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Texas Instruments TMS5703137BPGEQQ1
- Part No.:
- TMS5703137BPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMS5703137BPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 3MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,615
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Product details
Overview
TMS5703137BPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 3 MB ECC-protected flash, 256 KB ECC-protected RAM, and integrated safety features including BIST, voltage/clock monitoring, and error signaling. It delivers 298 DMIPS at 180 MHz and targets ASIL-D functional safety applications such as electric power steering and braking systems.
For engineers reviewing the TMS5703137BPGEQQ1 datasheet, TMS5703137BPGEQQ1 pinout, TMS5703137BPGEQQ1 application, or TMS5703137BPGEQQ1 equivalent, key selection criteria include dual-CPU lockstep operation, FMPLL/FlexRay/EMAC peripheral support, 144-pin LQFP packaging, and compliance with ISO 26262 for safety-critical real-time control.
Technical Context
The TMS5703137BPGEQQ1 implements a dual-core lockstep architecture where both Cortex-R4F CPUs execute identical instructions and compare results in real time to detect transient or permanent faults. Its safety subsystem includes dedicated Error Signaling Module (ESM), built-in self-test (BIST) for CPU and memory, and parity/ECC protection across flash, RAM, and peripheral buffers.
Timing and communication are managed via two FMPLLs (one for core, one for FlexRay), seven clock domains, and multiple high-integrity interfaces: three DCAN controllers (CAN 2.0B, up to 1 Mbps), dual N2HET modules (40 total programmable channels), 10/100 Mbps EMAC with MII/RMII/MDIO, and dual 12-bit MibADCs with 24 shared channels and 64-word parity-protected buffers each.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core lockstep, 180 MHz max, 298 DMIPS - enables real-time deterministic execution with hardware fault detection. |
| Memory | 3 MB flash + 256 KB RAM, both with ECC - ensures data integrity and system resilience against bit errors in safety-critical code/data. |
| ADC | Two 12-bit MibADCs, 24 total channels, 64-word parity-protected buffer per ADC - supports simultaneous sampling and fault-tolerant sensor acquisition. |
| Timers | N2HET1 (32 channels) + N2HET2 (18 channels), each with dedicated HTU and MPU - provides precise, software-defined timing for actuator control and sensor synchronization. |
| Communication | 3× DCAN, 1× FlexRay (2-channel), 1× EMAC (10/100 Mbps), 2× SPI, 1× I2C, 1× LIN, 1× SCI - meets automotive networking requirements across CAN, time-triggered, and Ethernet domains. |
| Safety Features | Built-in BIST, ESM with ERROR pin, voltage/clock monitors, memory protection units (MPUs) on DMA/N2HET - satisfies ASIL-D decomposition requirements without external safety monitors. |
| Operating Range | −40°C to +125°C, VCC = 1.14–1.32 V, VCCIO = 3.0–3.6 V - qualified for under-hood automotive environments with tight supply tolerance. |
Pinout & Package
The TMS5703137BPGEQQ1 is housed in a 144-pin LQFP (PGE) package measuring 20.0 mm × 20.0 mm, lead-free and RoHS-compliant. Pin functions are defined per TI SPNS162C Rev C, Section 4.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nRST | Reset Input | Active-low asynchronous reset; initiates full device initialization and safety state entry upon assertion. |
| nERROR | Error Output | Open-drain output driven low by ESM on detected fault - used for external system-level fail-safe response coordination. |
| VCCAD / VSSAD | ADC Power / Ground | Dedicated 3.0–5.25 V analog supply domain with independent filtering - isolates ADC performance from digital noise. |
| GIOA[7:0] | General-Purpose I/O | Eight configurable GPIO pins with interrupt capability - supports diagnostic signaling, status reporting, or auxiliary control paths. |
| MIBSPI1_nCS[5:0] | Chip Select Outputs | Six independent chip select lines for daisy-chained or parallel peripheral interfacing - enables flexible expansion of SPI-based sensors or memory. |
| EMAC_MII_RXD[3:0] | Ethernet Receive Data | 4-bit MII receive data bus - supports 10/100 Mbps Ethernet PHY interface with standard IEEE 802.3 timing compliance. |
| FRAY_TX1 / FRAY_RX1 | FlexRay Channel 1 I/O | Differential transmit/receive pair for time-triggered, deterministic communication up to 10 Mbps - critical for drive-by-wire and active safety networks. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Lockstep Execution | Hardware-enforced instruction-level comparison between two Cortex-R4F cores - detects single-event upsets and logic faults before propagation. |
| ECC Memory Protection | Single-bit correction and double-bit detection on 3 MB flash and 256 KB RAM - prevents silent data corruption in program and runtime data storage. |
| Fault-Tolerant N2HET Timers | Two independent N2HET modules (32 + 18 channels) with dedicated HTUs and MPUs - enables safe, high-resolution PWM generation and capture without CPU intervention. |
| Integrated Safety Subsystem | ESM, BIST, clock/voltage monitors, and loopback-capable I/O - reduces need for external safety ICs and simplifies ISO 26262 FMEDA analysis. |
| Automotive Communication Suite | Three DCAN, dual-channel FlexRay, 10/100 EMAC, LIN, and I2C - supports mixed-criticality network topologies in modern vehicle ECUs. |
Applications
| Braking Systems | Electric Power Steering |
|---|---|
Use Scenario: Real-time pressure modulation and wheel-speed feedback processing in ABS and ESC modules. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software with lockstep CPU verification and ECC memory. Use Value: Enables certified fault-detection latency < 10 µs and continuous BIST coverage during operation - meeting ISO 26262 ASIL-D timing constraints. | Use Scenario: Torque assist calculation, motor phase control, and torque sensor fusion in column- or rack-mounted EPS systems. IC Role / Device Role / Timing Role: Real-time motion controller with N2HET-driven PWM outputs and synchronized ADC sampling of motor current and position. Use Value: Achieves < 50 µs end-to-end control loop latency using hardware-accelerated timers and dual ADC buffering - critical for driver feel and stability. |
