual-CPU lockstep integrity, FlexRay/CAN/LIN interface count, N2HET timer channel allocation, and PGE package pin compatibility for automotive ECU layout.
Technical Context
The device implements a dual-core lockstep architecture where both Cortex-R4F CPUs execute identical instructions and compare results in real time to detect transient faults. Safety logic includes on-chip BIST for CPU and SRAM, ECC on flash and RAM, and parity protection across MibADC buffers, N2HET RAM, and message RAM.
Timing subsystems include two independent N2HET modules (N2HET1 with 32 channels, N2HET2 with 18 channels), each with dedicated HTU and MPU, plus a FlexRay Transfer Unit (FTU) supporting autonomous 10 Mbps dual-channel transfers with MPU-enforced memory access isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core lockstep, 180 MHz max, 298 DMIPS |
| Flash Memory | 3MB with ECC, 64-bit bus, 3.3 V I/O supply, pipeline mode up to 180 MHz |
| Data RAM | 256KB with ECC, single-cycle byte/halfword/word/double-word access |
| N2HET Modules | N2HET1: 32 programmable channels; N2HET2: 18 programmable channels |
| ADC System | Two 12-bit MibADCs: ADC1 with 24 channels, ADC2 with 16 shared channels, 64-word parity-protected buffer each |
| Communication | Three DCAN controllers (CAN 2.0B, up to 1 Mbps), FlexRay dual-channel (10 Mbps/channel), LIN 2.1, SCI, I²C, three MibSPIs, two SPIs |
| Safety Features | Dual-CPU lockstep, CPU/RAM BIST, ECC on flash/RAM, parity on peripheral memories, ESM with ERROR pin, voltage/clock monitoring |
Pinout & Package
LQFP-144 (PGE) package, 20.0 mm × 20.0 mm body size, green RoHS-compliant finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core power supply | 1.2 V nominal (1.14–1.32 V range); powers CPU, internal logic, and SRAM |
| VCCIO | I/O power supply | 3.3 V nominal (3.0–3.6 V range); powers GPIO, CAN transceivers, and peripheral I/O buffers |
| VCCAD | ADC reference supply | 3.0–5.25 V input; sets full-scale range for 12-bit MibADC conversion accuracy |
| nRST | Warm reset input | Active-low asynchronous reset; minimum pulse width 2256 oscillator cycles |
| nERROR | Error signaling output | Open-drain active-low signal asserted by ESM on detected fault (e.g., ECC double-bit error, BIST failure) |
| GIOA[7:0] | General-purpose I/O bank A | Eight configurable pins supporting GPIO, interrupt, or peripheral multiplexing (e.g., SCI, SPI, CAN) |
| N2HET1[31:0] | N2HET1 I/O port | 32-pin dedicated interface for high-precision timing functions: PWM, capture, compare, or GPIO |
| FRAY_TX1/FRAY_RX1 | FlexRay Channel 1 interface | Differential transmit/receive pair for 10 Mbps deterministic communication; requires external bus driver |
| CAN1_TX/CAN1_RX | DCAN1 physical interface | High-speed CAN 2.0B differential pair (up to 1 Mbps); compatible with ISO 11898-2 transceivers |
| MIBSPI1_SIMO[1:0] | MibSPI1 serial data output | Dual SIMO lines support daisy-chain or parallel slave configurations in high-speed motor control loops |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Lockstep Execution | Real-time comparison of instruction execution between two Cortex-R4F cores ensures immediate fault detection for ASIL-D compliance |
| ECC-Protected Flash & RAM | Single-bit error correction and double-bit error detection prevent silent data corruption in safety-critical code and runtime variables |
| N2HET Timing Coprocessors | Two independent hardware timers (32 + 18 channels) offload complex PWM, capture, and sensor timing from main CPU |
| FlexRay Dual-Channel Controller | Hardware-accelerated 10 Mbps per channel communication with FTU enabling zero-CPU-overhead message transfers |
| Integrated Safety Monitoring | ESM aggregates faults from voltage monitors, clock detectors, BIST, and ECC engines to assert nERROR or trigger interrupts |
Applications
| Braking Systems | Electric Power Steering |
|---|---|
Use Scenario: Real-time pressure modulation in ABS and ESC modules during emergency maneuvers. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D software with lockstep CPU validation and redundant sensor processing. Use Value: Deterministic 180 MHz execution and dual N2HET modules enable sub-microsecond PWM timing for solenoid valve control. | Use Scenario: Torque assist calculation and motor phase commutation in column-assist EPS systems. IC Role / Device Role / Timing Role: Real-time MCU managing torque sensor fusion, motor current control, and CAN/FlexRay gateway functions. Use Value: 24-channel MibADC with 64-word buffer enables simultaneous sampling of torque, position, and current sensors without CPU intervention. |
| Battery Management Systems | Active Driver Assistance |
