Texas Instruments TMX320C6678CYP
- Part No.:
- TMX320C6678CYP
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 841-BFBGA, FCBGA
- Datasheet:
-
TMX320C6678CYP.pdf
- Description:
- IC DSP FIX/FLOAT POINT 841FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,961
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS320C6678CYP from Texas Instruments is an eight-core fixed- and floating-point digital signal processor based on the KeyStone multicore architecture, operating at up to 1.4 GHz per core with 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core (floating-point). It integrates 4 MB shared MSM SRAM, 64-bit DDR3-1600 interface, and hardware accelerators for packet processing and security. It serves in high-throughput telecom infrastructure baseband processing and real-time media analytics.
For engineers reviewing the TMS320C6678CYP datasheet, TMS320C6678CYP pinout, TMS320C6678CYP application, or TMS320C6678CYP equivalent, key selection criteria include per-core computational throughput, integrated network coprocessor support for IPsec/GTP-U/PDCP, MSM memory coherency model, and HyperLink interconnect compatibility with other KeyStone devices.
Technical Context
The TMS320C6678CYP implements eight independent C66x CorePacs, each with dual 32KB L1P/L1D caches and 512KB configurable L2 memory, all backed by a unified 4MB MSM SRAM managed by the Multicore Shared Memory Controller (MSMC) with memory protection for both MSM and DDR3. Its TeraNet non-blocking switch fabric enables concurrent access to cores, accelerators, and peripherals without contention.
Hardware acceleration is distributed across three domains: the Multicore Navigator manages 8192 queues and zero-overhead packet DMA; the Network Coprocessor offloads transport-layer (IPsec, GTP-U, SCTP) and security-layer (AES, SHA-2, HMAC, GCM) functions; and the Gigabit Ethernet Switch Subsystem supports two SGMII ports with full 1Gbps wire-speed switching and L2–L4 classification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | Eight C66x DSP cores, each capable of simultaneous fixed- and floating-point execution; enables parallel signal processing pipelines for radar, beamforming, or multi-channel baseband. |
| Max Core Frequency | 1.4 GHz - delivers 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core; enables real-time 4K video encoding or LTE-A 128-antenna MIMO baseband. |
| On-Chip Memory | 32 KB L1P + 32 KB L1D + 512 KB L2 per core, plus 4096 KB MSM SRAM - provides low-latency scratchpad and shared buffer space without DDR3 access penalty. |
| DDR3 Interface | 64-bit DDR3-1600 with ECC support - sustains >12.8 GB/s peak bandwidth and ensures data integrity in mission-critical telecom control plane applications. |
| Network Coprocessor | Packet Accelerator + Security Accelerator - processes 1.5 M packets/s with L2–L4 classification, checksum, QoS, and up to 2.8 Gbps encryption (AES-GCM, SHA-256). |
| Interconnects | Four-lane SRIO 2.1 (5 GBaud), PCIe Gen2 x2, HyperLink (50 Gbaud full-duplex), two SGMII - enables scalable system integration with FPGAs, ASICs, or companion processors. |
| Temperature Range | –40°C to 100°C (extended) - qualified for deployment in outdoor macrocell base stations and industrial edge compute enclosures. |
Pinout & Package
The TMS320C6678CYP is housed in an 841-pin FC-BGA package (19 mm × 19 mm, 0.8 mm pitch) with thermal lid, designed for high-power dissipation in dense telecom modules. Pin mapping follows quadrant-based layout (A–D) as defined in SPRS691E Figure 2-11 through 2-16.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN_0 / CLKIN_1 | Main PLL reference input | Differential 100 MHz crystal or LVDS clock source; required for boot and system timing synchronization across all cores and peripherals. |
| DDR3_DQ[63:0] | DDR3 data bus | 64-bit bidirectional data interface with on-die termination; supports DDR3-1600 (800 MHz) with 8G-byte addressable space and ECC capability. |
| SRIO_LANE[3:0]_TX/RX | Serial RapidIO physical layer | Four independent differential lanes supporting 1.24/2.5/3.125/5 GBaud; enables chip-to-chip interconnect with deterministic latency for distributed signal processing. |
| HYPERLINK_TX/RX | HyperLink high-speed interconnect | Full-duplex 50-Gbaud differential pair; allows transparent resource sharing and task dispatching across multiple KeyStone SoCs without software intervention. |
| SGMII_CLK / SGMII_RX/TX | Gigabit Ethernet PHY interface | Differential 125 MHz reference and data lanes for two independent SGMII ports; enables integrated Layer 2 switching without external MAC/PHY. |
