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Texas Instruments TMS5703137CGWTMEP

Part No.:
TMS5703137CGWTMEP
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
337-LFBGA
Datasheet:
AetrixTMS5703137CGWTMEP.pdf
Description:
IC MCU 16/32B 3MB FLASH 337NFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,159

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Product details

Overview

TMS5703137CGWTMEP from Texas Instruments is a radiation-tolerant, safety-certified 32-bit RISC microcontroller featuring dual lockstep ARM Cortex-R4F CPUs, 3 MB flash with ECC, 256 KB RAM with ECC, and integrated safety mechanisms including BIST, parity-protected peripherals, and error signaling. It operates from –55°C to 125°C and targets brake control, electric power steering, and HEV/EV inverter systems.

For engineers reviewing the TMS5703137CGWTMEP datasheet, TMS5703137CGWTMEP pinout, TMS5703137CGWTMEP application, or TMS5703137CGWTMEP equivalent, this page delivers verified technical context, validated pin functions, safety-critical peripheral mappings (DCAN, FlexRay, N2HET), and real-world design implications for aerospace, automotive, and industrial safety systems.

Technical Context

The TMS5703137CGWTMEP implements a dual-core lockstep architecture with hardware-enforced instruction-level redundancy, where both CPUs execute identical code streams and compare results at each cycle. Its FMPLL and nonmodulating PLL provide independent clock domains for core, peripheral, and EMIF subsystems, supporting up to 180 MHz operation with 298 DMIPS performance.

Safety-critical data paths are protected by ECC on flash and RAM, parity on MibADC buffers and message RAM, and loopback-capable I/O for diagnostic coverage. The device integrates two N2HET coprocessors (32+18 channels), three DCAN controllers compliant with CAN 2.0B, and an IEEE 802.3-compliant 10/100 Mbps EMAC with MII/RMII support - all operating within the extended –55°C to 125°C temperature range.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ARM Cortex-R4F dual CPU in lockstep with BIST, delivering functional safety compliance per ISO 26262 ASIL-D and IEC 61508 SIL-3.
Memory 3 MB program flash with ECC + 256 KB RAM with ECC + 64 KB emulated EEPROM flash - enabling safe firmware updates and runtime parameter storage.
Operating Temperature –55°C to 125°C (full specification across all IP modules), qualified for defense, aerospace, and harsh-environment industrial use.
Communication Interfaces Three DCAN (CAN 2.0B, up to 1 Mbps), FlexRay (two channels), EMAC (10/100 Mbps, MII/RMII), LIN 2.1, I2C (100/400 kbps), and five MibSPIs - supporting distributed real-time networking.
Analog Peripherals Two 12-bit MibADCs (24 total channels, 16 shared), each with 64-word parity-protected buffer RAM - enabling synchronized sensor acquisition for motor control and battery monitoring.
Timing & Control N2HET1 (32 channels) and N2HET2 (18 channels) with dedicated HTUs and MPUs - providing deterministic, software-defined PWM, capture, and GPIO timing for actuator control.
Package 337-ball NFBGA (GWT), SnPb finish, 1.0 mm ball pitch - compatible with high-reliability board assembly and thermal cycling requirements.

Pinout & Package

337-ball NFBGA (GWT) package with SnPb finish, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in high-power safety applications.

Pin/Terminal Circuit Role Design Meaning
VCCAD / VSSAD ADC Power Supply / Ground Dedicated 3.0–5.25 V analog domain supply and ground - isolates ADC noise from digital logic and enables precise reference stability.
AD1IN[0]–AD1IN[23] / AD2IN[0]–AD2IN[15] Analog Input Channels 24-channel MibADC1 + 16-channel MibADC2 (16 shared), each with programmable event triggers - supports multi-sensor sampling for torque, current, and temperature feedback loops.
N2HET1[0]–N2HET1[31] / N2HET2[0]–N2HET2[17] High-End Timer I/O Programmable timing pins with suppression filters - enable glitch-immune PWM generation, edge capture, and GPIO with sub-microsecond resolution for motor phase control.
DCAN1_RX / DCAN1_TX – DCAN3_RX / DCAN3_TX CAN Transceiver Interface Three independent CAN physical layer interfaces compliant with ISO 11898-1 - support redundant bus architectures and fault-tolerant vehicle networks.
EMAC_MII_RXD[3:0] / EMAC_MII_TXD[3:0] Ethernet PHY Interface 4-bit MII data lanes supporting 10/100 Mbps full-duplex operation - enables time-sensitive networking (TSN)-capable communication in avionics and rail systems.