Use Scenario: Cell voltage monitoring, thermal management, and SOC/SOH estimation in HEV/EV traction battery packs. IC Role / Device Role / Timing Role: Safety-certified host controller interfacing with analog front-ends, isolators, and CAN networks for pack-level diagnostics. Use Value: ECC RAM and flash ensure firmware integrity over 15+ year vehicle lifetime; 3MB flash accommodates OTA update partitions and redundancy. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for lane-keeping and automatic emergency braking. IC Role / Device Role / Timing Role: High-integrity timing and communication gateway synchronizing distributed ECUs via FlexRay and CAN FD. Use Value: Dual-channel FlexRay with FTU provides deterministic 10 Mbps inter-ECU messaging with <1 µs jitter for time-critical ADAS decisions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS2135PGE | 2MB flash (vs. 3MB), same 256KB ECC RAM, identical PGE package and pinout | Lower code storage capacity limits complex OTA update schemes and multi-application partitioning | Select when application firmware fits within 2MB and cost optimization is prioritized over future scalability |
| SPC574S40L3 | Power Architecture e200z4 dual-core, 160 MHz, 2MB flash, 256KB RAM, ASIL-D certified | Different ISA and toolchain; lacks FlexRay but adds Ethernet MAC and more CAN FD channels | Choose for legacy Power Architecture ecosystems or when Ethernet connectivity is required over FlexRay |
Compared with TMS5703135DPGEQQ1, TMS570LS2135PGE offers identical safety architecture and pin compatibility but reduced flash for cost-sensitive designs, while SPC574S40L3 provides alternative ASIL-D capability with Ethernet and CAN FD-requiring toolchain migration and board redesign.
Availability
TMS5703135DPGEQQ1 is available at Aetrix Electronics and suitable for automotive braking systems, electric power steering units, and battery management systems requiring stable component supply across extended production lifecycles.
Supply support for TMS5703135DPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive, industrial, and communications markets.
The TMS570 Hercules™ family is designed specifically for ASIL-D automotive safety applications, integrating lockstep CPUs, memory protection, and self-test capabilities to meet ISO 26262 requirements without external safety monitors.
FAQ
What safety certifications does the TMS5703135DPGEQQ1 support?
The TMS5703135DPGEQQ1 is qualified for automotive applications per AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D development with integrated safety mechanisms including dual lockstep CPUs, ECC memory, BIST, and ESM. Documentation includes FMEDA reports and safety manuals confirming diagnostic coverage metrics for TMS5703135DPGEQQ1.
Does the TMS5703135DPGEQQ1 include hardware support for FlexRay communication?
Yes, the TMS5703135DPGEQQ1 integrates a dual-channel FlexRay controller compliant with FlexRay v2.1, supporting 10 Mbps per channel and featuring a dedicated FlexRay Transfer Unit (FTU) for autonomous DMA-like transfers between FlexRay message RAM and main memory without CPU involvement.
What is the maximum operating frequency and performance of the TMS5703135DPGEQQ1 CPU?
The TMS5703135DPGEQQ1 features dual ARM Cortex-R4F CPUs running in lockstep at up to 180 MHz, delivering 298 DMIPS total (1.66 DMIPS/MHz). Its 8-stage pipeline, FPU with single- and double-precision support, and efficient memory subsystem enable deterministic real-time control for safety-critical automotive applications.
How does the TMS5703135DPGEQQ1 handle memory reliability in harsh environments?
The TMS5703135DPGEQQ1 ensures memory reliability through ECC on 3MB flash and 256KB RAM (single-bit correction, double-bit detection), parity protection on MibADC buffers, N2HET RAM, and message RAM, plus built-in BIST for CPU and SRAM. These features maintain data integrity under radiation, voltage fluctuation, and temperature stress typical in automotive under-hood environments.
What package and pin count does the TMS5703135DPGEQQ1 use?
The TMS5703135DPGEQQ1 uses a 144-pin LQFP (PGE) package with 20.0 mm × 20.0 mm body size and green RoHS-compliant finish. Pin functions include dual N2HET interfaces, three DCAN controllers, FlexRay differential pairs, 24-channel MibADC inputs, and GPIO banks-all mapped to the PGE footprint as documented in TI SPNS164C Section 4.1.
TMS5703135DPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5703135DPGEQQ1 FAQ
1.How can I place an order for TMS5703135DPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5703135DPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5703135DPGEQQ1 reliable?
The price and inventory of TMS5703135DPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5703135DPGEQQ1 is usually 5 days.
3.What payment methods are accepted for TMS5703135DPGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5703135DPGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS5703135DPGEQQ1?
TMS5703135DPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5703135DPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5703135DPGEQQ1?
For technical support, including TMS5703135DPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5703135DPGEQQ1 requirements.
6.How does Aetrix verify that TMS5703135DPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5703135DPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5703135DPGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5703135DPGEQQ1?
All TMS5703135DPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5703135DPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5703135DPGEQQ1 part is unused and in its original packaging.
Return procedure for TMS5703135DPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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