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Texas Instruments TMS5703137DPGEQQ1
- Part No.:
- TMS5703137DPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMS5703137DPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 3MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:278
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Product details
Overview
TMS5703137DPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 3 MB ECC-protected flash, 256 KB ECC RAM, and integrated safety features including BIST, voltage/clock monitoring, and error signaling for ASIL-D systems. It supports real-time control in braking, electric power steering, and battery management.
For engineers reviewing the TMS5703137DPGEQQ1 datasheet, TMS5703137DPGEQQ1 pinout, TMS5703137DPGEQQ1 application, or TMS5703137DPGEQQ1 equivalent, this page delivers verified technical context, package-specific pin mapping (144-pin LQFP), functional alternatives, and safety-critical design guidance aligned to ISO 26262 requirements.
Technical Context
The TMS5703137DPGEQQ1 implements a dual-CPU lockstep architecture with hardware BIST, ECC on flash and SRAM, parity on peripheral memories, and loopback I/O for fault detection. Its FMPLL and nonmodulating FlexRay PLL provide independent clock domains for deterministic timing.
It integrates two N2HET modules (32 + 18 channels), two 12-bit MibADCs (24 total channels, 64-word parity buffers each), three DCAN controllers (CAN 2.0B compliant), and a 10/100 Mbps Ethernet MAC supporting MII/RMII/MDIO - all accessible via a switched central resource crossbar with MPU-enforced memory protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core lockstep, 1.66 DMIPS/MHz @ up to 180 MHz (298 DMIPS peak) |
| Memory | 3 MB program flash with ECC; 256 KB data RAM with ECC; 64 KB emulated EEPROM flash with ECC |
| Safety Features | Dual CPU lockstep, CPU/RAM BIST, ECC/parity protection across memory and peripherals, ERROR pin assertion |
| Analog Peripherals | Two 12-bit MibADCs: ADC1 with 24 channels, ADC2 with 16 shared channels; 64-word parity-protected result buffers each |
| Timing & Control | N2HET1 (32 channels) and N2HET2 (18 channels); HTU with MPU per N2HET; RTI timer; 96-channel VIM interrupt controller |
| Communication | Three DCANs (1 Mbps), one FlexRay (10 Mbps/channel), one EMAC (10/100 Mbps), two SPIs, three MibSPIs, one LIN, one SCI, one I2C |
| Package & Environment | LQFP-144 (PGE), green RoHS-compliant; operating temperature −40°C to +125°C; AEC-Q100 Grade 1 qualified |
Pinout & Package
Package: 144-pin LQFP (PGE), 20.0 mm × 20.0 mm, 0.5 mm pitch, green RoHS-compliant. Pinout validated per TI SPNS162C Rev. April 2015, Section 4.1 (PGE QFP Package Pinout).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nRST | Reset Input | Active-low asynchronous reset; initiates full device reset sequence including CPU, memory, and peripherals |
| nERROR | Error Output | Open-drain output asserted low by ESM on detected fault (e.g., ECC double-bit error, BIST failure, clock monitor violation) |
| VCCAD / VSSAD | ADC Power / Ground | Separate 3.0–5.25 V analog supply domain with dedicated ground; enables high-precision ADC operation independent of digital noise |
| GIOA[7:0] | General-Purpose I/O | Eight configurable GPIO pins with interrupt capability; multiplexed with N2HET1, MibSPI1, and CAN1 signals |
| MIBSPI1_nCS[5:0] | Chip Select Outputs | Six independent chip select lines for MibSPI1; support daisy-chained or parallel peripheral interfacing without external logic |
Key Features
| Feature | Design Value |
|---|---|
| Dual Lockstep CPU Architecture | Enables ASIL-D compliance by detecting transient faults via real-time comparison of dual execution paths |
| ECC-Protected Memory Subsystem | Single-bit error correction and double-bit error detection on 3 MB flash and 256 KB RAM prevent silent data corruption in safety-critical code/data |
| N2HET Timing Coprocessors | Hardware-accelerated real-time pulse generation, capture, and actuator control with autonomous HTU DMA transfers and MPU isolation |
| Integrated Safety Monitoring | On-chip voltage, clock, and memory BIST monitors feed into Error Signaling Module (ESM) for deterministic fault response and nERROR assertion |
| Automotive Communication Suite | Three DCAN, dual-channel FlexRay, and 10/100 Ethernet enable multi-bus vehicle networking with protocol-level redundancy |
Applications
| Braking Systems | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time monitoring of wheel speed sensors, hydraulic pressure, and yaw rate during ABS and ESC activation. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262-compliant brake actuation algorithms with lockstep CPU verification and ECC memory integrity. Use Value: Deterministic <100 µs interrupt latency and dual-CPU fault detection ensure fail-safe brake modulation under transient EMI or voltage droop. |
Use Scenario: Closed-loop torque control of EPS motor using torque sensor feedback, vehicle speed, and steering angle inputs. IC Role / Device Role / Timing Role: Real-time motor control unit managing N2HET-driven PWM outputs, ADC-sampled current/voltage, and CAN-based driver assistance coordination. Use Value: Integrated 12-bit MibADCs with 24-channel sequencing and N2HET hardware timing eliminate external timing ICs and reduce system BOM count. |
| Battery Management Systems | Railway Communications |
Use Scenario: Cell voltage, temperature, and current monitoring in high-voltage traction battery packs for EV/HEV platforms. IC Role / Device Role / Timing Role: Safety-certified data acquisition and communication hub interfacing with isolated ADCs, thermal sensors, and DCAN/FlexRay networks. Use Value: Parity-protected 64-word ADC buffers and ECC RAM guarantee accurate state-of-charge calculation even after years of field operation. |
