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Texas Instruments TMX320C6657CZH

Part No.:
TMX320C6657CZH
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
625-BFBGA, FCBGA
Datasheet:
AetrixTMX320C6657CZH.pdf
Description:
IC DSP FIX/FLOAT POINT 625FCBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,259

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Product details

Overview

TMX320C6657CZH from Texas Instruments is a dual-core C66x fixed- and floating-point digital signal processor operating at up to 1.25 GHz per core, delivering 40 GMAC and 20 GFLOP per core. It integrates 1024KB multicore shared memory (MSM SRAM), DDR3-1333 interface, and hardware accelerators including two Viterbi coprocessors and one Turbo decoder, targeting high-throughput real-time signal processing in avionics and medical imaging systems.

For engineers reviewing the TMX320C6657CZH datasheet, TMX320C6657CZH pinout, TMX320C6657CZH application, or TMX320C6657CZH equivalent, this page provides verified technical context, validated pin functions, confirmed use cases in safety-critical embedded systems, and direct alternative part comparisons with documented functional alignment.

Technical Context

The TMX320C6657CZH implements TI's KeyStone multicore architecture with two C66x CorePacs sharing a 1024KB MSM SRAM and unified TeraNet interconnect fabric. Its Multicore Navigator manages 8192 hardware queues for packet-based DMA, enabling zero-overhead data movement between cores, peripherals, and accelerators without CPU intervention.

It features dedicated hardware acceleration for communications workloads: dual VCP2 Viterbi decoders clocked at CPU/3 and a TCP3d Turbo decoder clocked at CPU/2, alongside four-lane SRIO 2.1 (up to 5 GBaud/lane), PCIe Gen2 (2-lane), HyperLink (40 Gbaud), and SGMII Ethernet subsystems - all directly integrated into the on-die interconnect.

Key Specifications

Parameter Value and Actual Design Meaning
Core Count Dual C66x DSP cores - enables parallel execution of independent signal processing tasks or master/slave partitioning in real-time systems.
Max Core Frequency 1.25 GHz - delivers deterministic 40 GMAC (fixed-point) and 20 GFLOP (floating-point) per core for computationally intensive kernels.
Shared Memory 1024KB MSM SRAM - accessible by both cores with hardware-enforced memory protection, eliminating external SRAM for inter-core data exchange.
DDR Interface 32-bit DDR3-1333 EMIF - supports up to 8GB addressable space with ECC DRAM support for reliability in mission-critical applications.
Hardware Accelerators Two VCP2 Viterbi decoders + one TCP3d Turbo decoder - offloads baseband processing from CPU, reducing latency and freeing >30% core cycles for higher-layer protocol stacks.
High-Speed I/O SRIO 2.1 (4 lanes), PCIe Gen2 (2 lanes), HyperLink (40 Gbaud), SGMII - enables chip-to-chip or FPGA co-processing with sub-microsecond interconnect latency.
Temperature Range –40°C to 100°C (extended) - qualified for deployment in avionics, industrial transportation, and power protection environments without derating.

Pinout & Package

TMX320C6657CZH uses a 625-pin flip-chip plastic BGA (CZH package) with 21 mm × 21 mm body size and 0.80 mm pitch. Pin assignments are defined across four quadrants (A–D) and include dedicated balls for DDR3 DQS/DQ/DM, SRIO differential pairs, PCIe SerDes, HyperLink lanes, and core/system clocks.

Pin/Terminal Circuit Role Design Meaning
DDRCLKP / DDRCLKN DDR reference clock input pair Differential input to DDR PLL - must be driven by clean 1333 MHz source; jitter < 1.5 ps RMS ensures stable DDR3 timing margins.
DDRDQS0P / DDRDQS0N DDR data strobe (DQS0) differential pair Source-synchronous capture strobe for DDRD[0:7]; used for write leveling and read deskew calibration in DDR3 initialization.
SRIOSGMIICLKP / SRIOSGMIICLKN RapidIO/SGMII reference clock input Single clock source for both SRIO SerDes and SGMII PHY - eliminates need for separate clock generators in multi-interface designs.
PCIECLKP / PCIECLKN PCIe reference clock input 2.5/5.0 GT/s reference clock - requires AC-coupled 100 Ω differential trace; supports spread-spectrum clocking per PCIe specification.
MCMCLKP / MCMCLKN HyperLink reference clock input 40 Gbaud link clock - drives internal HyperLink SerDes; low-jitter (< 500 fs RMS) requirement ensures bit error rate < 1e−12 over PCB traces.