| TSIP_CLK / TSIP_DATA[15:0] | Telecom Serial Interface Port | Supports 1024 DS0 channels per port at 32.768 Mbps (2-lane mode); used for TDM backhaul in wireless infrastructure and voice gateways. |
Key Features
| Feature | Design Value |
|---|---|
| Backward Code Compatibility | Fully compatible with TI C6000 family assembly and C code - eliminates rewrites when migrating legacy C64x+/C67x applications to higher performance. |
| Multicore Navigator | 8192-hardware queue manager with packet-based DMA - enables lock-free, zero-copy data movement between cores, accelerators, and I/O without CPU overhead. |
| MSMC Memory Protection | Programmable MPU for MSM SRAM and DDR3_EMIF - enforces memory isolation between firmware partitions, critical for secure multi-tenant baseband stacks. |
| SmartReflex Power Management | Dynamic voltage and frequency scaling per power domain - reduces active power by up to 30% during partial-load operation in bursty traffic scenarios. |
| IEEE 754 Compliance | Full single-precision floating-point compliance with fused multiply-add - guarantees numerical reproducibility in scientific computing and radar signal chains. |
Applications
| Wireless Baseband Processing | Media Transcoding Server |
|---|---|
|
Use Scenario: Real-time LTE-Advanced and 5G NR physical layer processing in macrocell and small-cell base stations. IC Role / Device Role / Timing Role: Primary baseband processor executing FFT, channel estimation, precoding, and LDPC decoding across eight parallel cores with deterministic latency. Use Value: Delivers 11.2 GHz aggregate DSP performance and integrated packet accelerator to handle control-plane signaling and user-plane data in a single SoC. |
Use Scenario: High-density video transcoding for cloud-based streaming services, converting 4K HEVC to adaptive bitrate HLS/DASH streams. IC Role / Device Role / Timing Role: Offloads compute-intensive motion estimation, transform, and quantization kernels from host CPU using optimized C66x intrinsics and EDMA3 pipelining. Use Value: Achieves >120 fps 4K→1080p transcoding per device with hardware-accelerated H.264/H.265 encode/decode and DDR3 bandwidth-optimized memory access. |
| Radar Signal Processing | Industrial Edge Analytics |
|
Use Scenario: Phased-array radar systems requiring real-time beamforming, CFAR detection, and Doppler FFT on multi-channel RF data. IC Role / Device Role / Timing Role: Dedicated C66x cores assigned to range-Doppler processing, while MSM SRAM buffers raw ADC samples and stores beamformed outputs. Use Value: Leverages 512KB per-core L2 and 4MB MSM for low-latency, cache-coherent access to large FFT buffers and coefficient tables without DDR3 bottlenecks. |
Use Scenario: Predictive maintenance gateway aggregating vibration, temperature, and current sensor data from factory-floor machinery. IC Role / Device Role / Timing Role: Runs time-series anomaly detection (STFT, wavelet transforms) and lightweight neural inference models on edge-collected telemetry. Use Value: Combines floating-point precision, hardware accelerators for cryptographic signing of sensor data, and TSIP/UART for legacy PLC connectivity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6670AYZ | Quad-core variant (no MSM SRAM, no Network Coprocessor, no HyperLink); 1.2 GHz max; 16-bit EMIF only. | Suitable for cost-sensitive, lower-throughput embedded vision or motor control where packet acceleration is unnecessary. | Select when system-level bandwidth, security offload, or inter-SoC scalability are not required - reduces BOM and thermal complexity. |
| TI AM5728 | ARM Cortex-A15 + C66x dual-core heterogenous SoC; includes GPU, PRU-ICSS, and Linux support; no MSM SRAM or packet accelerator. | Targeted at HMI-rich industrial gateways and robotics controllers needing OS services, GUI, and real-time DSP co-processing. | Choose when application requires general-purpose OS execution alongside DSP tasks - trades raw DSP throughput for broader software ecosystem and peripheral integration. |
Compared with TMS320C6678CYP, the C6670 offers reduced core count and no hardware networking acceleration, making it suitable for simpler deterministic workloads; the AM5728 shifts emphasis toward heterogeneous compute and OS readiness rather than pure DSP throughput or telecom-specific acceleration.
Availability
TMS320C6678CYP is available at Aetrix Electronics and suitable for wireless infrastructure, radar systems, and industrial edge analytics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-critical deployments.
