Texas Instruments TMS5703135DZWTQQ1
- Part No.:
- TMS5703135DZWTQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 337-LFBGA
- Datasheet:
-
TMS5703135DZWTQQ1.pdf
- Description:
- IC MCU 16/32B 3MB FLASH 337NFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS5703135DZWTQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 3MB ECC-protected flash, 256KB ECC RAM, and integrated safety features including BIST, parity-protected peripherals, and error signaling for ASIL-D systems. It targets real-time control in braking, electric power steering, and battery management.
For engineers reviewing the TMS5703135DZWTQQ1 datasheet, TMS5703135DZWTQQ1 pinout, TMS5703135DZWTQQ1 application, or TMS5703135DZWTQQ1 equivalent, key selection criteria include functional safety certification (ISO 26262), dual-CPU lockstep execution, FlexRay/CAN/LIN interface support, N2HET timer resolution, and ZWT package thermal performance in 125°C ambient environments.
Technical Context
The TMS5703135DZWTQQ1 implements a dual-core lockstep architecture where both Cortex-R4F CPUs execute identical instructions and compare results in real time to detect transient faults. Its safety subsystem includes built-in self-test (BIST) for CPU and SRAM, ECC on flash and RAM, parity protection on peripheral memories (MibADC, N2HET, DCAN), and dedicated Error Signaling Module (ESM) with external ERROR pin assertion.
It integrates two Next Generation High-End Timers (N2HET1 with 32 channels, N2HET2 with 18 channels), each with hardware angle generation and dedicated HTU DMA engines protected by MPU. The device supports FlexRay v2.1A with FTU-based autonomous transfers, three DCAN controllers compliant with CAN 2.0B up to 1 Mbps, and two 12-bit MibADCs with 24 total channels and 64-word parity-protected buffers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core lockstep, 1.66 DMIPS/MHz at up to 180 MHz → delivers 298 DMIPS deterministic real-time performance with fault detection. |
| Memory | 3MB program flash with ECC + 256KB data RAM with ECC → enables ASIL-D-compliant code storage and runtime data integrity. |
| Safety Features | Dual-CPU lockstep, CPU/RAM BIST, ECC/parity on all memory/peripherals, ESM with ERROR pin → meets ISO 26262 ASIL-D requirements out of box. |
| Timers | N2HET1 (32 channels) + N2HET2 (18 channels) with HTU DMA and MPU → supports complex PWM, capture, and actuator timing without CPU load. |
| Analog | Two 12-bit MibADCs: ADC1 (24 channels), ADC2 (16 shared), 64-word parity buffer each → enables simultaneous high-resolution sensor acquisition for motor control. |
| Communication | 3× DCAN (CAN 2.0B, 1 Mbps), 2× MibSPI, 2× SPI, 1× LIN, 1× SCI, 1× I2C, 1× FlexRay (2-channel, 10 Mbps/channel) → full automotive network stack integration. |
| Package | NFBGA-337 (ZWT), 16 mm × 16 mm, 0.8 mm pitch → optimized for automotive PCB thermal dissipation and high-pin-count routing. |
Pinout & Package
NFBGA-337 (ZWT) package with 16 mm × 16 mm body size, 0.8 mm ball pitch, and green RoHS-compliant finish. Designed for automotive under-hood applications with -40°C to +125°C operating range and enhanced thermal resistance (θJA = 25.2°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCAD / VSSAD | Analog supply/ground | Independent 3.0–5.25 V analog domain powers ADCs and reference circuitry; isolation prevents digital noise coupling into precision measurements. |
| FRAY_TX1 / FRAY_RX1 | FlexRay Channel 1 I/O | Differential transmit/receive pair for primary FlexRay bus; supports 10 Mbps deterministic communication with built-in slip detector. |
| CAN1_TX / CAN1_RX | DCAN1 differential I/O | High-speed CAN physical layer interface compliant with ISO 11898-2; supports 1 Mbps operation in electrically noisy vehicle networks. |
| N2HET1[31:0] | N2HET1 programmable I/O | 32 dedicated pins for high-resolution timing functions-PWM generation, edge capture, GPIO-with autonomous HTU DMA transfers. |
| AD1IN[23:0] | MibADC1 analog inputs | 24-channel analog input bank supporting multiplexed sampling; used for motor phase current, temperature, and voltage sensing in traction inverters. |