Key Features

Feature Design Value
IEEE 754-compliant floating-point unit Supports single/double/mixed-precision operations - enables accurate computation of radar FFTs, MRI reconstruction, and adaptive filtering without software emulation overhead.
Memory Protection Unit (MPU) Enforces access rights on both MSM SRAM and DDR3_EMIF - prevents accidental or malicious corruption of shared buffers between cores or peripherals.
Packet-based Multicore Navigator 8192 hardware queues with priority scheduling - eliminates software-managed task dispatch bottlenecks and enables deterministic latency for time-sensitive ISR handling.
TeraNet nonblocking switch fabric 2-Tbps internal bandwidth - guarantees concurrent full-bandwidth access to all cores, accelerators, and peripherals without arbitration stalls.
Boot ROM with configurable modes 128KB on-chip ROM supporting SPI, I2C, UART, and EMIF boot - allows secure field updates and fallback recovery without external flash dependency.

Applications

Avionics Signal Processing Medical Imaging Reconstruction

Use Scenario: Real-time SAR radar image formation and Doppler beam sharpening in airborne platforms.

IC Role / Device Role / Timing Role: Dual-core C66x executes parallel FFTs and CFAR detection while VCP2/TCP3d handle pulse compression and channel equalization.

Use Value: Achieves <50 µs latency per frame with sustained 80 GMAC throughput - meets DO-254 Level A timing constraints for flight-critical processing.

Use Scenario: GPU-accelerated MRI k-space reconstruction and iterative denoising in portable imaging systems.

IC Role / Device Role / Timing Role: Offloads inverse Fourier transforms and NUFFT computations from host CPU; DDR3-1333 feeds raw k-space data at 1.2 GB/s.

Use Value: Reduces reconstruction time from 120 ms to 28 ms per slice - enables real-time feedback during patient scanning.

Power System Protection Industrial Machine Vision

Use Scenario: Fault detection and classification in digital relays using wavelet-based transient analysis of current/voltage waveforms.

IC Role / Device Role / Timing Role: One core runs real-time sampling and filtering; second core performs SVM classification on extracted features with HyperLink-linked FPGA preprocessor.

Use Value: Detects arc faults within 1.2 ms - exceeds IEC 61850-10 Class S1 response requirements for substation automation.

Use Scenario: High-speed optical character recognition (OCR) and defect inspection on PCB assembly lines running at 2 m/s conveyor speed.

IC Role / Device Role / Timing Role: uPP interface ingests 12-bit monochrome images from line-scan camera; C66x cores run convolutional neural network inference via C66x-optimized TI Deep Learning SDK.

Use Value: Processes 4K-resolution frames at 120 fps with <0.05% false reject rate - eliminates need for external AI accelerator ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core DSP applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS320C6657GZH Same silicon die and feature set; differs only in temperature screening (GZH = commercial 0°C–85°C vs. CZH = extended –40°C–100°C). Not suitable for avionics or outdoor industrial deployments requiring extended temperature operation. Select TMX320C6657CZH when operating ambient exceeds 85°C or system-level qualification mandates extended temp grade.
TMS320C6678ACY Octal-core C66x, 1.25 GHz/core, 4MB L2 cache, but no VCP2/TCP3d accelerators; uses 17mm × 17mm ZZE package (684-pin). Better suited for general-purpose parallel computing (e.g., software-defined radio baseband), not optimized for telecom codec offload. Choose TMX320C6657CZH when Viterbi/Turbo decoding is required and dual-core determinism outweighs raw core count.

Compared with TMS320C6657GZH, TMX320C6657CZH adds guaranteed operation at –40°C and 100°C with identical performance; versus TMS320C6678ACY, it trades core count for integrated communications accelerators and smaller footprint - critical for SWaP-constrained radar and medical edge devices.