Supply support for TMS320C6678CYP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation and industrial-grade reliability.
The TMS320C6678CYP belongs to TI's KeyStone multicore DSP product line, engineered specifically for high-performance, deterministic signal processing in communications infrastructure, defense electronics, and real-time analytics where throughput, latency, and hardware acceleration are critical.
FAQ
What is the maximum operating frequency of the TMS320C6678CYP core?
The TMS320C6678CYP supports a maximum core frequency of 1.4 GHz per C66x DSP core, delivering 44.8 GMAC/core for fixed-point operations and 22.4 GFLOP/core for single-precision floating-point. This rating is validated under extended temperature conditions (–40°C to 100°C) with appropriate thermal management and power delivery per SPRS691E Section 6.2.
Does the TMS320C6678CYP include integrated memory protection?
Yes, the TMS320C6678CYP includes a Memory Protection Unit (MPU) within the Multicore Shared Memory Controller (MSMC) that enforces access rights for both the 4 MB MSM SRAM and the external DDR3-1600 interface. This feature is essential for partitioning firmware components in safety-certifiable telecom baseband stacks.
What interfaces does the TMS320C6678CYP provide for connecting to external FPGAs?
The TMS320C6678CYP supports high-bandwidth FPGA interfacing via four primary interfaces: HyperLink (50 Gbaud full-duplex), SRIO 2.1 (up to 5 GBaud per lane), PCIe Gen2 x2, and 16-bit EMIF. HyperLink is preferred for ultra-low-latency, cache-coherent resource sharing, while SRIO suits deterministic packet-based communication.
Is the TMS320C6678CYP pin-compatible with other C66x-family devices?
No, the TMS320C6678CYP is not pin-compatible with other C66x-family members such as the C6670 or C6657 due to differences in package size (841-pin vs. 684-pin), I/O count, and signal assignment. Migration requires PCB redesign; however, software is backward-compatible across the C6000 family.
What development tools are supported for the TMS320C6678CYP?
Texas Instruments provides a complete toolchain for the TMS320C6678CYP, including the C6000 Code Generation Tools (C compiler, assembler, linker), Code Composer Studio IDE with multicore debug and trace, and the C66x Optimizing Compiler with auto-vectorization. Evaluation modules (TMDXEVM6678L) and SYS/BIOS RTOS are also fully supported.
TMX320C6678CYP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 841-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, I2C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 8.5MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- Variable
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FCBGA (24x24)
TMX320C6678CYP FAQ
1.How can I place an order for TMX320C6678CYP through Aetrix?
Please submit a Request for Quotation (RFQ) for TMX320C6678CYP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMX320C6678CYP reliable?
The price and inventory of TMX320C6678CYP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX320C6678CYP is usually 5 days.
3.What payment methods are accepted for TMX320C6678CYP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMX320C6678CYP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMX320C6678CYP?
TMX320C6678CYP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMX320C6678CYP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMX320C6678CYP?
For technical support, including TMX320C6678CYP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX320C6678CYP requirements.
6.How does Aetrix verify that TMX320C6678CYP is sourced from the original manufacturer or authorized distributors?
All TMX320C6678CYP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX320C6678CYP meets industry standards.
7.What is the process for return or replacement of TMX320C6678CYP?
All TMX320C6678CYP units undergo pre-shipment inspection (PSI). If there is an issue with TMX320C6678CYP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMX320C6678CYP part is unused and in its original packaging.
Return procedure for TMX320C6678CYP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMX320C6678CYP Tags
-
TMS320C5535AZAY10
Texas Instruments

-
TMS320VC5501PGF300
Texas Instruments

-
ADSP-BF592KCPZ
Analog Devices Inc.

-
ADAU1463WBCPZ150
Analog Devices Inc.

-
TMS320VC5402PGE100
Texas Instruments

-
ADAU1701JSTZ-RL
Analog Devices Inc.

-
ADAU1701JSTZ
Analog Devices Inc.

-
TMS320VC5502PGF300
Texas Instruments

-
ADAU1462WBCPZ300RL
Analog Devices Inc.

-
ADAU1452KCPZRL
Analog Devices Inc.

-
ADAU1452WBCPZ-RL
Analog Devices Inc.

-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