Use Scenario: Interlocking and signaling control in rail infrastructure requiring SIL-3/4 certification and deterministic message delivery. IC Role / Device Role / Timing Role: Dual-redundant communication controller handling FlexRay-based train-to-trackside messaging and DCAN-based subsystem diagnostics. Use Value: Dual-channel FlexRay with FTU and built-in 8 KB message RAM enable time-triggered, fault-tolerant data exchange without host CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS3137ZWT | 337-ball BGA (16 mm × 16 mm); higher pin count (144 → 337), supports EMIF, ETM trace, and additional GPIO/N2HET channels | Preferred for space-constrained PCBs needing expanded memory interface or debug visibility; not drop-in compatible with PGE footprint | Select ZWT when board layout allows BGA and requires EMIF for external SDRAM or enhanced trace capability. |
| TMS570LS3135PGE | Same PGE package but lower frequency (160 MHz vs. 180 MHz); identical memory map, peripherals, and safety architecture | Suitable for cost-sensitive designs where 20 MHz CPU margin is acceptable; shares same pinout and thermal profile | Choose LS3135PGE if application timing budget permits reduced clock headroom and lower power consumption is prioritized. |
Compared with TMS5703137DPGEQQ1, the ZWT variant offers greater I/O and memory expansion at the cost of soldering complexity, while the LS3135PGE provides identical safety functionality with relaxed performance - enabling trade-offs between compute headroom, board area, and testability without redesigning safety-critical firmware.
Availability
TMS5703137DPGEQQ1 is available at Aetrix Electronics and suitable for automotive braking systems, electric power steering units, and battery management systems requiring stable component supply across extended product lifecycles.
Supply support for TMS5703137DPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of automotive electronics innovation.
The TMS570 Hercules™ family was designed specifically for ASIL-D and SIL-3 safety-critical applications, integrating hardware redundancy, memory protection, and diagnostic accelerators to simplify ISO 26262 and IEC 61508 certification.
FAQ
What safety certifications apply to the TMS5703137DPGEQQ1?
The TMS5703137DPGEQQ1 is AEC-Q100 Grade 1 qualified and architected to support ISO 26262 ASIL-D and IEC 61508 SIL-3 compliance. Its dual lockstep CPUs, ECC memory, BIST logic, and error signaling module are implemented in silicon to meet systematic and random hardware fault metrics. Certification evidence must be generated per application-specific FMEDA and safety analysis - the TMS5703137DPGEQQ1 itself provides the foundational hardware safety mechanisms required.
Does the TMS5703137DPGEQQ1 support external memory expansion?
No, the TMS5703137DPGEQQ1 does not support external memory expansion. Unlike the ZWT variant, the PGE package omits the External Memory Interface (EMIF) signals. All required program and data storage is contained on-die: 3 MB flash, 256 KB RAM, and 64 KB emulated EEPROM. This simplifies layout and improves reliability in harsh environments but limits maximum addressable memory to internal resources.
How many CAN interfaces does the TMS5703137DPGEQQ1 include?
The TMS5703137DPGEQQ1 includes three fully independent DCAN controllers compliant with CAN 2.0B protocol, each supporting bit rates up to 1 Mbps. These controllers operate autonomously with dedicated message RAM, 64 mailboxes (each parity-protected), and integrated error counters - enabling simultaneous communication on chassis, powertrain, and body networks without CPU overhead.
What is the role of the N2HET modules in the TMS5703137DPGEQQ1?
The TMS5703137DPGEQQ1 integrates two Next Generation High-End Timer (N2HET) modules: N2HET1 with 32 programmable channels and N2HET2 with 18 channels. Each operates as a dedicated timing coprocessor with its own instruction RAM and I/O port, offloading precise PWM generation, input capture, and GPIO sequencing from the main CPU - critical for deterministic actuator control in safety systems.
Can the TMS5703137DPGEQQ1 be used without FlexRay or Ethernet?
Yes, the TMS5703137DPGEQQ1 can be deployed in applications that do not use FlexRay or Ethernet. Both modules are optional peripherals enabled only when configured in software and connected to external PHYs. Unused modules remain powered down, consuming no dynamic current. The core safety architecture, CPU, memory, ADCs, timers, and CAN/LIN/SCI interfaces remain fully functional and certified regardless of FlexRay or EMAC usage.
TMS5703137DPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5703137DPGEQQ1 FAQ
1.How can I place an order for TMS5703137DPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5703137DPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5703137DPGEQQ1 reliable?
The price and inventory of TMS5703137DPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5703137DPGEQQ1 is usually 5 days.
3.What payment methods are accepted for TMS5703137DPGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5703137DPGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS5703137DPGEQQ1?
TMS5703137DPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5703137DPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5703137DPGEQQ1?
For technical support, including TMS5703137DPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5703137DPGEQQ1 requirements.
6.How does Aetrix verify that TMS5703137DPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMS5703137DPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5703137DPGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMS5703137DPGEQQ1?
All TMS5703137DPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMS5703137DPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5703137DPGEQQ1 part is unused and in its original packaging.
Return procedure for TMS5703137DPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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