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Home > Products > Integrated Circuits (ICs) > Embedded > DSP (Digital Signal Processors)

Texas Instruments TMSDC6727BGDHA250

Name: TMSDC6727BGDHA250
Brand: Texas Instruments
SKU: TMSDC6727BGDHA250
Price: 2.40 USD
Availability: InStock
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Part No.:: TMSDC6727BGDHA250

Manufacturer:: Texas Instruments

Category:: DSP (Digital Signal Processors)

Package:: 256-BGA

Datasheet:: TMSDC6727BGDHA250.pdf

Description:: IC FLOATING-POINT DSP 256-BGA

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Product details

Overview

TMSDC6727BGDHA250 from Texas Instruments is a 32-/64-bit floating-point digital signal processor (DSP) featuring a C67x+ CPU core running at 250 MHz, 256 KB on-chip RAM, 384 KB ROM, and a 32 KB program cache. It integrates three multichannel audio serial ports (McASP0–McASP2), dual SPI, dual I²C, real-time interrupt timer, oscillator- and software-controlled PLL, and a 32-bit Universal Host-Port Interface (UHPI). It targets professional audio synthesis, effects processing, and broadcast systems requiring deterministic low-latency signal flow.

For engineers reviewing the TMSDC6727BGDHA250 datasheet, TMSDC6727BGDHA250 pinout, TMSDC6727BGDHA250 application, or TMSDC6727BGDHA250 equivalent, key selection criteria include its 250-MHz C67x+ CPU performance (2000 MIPS/1500 MFLOPS), 32-bit UHPI for host-DSP co-processing, McASP2 with DIT capability for S/PDIF output, 32-bit EMIF supporting up to 512M-bit SDRAM, and PBGA-256 (GDH) thermal-enhanced packaging for high-density audio compute modules.

Technical Context

The TMSDC6727BGDHA250 implements the enhanced C67x+ VLIW CPU with dual 32-register data paths, eight functional units (.D1/.D2, .M1/.M2, .S1/.S2, .L1/.L2), and native IEEE 32-bit single-precision and 64-bit double-precision floating-point arithmetic. It achieves 2000 MIPS and 1500 MFLOPS at 250 MHz with 1.2-V core voltage and 3.3-V I/O.

Its memory subsystem includes unified 256 KB RAM and 384 KB ROM mapped via a high-performance crossbar switch supporting concurrent CPU, dMAX, and UHPI accesses. The 32 KB direct-mapped program cache delivers single-cycle hits and 2-cycle misses to internal memory, while the 32-bit EMIF supports 133-MHz SDRAM and NAND flash with hardware ECC for boot reliability.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	C67x+ VLIW DSP core, code-compatible with C67x, supports 32-/64-bit floating-point and new audio-specific instructions (MPYSPDP, ADDSP, SUBDP).
Operating Frequency	250 MHz - delivers 2000 MIPS and 1500 MFLOPS; enables real-time execution of complex FIR/IIR filters and FFTs in professional audio pipelines.
On-Chip Memory	256 KB RAM + 384 KB ROM - unified program/data space simplifies memory management; supports bootloader, firmware, and real-time audio buffers without external memory dependency.
Program Cache	32 KB direct-mapped - reduces instruction fetch latency; 256-bit-wide path enables full 8-instruction execute packet load per miss penalty cycle.
EMIF Width & Support	32-bit EMIF - supports 133-MHz SDRAM (up to 512M-bit), asynchronous NOR/SRAM, and 8-/16-bit NAND flash with hardware single-bit ECC for robust boot and streaming storage.
Audio Interfaces	Three McASPs (McASP0–McASP2) - McASP2 includes DIT mode for S/PDIF transmission; all support I²S, TDM (up to 32 slots), and independent TX/RX clocking up to 50 MHz.
Host Interface	32-bit UHPI - enables high-bandwidth parallel communication with external microcontrollers or FPGAs; only available on C6727B family members like TMSDC6727BGDHA250.
Package	256-terminal PBGA (GDH suffix), 17 × 17 mm, 1.0-mm pitch - PowerPAD-enabled thermal design supports sustained 250-MHz operation in compact audio processing modules.

Pinout & Package

Package: 256-terminal plastic ball grid array (PBGA), GDH suffix, 17 mm × 17 mm footprint, 1.0-mm ball pitch, PowerPAD thermal pad on underside for enhanced heat dissipation in audio DSP applications.

