Texas Instruments TMS5704357BGWTEP
- Part No.:
- TMS5704357BGWTEP
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 337-LFBGA
- Datasheet:
-
TMS5704357BGWTEP.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 337NFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS5704357BGWTEP from Texas Instruments is a radiation-tolerant, high-integrity automotive-grade ARM® Cortex®-R5F dual-core microcontroller designed for ASIL-D safety-critical systems. It operates at up to 300 MHz, integrates 4 MB ECC-protected flash and 512 KB ECC-protected RAM, and features dual-lockstep CPUs with BIST, ESM, and voltage/clock monitoring - deployed in electric power steering and brake control units.
For engineers reviewing the TMS5704357BGWTEP datasheet, TMS5704357BGWTEP pinout, TMS5704357BGWTEP application, or TMS5704357BGWTEP equivalent, key selection criteria include functional safety certification (ISO 26262 ASIL-D), dual-core lockstep integrity, on-chip ECC coverage across memory and peripherals, and support for FlexRay/CAN/Ethernet real-time communication in harsh environments.
Technical Context
The TMS5704357BGWTEP implements two ARM Cortex-R5F CPUs in hardware-enforced lockstep with 32 KB I-cache and 32 KB D-cache, both protected by ECC. Its safety architecture includes dedicated Error Signaling Module (ESM) with nERROR output, Built-In Self-Test (BIST) for CPU/N2HET/SRAM, and voltage/clock monitors that trigger fault responses within defined timing windows.
Real-time control is enabled by two N2HET coprocessors (32 channels each, 256-word parity-protected RAM), seven ePWM modules with trip-zone protection, six eCAP modules, two 12-bit MibADCs (41 total channels, 64-word parity buffers), and dual-channel FlexRay with autonomous FTU transfers - all with ECC or parity protection on associated memories.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R5F dual-core, lockstep operation with 1.66 DMIPS/MHz performance |
| Max Clock Frequency | 300 MHz - enables deterministic real-time execution for ASIL-D motion control loops |
| Flash Memory | 4 MB with ECC - supports safe program storage and field updates without corruption risk |
| RAM | 512 KB SRAM with ECC + 128 KB data flash for EEPROM emulation with ECC |
| Operating Temperature | –55°C to +125°C - qualified for extended aerospace, defense, and heavy-duty vehicle environments |
| Safety Features | Dual-lockstep CPUs, BIST, ESM with nERROR pin, clock/voltage monitors, MPU, and ECC on all critical memories |
| Communication Interfaces | 4× CAN 2.0B (64 mailboxes), 2× I²C, 5× MibSPI, 4× UART/LIN, 1× 10/100 Ethernet MAC, 1× FlexRay (2-channel) |
Pinout & Package
Package: 337-ball NFBGA (GWT), 16.00 mm × 16.00 mm, green RoHS-compliant package with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nERROR | Error signaling output | Active-low fault indicator asserted by ESM upon detection of uncorrectable error in CPU, memory, or clock domain |
| nPORRST | Power-on reset input | Asynchronous reset pin that initializes all logic and disables outputs until stable supply is confirmed |
| VCC / VCCIO / VCCAD | Power domains | Separate 1.14–1.32 V core, 3.0–3.6 V I/O, and analog supply rails - enable independent sequencing and noise isolation |
| OSCIN / OSCOUT | Crystal oscillator interface | Differential crystal input/output supporting external 1–20 MHz reference for FMPLL and system clock generation |
| EMIF_ADDR[21:0] | External memory address bus | 22-bit multiplexed address bus for interfacing with asynchronous/synchronous SRAM, NOR, or FPGA peripherals |
| MIBSPI1_SIMO[1:0] | Serial data output | Dual-SIMO mode supports daisy-chained SPI slaves or redundant sensor interfaces with ECC-protected 256-word buffer |
Key Features
| Feature | Design Value |
|---|---|
| Dual-lockstep Cortex-R5F CPUs | Hardware-synchronized execution with automatic fault detection and fail-safe response via ESM |
| ECC protection across all memories | Single-bit correction/double-bit detection on 4 MB flash, 512 KB RAM, and peripheral buffers - prevents silent data corruption |
| N2HET timing coprocessors (2×) | 64 programmable I/O terminals with hardware angle generation and HTU DMA - offloads complex PWM/capture tasks from CPU |