| nERROR | Error signaling output | Open-drain active-low signal asserted by ESM on detected fault (CPU mismatch, memory ECC double-bit error, clock failure) for system-level fail-safe response. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Lockstep Execution | Real-time comparison of instruction execution between two Cortex-R4F cores ensures immediate detection of single-event upsets or logic faults. |
| ECC on 3MB Flash & 256KB RAM | Single-bit error correction and double-bit error detection across all program and data memory enables reliable operation over 15+ year automotive lifetimes. |
| FlexRay Transfer Unit (FTU) | Hardware-accelerated autonomous data movement between FlexRay message RAM and main memory eliminates CPU overhead for time-critical bus traffic. |
| Two 12-Bit MibADCs with Shared Channels | 24 total analog inputs with configurable grouping, 64-word parity buffers, and 10-bit mode compatibility enable flexible sensor acquisition in HEV/EV powertrain control. |
| Memory Protection Unit (MPU) | Dedicated MPU per N2HET, DMA, and EMIF enforces strict memory access boundaries-prevents peripheral DMA corruption of critical safety code or data. |
Applications
| Braking Systems | Electric Power Steering |
|---|---|
Use Scenario: ABS and ESC control units requiring real-time wheel speed processing, hydraulic valve actuation, and fail-operational redundancy. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D software with lockstep CPU validation and ESM-triggered safe state entry. Use Value: Integrated BIST, ECC RAM/flash, and nERROR pin enable certified safe shutdown within <100 µs of fault detection-meeting FMVSS 126 compliance. | Use Scenario: Motor torque control and assist algorithm execution in column-assist or rack-assist EPS systems exposed to vibration and thermal cycling. IC Role / Device Role / Timing Role: Real-time motor control MCU managing FOC loops, sensor fusion (resolver, torque sensor), and CAN/FlexRay gateway functions. Use Value: N2HET timers generate precise PWM for 3-phase inverter gate drivers; MibADCs acquire resolver sine/cosine signals with <1 LSB INL at 12-bit resolution. |
| Battery Management Systems | HEV/EV Inverter Control |
Use Scenario: High-voltage battery pack monitoring in PHEV/BEV applications requiring cell voltage, temperature, and isolation diagnostics. IC Role / Device Role / Timing Role: Safety-certified host processor interfacing with analog front-end ICs via SPI/I2C, running SOC/SOH algorithms and communicating via CAN to vehicle network. Use Value: 3MB flash stores redundant firmware images; 256KB ECC RAM holds real-time BMS state variables with guaranteed integrity across thermal stress cycles. | Use Scenario: Traction inverter control in hybrid/electric vehicles demanding precise IGBT/SiC gate timing, current sensing, and thermal protection. IC Role / Device Role / Timing Role: Central real-time controller coordinating PWM generation (via N2HET), ADC sampling (MibADC), and fault response (ESM + nERROR). Use Value: HTU-enabled DMA transfers move ADC results to RAM without CPU intervention; FMPLL provides stable 180 MHz core clock despite input voltage ripple. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS2135ZWT | 2MB flash (vs. 3MB), same 256KB ECC RAM, identical ZWT package and pinout | Lower code density margin; suitable for cost-sensitive ASIL-B/C designs without complex middleware stacks | Select when firmware footprint <2MB and BOM cost optimization is prioritized over future-proofing. |
| SPC574K72E5 | Power Architecture e200z4 dual-core, 2MB flash, 384KB RAM, AEC-Q100 Grade 0 (−40°C to +150°C) | Higher ambient temperature rating; different toolchain (S32DS vs. TI CCS); no FlexRay support | Choose for extreme under-hood environments (>125°C) where FlexRay is not required and legacy Power Architecture ecosystem exists. |
Compared with TMS570LS2135ZWT, the TMS5703135DZWTQQ1 provides 1MB additional flash for AUTOSAR OS, diagnostic stacks, and OTA update partitions; versus SPC574K72E5, it offers native FlexRay and tighter integration with TI's Hercules safety libraries and FMEDA reports.
