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Texas Instruments TMX5700714APZQQ1

Part No.:
TMX5700714APZQQ1
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixTMX5700714APZQQ1.pdf
Description:
IC MCU 32BIT 768KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,034

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Product details

Overview

TMX5700714APZQQ1 from Texas Instruments is a safety-certified 32-bit ARM Cortex-R4F microcontroller for automotive ASIL-D and industrial SIL-3 applications, featuring dual lockstep CPUs, 768KB flash with ECC, 128KB RAM with ECC, 160-MHz operation, and integrated functional safety diagnostics including BIST, voltage/clock monitoring, and error signaling via nERROR pin - deployed in electric power steering and braking systems.

For engineers reviewing the TMX5700714APZQQ1 datasheet, TMX5700714APZQQ1 pinout, TMX5700714APZQQ1 application, or TMX5700714APZQQ1 equivalent, this page delivers verified technical context, real-world timing/peripheral constraints, safety architecture details, and validated alternative options for ISO 26262-compliant system design.

Technical Context

The TMX5700714APZQQ1 implements a dual-core lockstep execution architecture with hardware-enforced instruction-level redundancy, where both Cortex-R4F cores execute identical code streams and compare results at each stage to detect transient or permanent faults. Its FMPLL generates internal clocks up to 160 MHz while supporting frequency modulation and slip detection for robust clock domain integrity.

Functional safety is enforced through dedicated modules: Error Signaling Module (ESM) asserts nERROR on fault detection; Built-In Self-Test (BIST) validates CPU logic and SRAM contents at startup and runtime; ECC protects all flash and RAM accesses; and parity safeguards peripheral memories including MibADC buffers, N2HET instruction RAM, and DCAN mailboxes.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreARM Cortex-R4F, 1.66 DMIPS/MHz, supports BE32 word-invariant big-endian mode
Max Clock Frequency160 MHz system clock - enables deterministic real-time control with ≤6.25 ns instruction cycle time
Flash Memory768 KB with ECC - provides nonvolatile program storage with single-bit correction/double-bit detection for ASIL-D compliance
RAM128 KB SRAM with ECC - supports safe data buffering and stack operations in safety-critical contexts
Analog-to-Digital ConverterTwo 12-bit MibADCs: ADC1 with 24 channels, ADC2 with 16 channels, 16 shared inputs, 64-word parity-protected result buffers each
Communication InterfacesThree DCAN controllers (CAN 2.0A/B, 1 Mbps), two SCI/LIN interfaces, one I2C (100/400 kbps), three MibSPIs (64-word parity-protected RAM each)
Safety FeaturesDual lockstep CPUs, CPU/RAM BIST, ESM with nERROR pin, voltage/clock monitors, CRC modules, and loopback-capable peripheral I/O

Pinout & Package

TMX5700714APZQQ1 is packaged in a 100-pin LQFP (PZ package), 14.0 mm × 14.0 mm body size, green RoHS-compliant finish, with 45 general-purpose I/O pins (9 interrupt-capable), dual supply domains (VCC = 1.14–1.32 V core, VCCIO = 3.0–3.6 V I/O), and Kelvin ground for precision analog reference stability.

Pin/Terminal Circuit Role Design Meaning
nPORRSTPower-on Reset InputActive-low asynchronous reset asserted during power ramp; disables I/O buffers and places outputs in high-impedance state until release
nRSTWarm Reset InputActive-low synchronous reset that initiates controlled CPU restart without power cycle; retains register states per reset vector
nERRORError Signaling OutputOpen-drain active-low signal driven by ESM to indicate detected fault (e.g., ECC double-bit error, BIST failure, clock monitor violation)
ECLKExternal Clock Monitor OutputProgrammable low-frequency output derived from VCLK - used externally to verify device clocking health and operational frequency
ADREFHI / ADREFLOADC Reference InputsDifferential analog reference pair (shared by both MibADCs); requires Kelvin-connected VCCAD/VSSAD for noise immunity in precision sensing
GIOA[0]–GIOA[7]General-Purpose I/O Bank A8-pin multiplexed bank supporting GIO, INT, EXTCLKIN, EPWM, or N2HET functions; configurable pullup/pulldown per pin