| FlexRay controller with FTU | Autonomous dual-channel data transfer between message RAM and main memory - eliminates CPU intervention for time-triggered comms |
| Integrated safety monitoring | Real-time voltage, clock, and temperature monitoring with configurable thresholds and ESM-triggered fault escalation |
| Parameter Overlay Module (POM) | Runtime rerouting of flash accesses to RAM - enables live calibration without flash reprogramming or system interruption |
Applications
| Braking Systems | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time hydraulic pressure modulation and wheel-speed-based ABS actuation in passenger and commercial vehicles. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D braking algorithms with lockstep CPU validation and fault-tolerant CAN/FlexRay comms. Use Value: Dual-core lockstep and ECC memory ensure zero latent faults during emergency deceleration; N2HET timers precisely manage solenoid pulse widths within <1 µs jitter. |
Use Scenario: Torque assist calculation, motor phase control, and road feedback processing in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Central motion controller managing ePWM-driven 3-phase inverter, MibADC current sensing, and eQEP rotor position tracking. Use Value: Seven ePWM modules with deadband and trip-zone protection prevent shoot-through in inverter bridges; dual MibADCs sample motor currents at 1 MSPS with parity-checked buffers. |
| Battery Management Systems (BMS) | Railway Communications |
Use Scenario: Cell voltage monitoring, thermal management, and contactor control in high-voltage traction battery packs for EVs and HEVs. IC Role / Device Role / Timing Role: Safety-certified host MCU interfacing with analog front-ends via MibADC, communicating over isolated CAN to slave nodes. Use Value: 41-channel MibADC with shared inputs supports simultaneous cell voltage and temperature sampling; 128 KB data flash stores calibrated SOC/SOH models with ECC integrity. |
Use Scenario: Onboard train control unit (TCU) implementing ETCS Level 1/2 functions and secure inter-wagon communication via MVB or CANopen. IC Role / Device Role / Timing Role: SIL-4 certified controller running safety-critical interlocking logic and handling time-triggered FlexRay messaging for distributed subsystems. Use Value: Extended –55°C to +125°C operation ensures reliability in unconditioned underfloor enclosures; dual VIM interrupt modules with ECC vector tables guarantee deterministic ISR latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS1227ZWT | Single-core Cortex-R4F, 192 KB RAM, 2 MB flash, no FlexRay, lower temp range (–40°C to 105°C) | Targeted at ASIL-B systems like body control modules; lacks dual-core lockstep and FlexRay for train control | Select when cost-sensitive ASIL-B compliance suffices and FlexRay/extended temperature are unnecessary |
| SPC574K72E5 | Power Architecture e200z4 dual-core, 2 MB flash, 384 KB RAM, supports SENT but no FlexRay; AEC-Q100 Grade 1 | Optimized for engine control with SENT sensor interface; lacks Ethernet and POM calibration capability | Prefer for ICE powertrain applications requiring SENT decoding and legacy toolchain compatibility |
Compared with TMS5704357BGWTEP, the TMS570LS1227ZWT offers reduced safety scope and memory but lower cost for less demanding ASIL-B roles, while the SPC574K72E5 provides Power Architecture ecosystem advantages in engine management but lacks FlexRay/Ethernet needed for modern rail or ADAS domain controllers.
Availability
TMS5704357BGWTEP is available at Aetrix Electronics and suitable for electric power steering, railway signaling, and battery-management systems requiring stable component supply across extended product lifecycles and extreme environmental conditions.
Supply support for TMS5704357BGWTEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of automotive and industrial qualification expertise.
The TMS570 Hercules™ family is engineered specifically for functional safety-critical applications, delivering ASIL-D and SIL-3 certified MCUs with integrated diagnostics, lockstep architectures, and end-to-end ECC protection across compute, memory, and I/O subsystems.