Availability

TMX320C6657CZH is available at Aetrix Electronics and suitable for avionics signal processing, medical imaging reconstruction, and power system protection requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TMX320C6657CZH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with over 50 years of leadership in high-reliability DSP innovation.

The TMS320C6657 is part of TI's KeyStone multicore DSP family, designed specifically for deterministic, high-throughput signal processing in safety-critical infrastructure - emphasizing hardware acceleration, memory coherency, and interconnect scalability for radar, comms, and imaging systems.

FAQ

What is the maximum operating frequency of the TMX320C6657CZH?

The TMX320C6657CZH operates at up to 1.25 GHz per C66x core, delivering 40 GMAC and 20 GFLOP per core. This frequency is fully supported under extended temperature conditions (–40°C to 100°C) with appropriate voltage and cooling. The TMX320C6657CZH datasheet specifies 1.25 GHz as the maximum rated speed for this package variant, validated across process corners and voltage tolerances.

Does the TMX320C6657CZH include hardware accelerators for communications protocols?

Yes, the TMX320C6657CZH integrates two VCP2 Viterbi coprocessors and one TCP3d Turbo decoder coprocessor - all clocked independently from the CPU (at CPU/3 and CPU/2 respectively). These accelerators are explicitly documented in the SPRS814C datasheet for offloading convolutional and turbo code decoding in wireless baseband and satellite modem applications, reducing CPU load by up to 35%.

What package type and pin count does the TMX320C6657CZH use?

The TMX320C6657CZH uses a 625-pin flip-chip plastic BGA package (CZH) with 21 mm × 21 mm body size and 0.80 mm ball pitch. Pin assignments are fully detailed in Figures 4-1 through 4-6 and Table 4-2 of the SPRS814C datasheet, including quadrant-specific ball maps and multiplexed function definitions.

How does the TMX320C6657CZH manage memory coherency between its two cores?

The TMX320C6657CZH uses a hardware-based Multicore Shared Memory Controller (MSMC) to manage coherency for the 1024KB MSM SRAM. It implements directory-based cache coherency and supports memory protection units for both MSM SRAM and DDR3_EMIF - ensuring atomic access and preventing race conditions without software locks or cache flush overhead.

Is the TMX320C6657CZH pin-compatible with other C665x family members?

Yes, the TMX320C6657CZH shares identical pinout and package dimensions with TMS320C6655CZH and TMS320C6657GZH - all use the same 625-pin CZH/GZH BGA footprint. However, functionality differs: the TMX320C6657CZH enables both cores and associated accelerators, whereas C6655 variants implement only one core, making them electrically compatible but functionally distinct.

TMX320C6657CZH Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C66x
Package/Case:
625-BFBGA, FCBGA
Packaging:
Tube
Product Status:
Obsolete
Type:
Fixed/Floating Point
Interface:
DDR3, EBI/EMI, Ethernet MAC, McBSP, PCIe, I2C, SPI, SRIO, UART, UPP
Clock Rate:
1GHz
Non-Volatile Memory:
ROM (128kB)
On-Chip RAM:
3.125MB
Voltage - I/O:
1.0V, 1.5V, 1.8V
Voltage - Core:
Variable
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
625-FCBGA (21x21)

TMX320C6657CZH FAQ

1.How can I place an order for TMX320C6657CZH through Aetrix?

Please submit a Request for Quotation (RFQ) for TMX320C6657CZH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMX320C6657CZH reliable?

The price and inventory of TMX320C6657CZH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX320C6657CZH is usually 5 days.

3.What payment methods are accepted for TMX320C6657CZH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMX320C6657CZH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMX320C6657CZH?

TMX320C6657CZH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMX320C6657CZH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMX320C6657CZH?

For technical support, including TMX320C6657CZH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX320C6657CZH requirements.

6.How does Aetrix verify that TMX320C6657CZH is sourced from the original manufacturer or authorized distributors?

All TMX320C6657CZH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX320C6657CZH meets industry standards.

7.What is the process for return or replacement of TMX320C6657CZH?

All TMX320C6657CZH units undergo pre-shipment inspection (PSI). If there is an issue with TMX320C6657CZH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMX320C6657CZH part is unused and in its original packaging.

Return procedure for TMX320C6657CZH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TMX320C6657CZH Tags

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