Availability
TMS5703135DZWTQQ1 is available at Aetrix Electronics and suitable for automotive braking systems, electric power steering modules, and battery management systems requiring stable component supply across extended production lifecycles and rigorous automotive qualification.
Supply support for TMS5703135DZWTQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive ICs, with decades of automotive qualification expertise and ISO/TS 16949-certified manufacturing.
The TMS570 Hercules family was designed specifically for ASIL-D automotive safety applications, integrating hardware safety mechanisms, certified development processes, and comprehensive FMEDA documentation to accelerate ISO 26262 compliance.
FAQ
What safety certifications does the TMS5703135DZWTQQ1 hold?
The TMS5703135DZWTQQ1 is qualified to AEC-Q100 Grade 1 (−40°C to +125°C) and supports ISO 26262 ASIL-D system-level implementation. Texas Instruments provides certified FMEDA reports, safety manuals, and diagnostic coverage analysis for the TMS5703135DZWTQQ1, enabling automotive OEMs to achieve functional safety compliance without developing safety mechanisms from scratch.
Does the TMS5703135DZWTQQ1 support FlexRay communication?
Yes, the TMS5703135DZWTQQ1 integrates a dual-channel FlexRay controller compliant with FlexRay v2.1A, supporting 10 Mbps per channel. It includes a dedicated FlexRay Transfer Unit (FTU) that autonomously moves message RAM contents to/from main memory, reducing CPU load and ensuring deterministic timing for time-triggered networking in chassis control systems.
What is the maximum operating frequency of the TMS5703135DZWTQQ1?
The TMS5703135DZWTQQ1 operates at a maximum system clock frequency of 180 MHz, enabled by its Frequency-Modulated Phase-Locked Loop (FMPLL). This delivers up to 298 DMIPS of deterministic real-time performance while maintaining tight jitter control for safety-critical timing tasks such as motor control PWM generation and ADC sampling synchronization.
How does the TMS5703135DZWTQQ1 handle memory errors?
The TMS5703135DZWTQQ1 uses ECC on its 3MB flash and 256KB RAM to correct single-bit errors and detect double-bit errors in real time. Peripheral memories-including MibADC buffers, N2HET RAM, and DCAN message RAM-are protected by parity checking. Detected errors trigger the Error Signaling Module (ESM), which can assert the nERROR pin or generate interrupts for controlled fail-safe responses.
What package options are available for the TMS5703135DZWTQQ1?
The TMS5703135DZWTQQ1 is offered exclusively in the NFBGA-337 (ZWT) package: 16 mm × 16 mm body, 0.8 mm ball pitch, green RoHS-compliant finish. This package supports automotive thermal requirements (θJA = 25.2°C/W) and provides optimal signal integrity for high-speed interfaces including FlexRay, DCAN, and MibSPI in dense PCB layouts.
TMS5703135DZWTQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 337-LFBGA
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5703135DZWTQQ1 FAQ
1.How can I place an order for TMS5703135DZWTQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5703135DZWTQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5703135DZWTQQ1 reliable?
The price and inventory of TMS5703135DZWTQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5703135DZWTQQ1 is usually 5 days.
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Once your TMS5703135DZWTQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5703135DZWTQQ1?
For technical support, including TMS5703135DZWTQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5703135DZWTQQ1 requirements.
6.How does Aetrix verify that TMS5703135DZWTQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5703135DZWTQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5703135DZWTQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5703135DZWTQQ1?
All TMS5703135DZWTQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5703135DZWTQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5703135DZWTQQ1 part is unused and in its original packaging.
Return procedure for TMS5703135DZWTQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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