Key Features

Feature Design Value
Dual Lockstep Cortex-R4F CPUsHardware-synchronized execution with real-time comparison ensures fault detection latency < 1 µs for ASIL-D diagnostic coverage
N2HET Timing CoprocessorsTwo independent modules (N2HET1: 32 channels; N2HET2: 18 channels) with 160-word parity-protected instruction RAM each - offloads complex PWM, capture, and encoder timing from main CPU
ePWM + eCAP + eQEP Integration7 ePWM modules (14 outputs), 6 eCAP modules, and 2 eQEP modules enable full motor control stack (field-oriented control, position feedback, fault protection) without external ICs
DCAN with 64 MailboxesThree CAN controllers each with 64 parity-protected message buffers - supports concurrent high-priority safety messaging and lower-priority diagnostics on same bus
Memory Protection Unit (MPU)12-region MPU applied to CPU, DMA, HTU, and peripheral access paths - enforces memory isolation between safety-critical and non-critical software partitions

Applications

Electric Power Steering (EPS) Braking Systems (ABS/ESC)

Use Scenario: Real-time torque assist calculation and motor phase control under dynamic road load and temperature variation.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU validation and N2HET-driven PWM generation.

Use Value: Enables <10 µs current-loop response time using ePWM deadband and trip-zone protection synchronized to MibADC sampling - meeting ISO 26262 QM→ASIL-D decomposition requirements.

Use Scenario: Pressure modulation and wheel-speed-based intervention during emergency braking on low-friction surfaces.

IC Role / Device Role / Timing Role: Central brake actuator controller managing hydraulic valve timing, sensor fusion (wheel speed, yaw, lateral acceleration), and fail-safe fallback logic.

Use Value: Dual-core lockstep + ECC memory + DCAN mailbox prioritization ensures deterministic <5 ms brake command latency even during concurrent LIN communication and self-test execution.

Battery Management Systems (BMS) Active Driver Assistance Systems (ADAS)

Use Scenario: Cell voltage, temperature, and current monitoring across 96-cell EV battery packs with thermal runaway detection.

IC Role / Device Role / Timing Role: Safety monitor MCU interfacing to isolated analog front-ends, performing CRC-checked data aggregation, and triggering contactor disconnect via GIO-controlled relays.

Use Value: MibADC shared-channel architecture and 64-word result buffers allow synchronized sampling of 24+ cell voltages per conversion group - reducing measurement jitter to <100 ns for SoC estimation accuracy.

Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for lane-keeping and automatic emergency braking decisions.

IC Role / Device Role / Timing Role: Real-time coordination node handling time-stamped event triggers (eCAP), high-rate SPI data ingestion (MibSPI), and CAN FD–compatible message routing.

Use Value: Three DCAN controllers with independent 64-mailbox RAMs support simultaneous communication with radar ECU (CAN 2.0B), camera module (CAN FD), and vehicle network gateway - eliminating inter-CAN arbitration delays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS570LS0432PZLower performance: 80-MHz CPU, 384-KB flash, 32-KB RAM, 2 CAN, 1 N2HET, no I2CTargeted at cost-sensitive ASIL-B subsystems (e.g., seat control, HVAC) with reduced peripheral count and memory footprintSelect when functional safety scope is limited to ASIL-B and real-time peripheral demand is below 50% of TMX5700714APZQQ1 capability
SPC574K72E5Power Architecture core (e200z4), 160-MHz, 2 MB flash, 384 KB RAM, 4 CAN, 2 FlexRay, no N2HET but includes GTM timerDesigned for chassis domain controllers requiring FlexRay backbone integration and higher flash density for OTA update partitioningChoose for FlexRay-dependent architectures or when larger program storage and dual-core lockstep with GTM-based timing are required over N2HET flexibility

Compared with TMX5700714APZQQ1, TMS570LS0432PZ reduces safety coverage depth and peripheral bandwidth for cost-constrained ASIL-B nodes, while SPC574K72E5 trades N2HET programmability for FlexRay and larger memory - making TMX5700714APZQQ1 optimal for CAN-centric, N2HET-dependent EPS/brake applications demanding ASIL-D certification evidence.