Pin/Terminal	Circuit Role	Design Meaning
VDD_CORE	Core power supply	1.2-V supply for C67x+ CPU and memory controller; requires tight regulation and local decoupling for stable 250-MHz operation.
VDD_IO	I/O power supply	3.3-V supply for McASP, SPI, I²C, UHPI, and EMIF interfaces; supports mixed-voltage system interfacing.
CLKIN / OSC_IN	External clock or crystal input	Accepts 12–25 MHz crystal or CMOS clock; feeds PLL for generating SYSCLK1 (250 MHz CPU), SYSCLK2 (peripherals), and SYSCLK3 (EMIF).
EMU0 / EMU1	JTAG emulation interface	IEEE 1149.1 boundary-scan pins for debug, trace, and real-time profiling using XDS emulators during audio algorithm development.
UHPI[31:0]	32-bit universal host-port data bus	Enables DMA-coherent parallel data transfers between host MCU and DSP memory; supports non-multiplexed 16-bit address + 32-bit data mode.
EMIF_A[22:0] / EMIF_D[31:0]	32-bit external memory interface	Direct connection to SDRAM/NOR/NAND; A[22:0] provides 4-MB addressing; D[31:0] enables burst transfers at 133 MHz for streaming audio buffers.
MCASP0_AXR[15:0]	McASP0 serial data lines	16 configurable serializers for I²S/TDM; supports up to 16 stereo channels; each AXR pin configurable as TX/RX with independent clocking.
RTI_CLKIN	Real-time interrupt timer clock input	Provides reference clock for RTI's dual 32-bit counters and four compare registers; used for sample-rate measurement and watchdog timing in audio sync chains.

Key Features

Feature	Design Value
Dual Data Movement Accelerator (dMAX)	16-channel DMA engine supporting concurrent memory-to-memory and memory-to-peripheral transfers with circular buffering and 3D data movement - offloads CPU from audio buffer management and enables zero-copy McASP/SDRAM streaming.
High-Performance Crossbar Switch	Deterministic arbitration between CPU, dMAX, and UHPI accessing RAM, ROM, peripherals, and EMIF - guarantees bounded latency for time-critical McASP and RTI events in real-time audio systems.
McASP2 with DIT Mode	Full 384-bit channel status/user data memory and S/PDIF transmitter logic - enables direct digital audio output compliant with IEC 60958 without external transceivers in broadcast and studio gear.
Flexible Boot Options	Supports boot from NAND flash (with hardware ECC), NOR flash, or SDRAM - allows secure, field-upgradable firmware loading in embedded audio products with minimal external components.
Oscillator + Software-Controlled PLL	Configurable PLL multiplier (×4 to ×25) and postscaler (/1 to /32) - enables precise clock tree tuning for McASP sample rates (44.1 kHz, 48 kHz, 96 kHz) and EMIF timing alignment.
PowerPAD Thermal Package (GDH)	Exposed thermal pad on PBGA underside - lowers junction-to-board thermal resistance to ≤12 °C/W, enabling sustained 250-MHz operation in fanless audio DSP modules.

Applications

Professional Audio Mixer	Studio Effects Processor
Use Scenario: Real-time mixing of 32-channel analog/digital inputs with dynamic EQ, compression, and reverb in live sound reinforcement systems. IC Role / Device Role / Timing Role: Primary audio compute engine executing multi-threaded DSP kernels; McASP0/McASP1 handle input/output I²S streams; RTI synchronizes to word clock. Use Value: 250-MHz C67x+ core delivers >100 dB SNR processing headroom; 256 KB RAM hosts multiple overlapping filter banks; UHPI enables host MCU to update mix parameters without interrupting audio flow.	Use Scenario: Standalone guitar/bass multi-effects unit with amp modeling, delay, modulation, and cabinet simulation. IC Role / Device Role / Timing Role: Real-time audio signal processor with deterministic latency; McASP2 in DIT mode outputs S/PDIF to powered monitors; SPI1 configures external DAC/ADC. Use Value: Native double-precision floating-point ensures accurate modeling of nonlinear tube stages; 32 KB program cache minimizes instruction stalls during rapid parameter sweeps; PowerPAD package sustains thermal stability during extended stage use.
Audio Broadcast Encoder	Medical Ultrasound Beamformer
Use Scenario: AES67-compliant IP audio encoder for broadcast studios transmitting uncompressed PCM over Ethernet. IC Role / Device Role / Timing Role: High-throughput audio preprocessor; McASP0 receives AES3/I²S; EMIF streams PCM to Ethernet MAC via external PHY; UHPI handles network stack control. Use Value: 32-bit EMIF supports 133-MHz SDRAM for large ping-pong buffers; dual I²C ports configure CODEC and network controller; deterministic crossbar ensures jitter-free audio packetization.	Use Scenario: Portable ultrasound device performing real-time beamforming and Doppler processing on 128-channel echo data. IC Role / Device Role / Timing Role: Signal processing accelerator; dMAX moves raw ADC data from McASP0 into RAM; C67x+ executes FIR-based delay-and-sum algorithms with sub-sample precision. Use Value: 64 general-purpose registers enable deep loop pipelining for 128-tap filters; 384 KB ROM contains optimized math libraries; 1.2-V core reduces power in battery-powered handheld units.