| Battery Management Systems | Railway Communications |
Use Scenario: Cell voltage/temperature monitoring, SOC/SOH estimation, and contactor control in high-voltage traction battery packs. IC Role / Device Role / Timing Role: Safety-certified data acquisition and decision engine interfacing with isolated ADCs, CAN, and digital isolators. Use Value: Supports redundant voltage measurement paths and CRC-protected CAN messaging - fulfilling IEC 61508 SIL-3 and UN ECE R100 requirements. | Use Scenario: Onboard train control unit managing signaling, door interlocks, and brake command arbitration across distributed carriages. IC Role / Device Role / Timing Role: Deterministic communication gateway with FlexRay time-triggered scheduling and EMAC for Ethernet backbone integration. Use Value: Guarantees sub-millisecond message delivery jitter and hardware timestamping - satisfying EN 50128 SW-SIL4 timing determinism. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS3137ZWT | 337-ball BGA package (16 mm × 16 mm), higher pin count (144 → 337), supports EMIF and ETM trace | Preferred for space-constrained designs requiring external SDRAM or full instruction trace; not pin-compatible with PGE | Select when board layout allows BGA and advanced debug/trace capability is required for certification evidence. |
| SPC574S40E1 | Power Architecture e200z4 dual-core, 200 MHz, 2 MB flash, 384 KB RAM, ASIL-D certified per ISO 26262 | Standalone safety MCU with integrated PMIC and LINPHY; lacks FlexRay and EMAC but adds CAN FD and HSE security engine | Choose when CAN FD, embedded security, or integrated power management outweigh FlexRay/Ethernet needs. |
Compared with TMS5703137BPGEQQ1, the ZWT variant offers greater I/O density and external memory support but requires BGA rework, while the SPC574S40E1 trades FlexRay/EMAC for CAN FD and hardware security - making it suitable for gateway or secure ECU roles where Ethernet is unnecessary.
Availability
TMS5703137BPGEQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, and battery management systems requiring stable component supply across long-life automotive programs.
Supply support for TMS5703137BPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for automotive, industrial, and communications markets.
The TMS570 Hercules™ family was designed specifically for ASIL-D and SIL-3 safety-critical applications, integrating hardware redundancy, memory protection, and diagnostic acceleration to reduce functional safety certification effort.
FAQ
What safety certifications does the TMS5703137BPGEQQ1 support?
The TMS5703137BPGEQQ1 is architected to meet ISO 26262 ASIL-D requirements and IEC 61508 SIL-3 standards. It includes dual lockstep CPUs, ECC memory, BIST, ESM, and voltage/clock monitors - all documented in TI's Functional Safety Manual (SPNU522). Certification evidence packages and FMEDA reports are available under NDA for TMS5703137BPGEQQ1 design-in.
Does the TMS5703137BPGEQQ1 support CAN FD?
No, the TMS5703137BPGEQQ1 integrates three DCAN controllers compliant only with CAN 2.0A/B protocols (up to 1 Mbps). It does not support CAN FD data rates or extended frame formats. For CAN FD capability, consider the TMS570LC4357ZWT or STMicroelectronics SPC574S40E1 - both explicitly listed with CAN FD support in their respective datasheets.
What is the maximum operating temperature for the TMS5703137BPGEQQ1?
The TMS5703137BPGEQQ1 is rated for continuous operation from −40°C to +125°C ambient temperature, qualified per AEC-Q100 Grade 1. This rating applies to the full electrical specification, including 180 MHz CPU operation, EMAC, and FlexRay - confirmed in TI SPNS162C Rev C, Section 5.4.
Can the TMS5703137BPGEQQ1 run without external crystal?
Yes, the TMS5703137BPGEQQ1 includes an internal HF-LPO oscillator and supports startup from internal RC sources. However, for full-spec operation - including EMAC, FlexRay, and USB timing - an external 20 MHz crystal is required per TI's clock tree documentation. The FMPLL must be configured to multiply this reference to achieve 180 MHz core frequency.
Is the TMS5703137BPGEQQ1 pin-compatible with other TMS570LS3137 variants?
The TMS5703137BPGEQQ1 shares identical pin functionality with the TMS570LS3137PGE (non-Q1) variant, differing only in automotive qualification (AEC-Q100 Grade 1, PPAP support, and enhanced screening). It is not pin-compatible with the ZWT BGA variant due to different package geometry, ball/pin mapping, and signal routing constraints.
TMS5703137BPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5703137BPGEQQ1 FAQ
1.How can I place an order for TMS5703137BPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5703137BPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5703137BPGEQQ1 reliable?
The price and inventory of TMS5703137BPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5703137BPGEQQ1 is usually 5 days.
3.What payment methods are accepted for TMS5703137BPGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5703137BPGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS5703137BPGEQQ1?
TMS5703137BPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5703137BPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5703137BPGEQQ1?
For technical support, including TMS5703137BPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5703137BPGEQQ1 requirements.
6.How does Aetrix verify that TMS5703137BPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5703137BPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5703137BPGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5703137BPGEQQ1?
All TMS5703137BPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5703137BPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5703137BPGEQQ1 part is unused and in its original packaging.
Return procedure for TMS5703137BPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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