Availability

TMX5700714APZQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, and battery management systems requiring stable component supply across automotive production lifecycles and industrial safety certifications.

Supply support for TMX5700714APZQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of automotive qualification experience and ISO/IEC 61508 and ISO 26262 process certification.

The TMX5700714APZQQ1 belongs to the Hercules TMS570 safety microcontroller product line, engineered specifically for ASIL-D and SIL-3 real-time control applications in automotive chassis, powertrain, and industrial automation where functional safety integrity is non-negotiable.

FAQ

What safety certifications does the TMX5700714APZQQ1 support out of the box?

The TMX5700714APZQQ1 is architected to meet ISO 26262 ASIL-D and IEC 61508 SIL-3 requirements. It includes dual lockstep CPUs, ECC-protected memory, BIST logic, ESM with nERROR pin, and clock/voltage monitors - all documented in TI's Functional Safety Manual SPNU637. No external components are required to achieve these levels when used per TI's safety manual guidelines and certified toolchain.

Does the TMX5700714APZQQ1 support CAN FD or only classical CAN?

The TMX5700714APZQQ1 integrates three DCAN controllers compliant exclusively with CAN Protocol Version 2.0A and 2.0B, supporting bit rates up to 1 Mbps. It does not implement CAN FD features such as flexible data-rate or extended data length. For CAN FD applications, designers must select alternate MCUs like the TMS570LC4357 or SPC58ECxx series.

How many N2HET channels are accessible in the PZ (100-pin) package of TMX5700714APZQQ1?

In the TMX5700714APZQQ1 PZ package, N2HET1 provides 32 programmable channels and N2HET2 provides 18 channels - totaling 50 I/O terminals. However, due to pin multiplexing and package limitations, only 21 N2HET I/O signals are physically routed to package pins (per Table 4-20 in SPNS226E), with N2HET2_PIN_nDIS on Pin 10 enabling/disabling N2HET2 functionality.

Can the TMX5700714APZQQ1 operate with a single 3.3-V supply, or does it require separate core and I/O rails?

The TMX5700714APZQQ1 requires two independent supply domains: core voltage VCC (1.14–1.32 V) and I/O voltage VCCIO (3.0–3.6 V). These must be supplied separately - the device does not support single-supply operation. The 3.3-V I/O rail powers GPIO, CAN transceivers, and ADC references, while the low-voltage core rail minimizes dynamic power consumption at 160 MHz.

Is the TMX5700714APZQQ1 pin-compatible with other TMS570LS devices in the PZ package?

The TMX5700714APZQQ1 shares the same 100-pin PZ package footprint and basic pinout with TMS570LS0432PZ, but is not fully pin-compatible due to differences in peripheral mapping: TMS570LS0432PZ lacks I2C, has only 2 CAN controllers, omits one eQEP module, and routes fewer N2HET signals. Signal-level compatibility requires verification against each device's Terminal Functions table in their respective datasheets.

TMX5700714APZQQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
100-LQFP
Series:
Hercules™ TMS570 ARM® Cortex®-R
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

TMX5700714APZQQ1 FAQ

1.How can I place an order for TMX5700714APZQQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMX5700714APZQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMX5700714APZQQ1 reliable?

The price and inventory of TMX5700714APZQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX5700714APZQQ1 is usually 5 days.

3.What payment methods are accepted for TMX5700714APZQQ1?

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TMX5700714APZQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMX5700714APZQQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMX5700714APZQQ1?

For technical support, including TMX5700714APZQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX5700714APZQQ1 requirements.

6.How does Aetrix verify that TMX5700714APZQQ1 is sourced from the original manufacturer or authorized distributors?

All TMX5700714APZQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX5700714APZQQ1 meets industry standards.

7.What is the process for return or replacement of TMX5700714APZQQ1?

All TMX5700714APZQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMX5700714APZQQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMX5700714APZQQ1 part is unused and in its original packaging.

Return procedure for TMX5700714APZQQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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