Professional Audio Mixer

Studio Effects Processor

Use Scenario: Real-time mixing of 32-channel analog/digital inputs with dynamic EQ, compression, and reverb in live sound reinforcement systems.

IC Role / Device Role / Timing Role: Primary audio compute engine executing multi-threaded DSP kernels; McASP0/McASP1 handle input/output I²S streams; RTI synchronizes to word clock.

Use Value: 250-MHz C67x+ core delivers >100 dB SNR processing headroom; 256 KB RAM hosts multiple overlapping filter banks; UHPI enables host MCU to update mix parameters without interrupting audio flow.

Use Scenario: Standalone guitar/bass multi-effects unit with amp modeling, delay, modulation, and cabinet simulation.

IC Role / Device Role / Timing Role: Real-time audio signal processor with deterministic latency; McASP2 in DIT mode outputs S/PDIF to powered monitors; SPI1 configures external DAC/ADC.

Use Value: Native double-precision floating-point ensures accurate modeling of nonlinear tube stages; 32 KB program cache minimizes instruction stalls during rapid parameter sweeps; PowerPAD package sustains thermal stability during extended stage use.

Audio Broadcast Encoder

Medical Ultrasound Beamformer

Use Scenario: AES67-compliant IP audio encoder for broadcast studios transmitting uncompressed PCM over Ethernet.

IC Role / Device Role / Timing Role: High-throughput audio preprocessor; McASP0 receives AES3/I²S; EMIF streams PCM to Ethernet MAC via external PHY; UHPI handles network stack control.

Use Value: 32-bit EMIF supports 133-MHz SDRAM for large ping-pong buffers; dual I²C ports configure CODEC and network controller; deterministic crossbar ensures jitter-free audio packetization.

Use Scenario: Portable ultrasound device performing real-time beamforming and Doppler processing on 128-channel echo data.

IC Role / Device Role / Timing Role: Signal processing accelerator; dMAX moves raw ADC data from McASP0 into RAM; C67x+ executes FIR-based delay-and-sum algorithms with sub-sample precision.

Use Value: 64 general-purpose registers enable deep loop pipelining for 128-tap filters; 384 KB ROM contains optimized math libraries; 1.2-V core reduces power in battery-powered handheld units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar floating-point DSP applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TMS320C6727BZDH250	ZDH suffix indicates lead-free, RoHS-compliant 256-pin PBGA with identical electrical specs and pinout; same thermal pad but different plating and moisture sensitivity level (MSL3 vs MSL4).	Preferred for medical and industrial designs requiring full RoHS compliance and higher moisture resistance during reflow.	Select ZDH for new designs targeting global regulatory compliance; GDH remains viable for legacy production with existing qualification.
TMS320C6726BGDHA266	Lower-cost variant with 266-MHz CPU, 16-bit EMIF, no UHPI, and reduced McASP count (McASP0/McASP1 only); shares same GDH package and 256 KB RAM/384 KB ROM.	Suitable for cost-sensitive audio endpoints (e.g., USB DACs, Bluetooth speakers) where host control is via SPI/I²C and SDRAM bandwidth is not required.	Choose GDHA266 when UHPI and McASP2/DIT are unnecessary and 133-MHz SDRAM interface is not needed.

Compared with TMSDC6727BGDHA250, the ZDH variant offers identical functionality with stricter environmental compliance, while the C6726BGDHA266 sacrifices UHPI, McASP2, and 32-bit EMIF to reduce BOM cost-making it suitable only for less demanding audio edge nodes.

