Texas Instruments TMX320C6472CZTZ

Overview

TMX320C6472CZTZ from Texas Instruments is a fixed-point digital signal processor (DSP) featuring six independent C64x+ megamodules operating at 500 MHz, 625 MHz, or 700 MHz. It integrates 768 KB of shared L2 SRAM, dual IEEE 802.3-compliant 10/100/1000-Mb/s Ethernet MACs (EMAC0 and EMAC1), and a 32-bit DDR2-533 SDRAM controller. It targets high-end telecom infrastructure, media gateways, and remote access servers requiring deterministic real-time signal processing with on-chip memory consolidation.

For engineers reviewing the TMX320C6472CZTZ datasheet, TMX320C6472CZTZ pinout, TMX320C6472CZTZ application, or TMX320C6472CZTZ equivalent, key selection criteria include multi-core fixed-point throughput (4000 MMACS @ 500 MHz), dual EMAC interface flexibility (MII/RMII/GMII/RGMII/SS-SMII), UTOPIA Level 2 slave support, Serial RapidIO v1.2 compliance, and 737-pin ZTZ BGA package thermal and routing constraints.

Technical Context

The TMX320C6472CZTZ implements six identical C64x+ megamodules, each with an eight-functional-unit VLIW core, 32 KB L1P (direct-mapped) and 32 KB L1D (2-way set-associative) memory, and private 608 KB L2 SRAM. All six megamodules share a unified 768 KB SL2 SRAM and a centralized switch fabric for inter-core communication.

System-level peripherals include two independent EMACs sharing one MDIO interface, three TSIP ports (8 links × 8 Mbps), a 16-bit HPI, I²C bus, 16 GPIO pins, six dedicated + six shared 64-bit timers, and three PLLs-PLL1 for system clock, PLL2 for EMAC, and PLL3 for DDR2 controller-enabling precise domain-specific clock management.

Key Specifications

Pinout & Package

TMX320C6472CZTZ uses a 737-pin flip-chip plastic BGA (ZTZ) package with 0.8-mm ball pitch and 24 mm × 24 mm footprint. Thermal and mechanical data are specified in TI SPRS612D Section 8.2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-core fixed-point DSP applications.

Compared with TMS320C6474CZTZ, TMX320C6472CZTZ trades one EMAC and 768 KB less L2 for lower power and cost in dual-network deployments; versus TMS320C6678ACYPA, it offers proven fixed-point determinism and smaller footprint but lacks floating-point capability and DDR3 bandwidth.

Availability

TMX320C6472CZTZ is available at Aetrix Electronics and suitable for telecom infrastructure, media gateway design, and industrial video analytics requiring stable component supply across long product lifecycles.

Supply support for TMX320C6472CZTZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of DSP innovation rooted in the TMS320 platform.

The TMS320C6472 belongs to TI's C6000™ fixed-point DSP family, engineered for high-throughput, low-latency signal processing in telecom, media, and industrial edge systems where deterministic real-time performance and memory integration are critical.

FAQ

What is the maximum operating frequency of the TMX320C6472CZTZ?

The TMX320C6472CZTZ is offered in three speed grades: 500 MHz, 625 MHz, and 700 MHz. The specific frequency for a given TMX320C6472CZTZ unit depends on its speed binning and is marked on the device package. At 500 MHz, it delivers 4000 MMACS (16-bit); at 700 MHz, peak throughput reaches 5600 MMACS. Core voltage scales accordingly: 1.0 V (500 MHz), 1.1 V (625 MHz), 1.2 V (700 MHz).

Does the TMX320C6472CZTZ support boot from external memory?

Yes, the TMX320C6472CZTZ supports multiple boot modes including HPI boot, EMAC boot, and boot from external parallel NOR/NAND flash via the EMIF. Its integrated boot ROM contains configurable boot loader firmware that initializes PLLs, memory controllers, and peripherals before loading application code. Boot configuration is controlled by strapping pins (BOOTMODE[3:0]) sampled at reset.

How many Ethernet MAC interfaces does the TMX320C6472CZTZ integrate?

The TMX320C6472CZTZ integrates two fully independent 10/100/1000-Mb/s Ethernet MACs (EMAC0 and EMAC1), both compliant with IEEE 802.3. EMAC0 supports MII, RMII, SS-SMII, GMII, and RGMII; EMAC1 supports RMII, SS-SMII, and RGMII. Both share a single MDIO interface for PHY management, reducing pin count while maintaining full dual-port functionality.

What is the memory architecture of the TMX320C6472CZTZ?

The TMX320C6472CZTZ features a hierarchical memory architecture: six C64x+ megamodules each with 32 KB L1P (direct-mapped), 32 KB L1D (2-way set-associative), and 608 KB private L2 SRAM; plus 768 KB shared SL2 SRAM accessible by all cores. All memory blocks are configurable as SRAM or cache. The device also includes a 32-bit DDR2-533 SDRAM controller supporting up to 256 MB × 2 address space.

Is the TMX320C6472CZTZ pin-compatible with other C647x devices?

Yes, the TMX320C6472CZTZ is pin-compatible with the TMS320C6472CZTZ and TMS320C6474CZTZ within the ZTZ BGA package family. All share identical 737-pin layout, ball pitch (0.8 mm), and mechanical footprint (24 mm × 24 mm), enabling drop-in replacement between speed grades and feature variants (e.g., dual vs. triple EMAC) without PCB redesign.