Key Features

Feature Design Value
Lockstep Dual-Core Execution Hardware-synchronized Cortex-R4F CPUs with cycle-by-cycle comparison and automatic error flagging - eliminates undetected silent data corruption in safety-critical control loops.
ECC Memory Protection Single-bit correction and double-bit detection on 3 MB flash and 256 KB RAM - ensures integrity of boot code, application firmware, and runtime variables under radiation or voltage stress.
Parameter Overlay Module (POM) Dynamic rerouting of flash accesses to RAM or EMIF - allows real-time calibration of control parameters without halting CPU or reprogramming flash during field operation.
Data Modification Module (DMM) External write access to internal memory via debug interface - enables secure firmware patching and diagnostic data injection without altering application execution flow.
Error Signaling Module (ESM) Centralized fault monitor with configurable interrupt/error pin assertion - provides immediate system-level visibility into CPU, memory, clock, or peripheral failures for fail-safe shutdown.

Applications

Braking Systems Electric Power Steering

Use Scenario: Real-time pressure modulation and wheel-speed-based slip control in ABS and ESC modules.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D certified braking algorithms with lockstep CPU verification and ECC-protected motion profiles.

Use Value: Enables deterministic <100 µs response latency to wheel-speed transients while maintaining fault coverage >99% per ISO 26262 requirements.

Use Scenario: Torque assist calculation and motor position feedback in column-assist EPS systems.

IC Role / Device Role / Timing Role: High-resolution ADC sampling (12-bit, 24-channel) synchronized with N2HET-driven motor PWM for precise torque vectoring.

Use Value: Supports 12-bit ADC conversion with 64-word parity-protected buffers and sub-µs N2HET timing - reducing torque ripple below 2% THD.

HEV/EV Inverter Control Aerospace Actuation

Use Scenario: Gate driver timing, current sensing, and thermal monitoring in 3-phase traction inverters.

IC Role / Device Role / Timing Role: Dual N2HET modules generating isolated, phase-shifted PWM signals with hardware dead-time insertion and fault-triggered shutdown.

Use Value: Delivers 32+18 programmable N2HET channels with dedicated HTU DMA and MPU - ensuring gate drive timing accuracy ±5 ns across temperature.

Use Scenario: Flight control surface actuation with triple-redundant command validation and health monitoring.

IC Role / Device Role / Timing Role: Safety-certified controller interfacing with FlexRay (dual-channel) and DCAN buses for cross-channel arbitration and voting logic.

Use Value: Supports FlexRay protocol with 8 KB message RAM and dedicated FTU - enabling deterministic 10 µs cycle times for flight-critical actuator commands.

Equivalent & Alternatives

The following parts are listed as comparable options for similar safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS5703137CGWTQEP Same silicon, –40°C to 125°C operating range; lacks extended low-temperature qualification. Not suitable for cryogenic defense/aerospace deployments requiring –55°C startup. Select TMS5703137CGWTMEP when full military-grade cold-start capability is required.
SPC574S40E1 Power Architecture-based, single-core with lockstep emulation; 2 MB flash, no EMAC or FlexRay. Limited to automotive chassis applications without Ethernet or deterministic time-triggered networking. Choose TMS5703137CGWTMEP for systems needing IEEE 802.3, FlexRay, or dual-N2HET timing precision.

Compared with TMS5703137CGWTQEP, the TMS5703137CGWTMEP adds guaranteed –55°C functionality and extended product lifecycle support; versus SPC574S40E1, it delivers superior real-time networking (EMAC/FlexRay), higher memory density, and true hardware lockstep - critical for ASIL-D and SIL-3 certification evidence.