FAQ
What safety certifications apply to the TMS5704357BGWTEP?
The TMS5704357BGWTEP is qualified for ISO 26262 ASIL-D and IEC 61508 SIL-3 applications. It includes documentation packages, safety manuals, FMEDA reports, and diagnostic software libraries to support functional safety development. The TMS5704357BGWTEP device itself incorporates dual-lockstep CPUs, ECC on all memories, BIST, and ESM - enabling systematic fault mitigation required for highest automotive safety integrity levels.
Does the TMS5704357BGWTEP support external memory expansion?
Yes, the TMS5704357BGWTEP integrates a 16-bit External Memory Interface (EMIF) supporting asynchronous and synchronous memories including SRAM, NOR flash, and FPGA peripherals. It provides EMIF_ADDR[21:0], EMIF_DATA[15:0], EMIF_nCS[4:0], EMIF_nOE, EMIF_nWE, EMIF_nRAS, EMIF_nCAS, and EMIF_CLK signals - enabling direct connection to external devices without glue logic. The TMS5704357BGWTEP EMIF is fully configurable via registers and supports wait-state insertion for timing adaptation.
How does the N2HET module enhance real-time control in the TMS5704357BGWTEP?
The TMS5704357BGWTEP integrates two Next Generation High-End Timer (N2HET) modules, each with 32 programmable channels and 256-word instruction RAM protected by parity. These coprocessors execute timing-critical tasks - such as PWM generation, capture, GPIO toggling, and angle-based waveform synthesis - independently of the CPU. The TMS5704357BGWTEP uses HTU units to perform DMA-style transfers between N2HET RAM and main memory, reducing CPU load and jitter in motor control and sensor synchronization applications.
What is the role of the Parameter Overlay Module (POM) in the TMS5704357BGWTEP?
The Parameter Overlay Module (POM) in the TMS5704357BGWTEP enables runtime redirection of flash memory accesses to internal RAM or EMIF addresses. This allows engineers to update calibration parameters - such as PID gains or lookup tables - during system operation without reprogramming flash or halting execution. The TMS5704357BGWTEP POM supports real-time tuning in closed-loop control systems, significantly accelerating development and field calibration cycles while preserving flash endurance.
Can the TMS5704357BGWTEP operate in extended temperature environments?
Yes, the TMS5704357BGWTEP is rated for operation from –55°C to +125°C ambient temperature, meeting extended temperature requirements for aerospace, defense, and heavy-duty transportation applications. This rating is supported by controlled baseline manufacturing, single assembly/test/fabrication sites, and full traceability - documented in TI's enhanced product change notification and lifecycle management protocols. The TMS5704357BGWTEP maintains full functionality and ECC protection across this entire range.
TMS5704357BGWTEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 337-LFBGA
- Series:
- Hercules™
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 300MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 145
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 1.32V
- Data Converters:
- A/D 41x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS5704357BGWTEP FAQ
1.How can I place an order for TMS5704357BGWTEP through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS5704357BGWTEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS5704357BGWTEP reliable?
The price and inventory of TMS5704357BGWTEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS5704357BGWTEP is usually 5 days.
3.What payment methods are accepted for TMS5704357BGWTEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS5704357BGWTEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS5704357BGWTEP?
TMS5704357BGWTEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS5704357BGWTEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS5704357BGWTEP?
For technical support, including TMS5704357BGWTEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS5704357BGWTEP requirements.
6.How does Aetrix verify that TMS5704357BGWTEP is sourced from the original manufacturer or authorized distributors?
All TMS5704357BGWTEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS5704357BGWTEP meets industry standards.
7.What is the process for return or replacement of TMS5704357BGWTEP?
All TMS5704357BGWTEP units undergo pre-shipment inspection (PSI). If there is an issue with TMS5704357BGWTEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS5704357BGWTEP part is unused and in its original packaging.
Return procedure for TMS5704357BGWTEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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