Availability

TMSDC6727BGDHA250 is available at Aetrix Electronics and suitable for professional audio mixer development, studio effects processor manufacturing, and broadcast encoder production requiring stable component supply across long product lifecycles.

Supply support for TMSDC6727BGDHA250 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation and industrial-grade reliability.

The TMS320C672x product line was designed specifically for high-fidelity, real-time audio signal processing - delivering deterministic latency, floating-point precision, and integrated audio peripherals to replace discrete codec + FPGA solutions in pro-audio and broadcast equipment.

FAQ

What is the maximum SDRAM capacity supported by the TMSDC6727BGDHA250?

The TMSDC6727BGDHA250 supports up to 512M-bit SDRAM devices via its 32-bit EMIF operating at 133 MHz. This enables configurations such as two 256M-bit x16 SDRAM chips or one 512M-bit x32 device, providing ample buffer space for multi-channel audio streaming and real-time effects processing in the TMSDC6727BGDHA250-based system.

Does the TMSDC6727BGDHA250 include a hardware watchdog timer?

Yes, the TMSDC6727BGDHA250 integrates a digital watchdog within its Real-Time Interrupt (RTI) module. The RTI includes two 32-bit counter/prescaler pairs and four compare registers with automatic reload, and the optional watchdog function enhances system robustness in unattended audio equipment by triggering reset on software hang or timing violation in the TMSDC6727BGDHA250 firmware.

Can the TMSDC6727BGDHA250 boot directly from NAND flash?

Yes, the TMSDC6727BGDHA250 supports NAND flash boot with built-in hardware ECC for single-bit error correction across 512-byte blocks. Its EMIF configures NAND in 8- or 16-bit mode, and the on-chip ROM bootloader initializes the device and loads application code - enabling secure, field-upgradable firmware storage without external ECC controllers in TMSDC6727BGDHA250-based products.

Is the UHPI interface available on all C672x variants?

No, the 32-bit Universal Host-Port Interface (UHPI) is exclusive to the TMS320C6727B family, including the TMSDC6727BGDHA250. It is not present on C6726B, C6722B, or C6720 variants. This makes the TMSDC6727BGDHA250 the only C672x device capable of high-bandwidth parallel host-DSP communication, critical for hybrid audio systems with external ARM/FPGA controllers.

What audio formats does McASP2 support on the TMSDC6727BGDHA250?

McASP2 on the TMSDC6727BGDHA250 supports I²S, left-justified, right-justified, and time-division multiplexed (TDM) formats with up to 32 time slots. In DIT mode, it generates S/PDIF-compliant bitstreams with full 384-bit channel status and user data - enabling direct digital output to studio monitors or broadcast infrastructure without external transceivers in TMSDC6727BGDHA250 implementations.

TMSDC6727BGDHA250 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: TMS320C672x

Package/Case:: 256-BGA

Packaging:: Tray

Product Status:: Active

Type:: Floating Point

Interface:: EBI/EMI, HPI, I2C, McASP, SPI

Clock Rate:: 250MHz

Non-Volatile Memory:: ROM (384kB)

On-Chip RAM:: 288kB

Voltage - I/O:: 3.30V

Voltage - Core:: 1.20V

Operating Temperature:: -40°C ~ 105°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-BGA (17x17)

TMSDC6727BGDHA250 FAQ

1.How can I place an order for TMSDC6727BGDHA250 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMSDC6727BGDHA250 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMSDC6727BGDHA250 reliable?

The price and inventory of TMSDC6727BGDHA250 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMSDC6727BGDHA250 is usually 5 days.

3.What payment methods are accepted for TMSDC6727BGDHA250?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMSDC6727BGDHA250 transactions.

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4.How is shipping managed for TMSDC6727BGDHA250?

TMSDC6727BGDHA250 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMSDC6727BGDHA250 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMSDC6727BGDHA250?

For technical support, including TMSDC6727BGDHA250 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMSDC6727BGDHA250 requirements.

6.How does Aetrix verify that TMSDC6727BGDHA250 is sourced from the original manufacturer or authorized distributors?

All TMSDC6727BGDHA250 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMSDC6727BGDHA250 meets industry standards.

7.What is the process for return or replacement of TMSDC6727BGDHA250?

All TMSDC6727BGDHA250 units undergo pre-shipment inspection (PSI). If there is an issue with TMSDC6727BGDHA250, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMSDC6727BGDHA250 part is unused and in its original packaging.

Return procedure for TMSDC6727BGDHA250:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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