Availability

TMS5703137CGWTMEP is available at Aetrix Electronics and suitable for braking systems, electric power steering, and HEV/EV inverter control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TMS5703137CGWTMEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in high-reliability microcontrollers.

The TMS570LS3137-EP product line was designed specifically for functional safety-critical applications in aerospace, defense, medical, and automotive domains - integrating hardware safety mechanisms, extended temperature qualification, and controlled baseline manufacturing.

FAQ

What safety certifications apply to the TMS5703137CGWTMEP?

The TMS5703137CGWTMEP is qualified to meet ISO 26262 ASIL-D and IEC 61508 SIL-3 requirements. Its dual lockstep CPU, ECC memory, BIST logic, and error signaling module are architected to deliver >99% fault coverage. TI provides certified safety manuals, FMEDA reports, and diagnostic software libraries specifically for the TMS5703137CGWTMEP to support certification evidence generation.

Does the TMS5703137CGWTMEP support Ethernet communication?

Yes, the TMS5703137CGWTMEP integrates a fully compliant IEEE 802.3 10/100 Mbps Ethernet MAC (EMAC) with MII and RMII interfaces, plus MDIO management. It supports full-duplex operation, hardware checksum offload, and direct memory access via DMA - enabling deterministic real-time networking in avionics and rail systems using the TMS5703137CGWTMEP.

How does the N2HET module enhance real-time control in the TMS5703137CGWTMEP?

The TMS5703137CGWTMEP features two N2HET modules (N2HET1 with 32 channels, N2HET2 with 18 channels) that operate independently of the main CPU. Each supports programmable PWM, input capture, and GPIO with hardware-suppression filters. This offloads timing-critical tasks - such as motor phase control or sensor synchronization - from the Cortex-R4F cores, ensuring sub-microsecond jitter and deterministic behavior in the TMS5703137CGWTMEP.

What is the difference between TMS5703137CGWTMEP and TMS5703137CGWTQEP?

The TMS5703137CGWTMEP and TMS5703137CGWTQEP share identical silicon and feature sets, but differ in temperature qualification: the "MEP" variant is rated for –55°C to 125°C, while the "QEP" variant is rated for –40°C to 125°C. Both use the same 337-ball GWT package and support identical safety mechanisms, making the TMS5703137CGWTMEP the only choice for cryogenic defense or space applications requiring guaranteed –55°C startup.

Can the TMS5703137CGWTMEP interface with external SDRAM?

Yes, the TMS5703137CGWTMEP includes a 16-bit External Memory Interface (EMIF) supporting synchronous DRAM (SDRAM), asynchronous SRAM, and FPGA peripherals. It provides dedicated EMIF_CLK, CKE, nRAS, nCAS, and nWE signals - enabling expansion of data buffers or offloading of graphics/video processing in safety-critical displays using the TMS5703137CGWTMEP.

TMS5703137CGWTMEP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
337-LFBGA
Series:
Hercules™ TMS570 ARM® Cortex®-R
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 16x12b, 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TMS5703137CGWTMEP FAQ

1.How can I place an order for TMS5703137CGWTMEP through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS5703137CGWTMEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS5703137CGWTMEP reliable?

The price and inventory of TMS5703137CGWTMEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5703137CGWTMEP is usually 5 days.

3.What payment methods are accepted for TMS5703137CGWTMEP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5703137CGWTMEP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS5703137CGWTMEP?

TMS5703137CGWTMEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS5703137CGWTMEP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS5703137CGWTMEP?

For technical support, including TMS5703137CGWTMEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5703137CGWTMEP requirements.

6.How does Aetrix verify that TMS5703137CGWTMEP is sourced from the original manufacturer or authorized distributors?

All TMS5703137CGWTMEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5703137CGWTMEP meets industry standards.

7.What is the process for return or replacement of TMS5703137CGWTMEP?

All TMS5703137CGWTMEP units undergo pre-shipment inspection (PSI). If there is an issue with TMS5703137CGWTMEP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS5703137CGWTMEP part is unused and in its original packaging.

Return procedure for TMS5703137CGWTMEP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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