Texas Instruments TMX5700914PGEQQ1
- Part No.:
- TMX5700914PGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMX5700914PGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 1MB FLASH 144QFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,291
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Product details
Overview
TMS570LS0914PGEQQ1 from Texas Instruments is a dual-CPU lockstep ARM Cortex-R4F 32-bit safety MCU for automotive ASIL-D and IEC 61508 SIL-3 applications, operating up to 160 MHz with 1 MB flash (ECC), 128 KB RAM (ECC), and integrated diagnostics including BIST, voltage/clock monitoring, and error signaling. It delivers 265 DMIPS and supports real-time control in electric power steering and braking systems.
For engineers reviewing the TMS570LS0914PGEQQ1 datasheet, TMS570LS0914PGEQQ1 pinout, TMS570LS0914PGEQQ1 application, or TMS570LS0914PGEQQ1 equivalent, this page provides verified functional safety architecture details, validated N2HET/ePWM/ADC peripheral configurations, package-specific terminal mapping for the 144-pin LQFP (PGE), and confirmed drop-in alternatives for ISO 26262-compliant designs.
Technical Context
The TMS570LS0914PGEQQ1 implements dual ARM Cortex-R4F CPUs executing identical instructions in lockstep with continuous comparison, supported by ECC on all flash and SRAM interfaces and parity protection across peripheral memories. Its FMPLL generates system clocks up to 160 MHz, while the Global Clock Module routes six clock sources to domain-specific peripherals.
Real-time control is enabled by two N2HET coprocessors (32 + 18 channels), seven ePWM modules (14 outputs), six eCAP modules, two eQEP modules, and dual 12-bit MibADCs (24 + 16 inputs, 16 shared). All three DCAN controllers comply fully with CAN 2.0B at up to 1 Mbps and include 64 mailboxes with parity protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core lockstep, 1.66 DMIPS/MHz, 265 DMIPS @ 160 MHz |
| Memory | 1 MB flash with ECC, 128 KB RAM with ECC, 64 KB emulated EEPROM with ECC |
| Operating Voltage | VCC core: 1.14–1.32 V; VCCIO I/O: 3.0–3.6 V |
| ADC | Two 12-bit MibADCs: ADC1 (24 ch), ADC2 (16 ch), 16 shared channels, 64-word parity-protected buffers each |
| Timers & PWM | Two N2HETs (32 + 18 channels), seven ePWM modules (14 outputs), six eCAP, two eQEP |
| Communication | Three DCAN (CAN 2.0B, 64 mailboxes each), two SCI (one LIN 2.1), three MibSPI, one I2C, one SPI |
| Package | 144-pin LQFP (PGE), 20.0 mm × 20.0 mm, green RoHS-compliant |
| Safety Features | Built-in self-test (BIST) for CPU/RAM, ECC/parity protection, ESM with nERROR pin, voltage/clock monitoring |
Pinout & Package
Package: 144-pin LQFP (PGE), 20.0 mm × 20.0 mm body size, exposed pad not present, RoHS-compliant green finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (nPORRST) | Power-on reset input | Active-low asynchronous reset asserted during power ramp; initiates full device initialization sequence |
| Pins 66–69 (ADREFHI/ADREFLO/VCCAD/VSSAD) | ADC reference and supply | Dedicated analog power domain for both MibADCs; enables high-precision 12-bit conversion without digital noise coupling |
| Pins 55, 86 (AD2EVT, AD1EVT) | ADC event trigger inputs | Hardware-synchronized sampling initiation for time-critical control loops (e.g., motor current sensing aligned with PWM edges) |
| Pins 1–4, 7–10, 12–15, 17–20, 22–25, 27–30, 32–35, 37–40, 42–45, 47–50, 52–54, 56–59, 61–65, 70–72, 74–79, 81–85, 87–90, 92–95, 97–100, 102–107, 109–114, 116–120, 122–129, 131–136, 138–143 (GIOA/GIOB) | General-purpose I/O | 64 configurable GIO pins (10 interrupt-capable); support multiplexed functions including ePWM, eCAP, eQEP, CAN, SPI, and LIN signals |
| Pins 115, 117, 119, 121, 123, 125, 127, 129, 131, 133, 135, 137, 139, 141, 143 (CAN1TX/CAN1RX/CAN2TX/CAN2RX/CAN3TX/CAN3RX) | CAN transceiver interface | Differential bus drivers/receivers compliant with ISO 11898-2; support fault-tolerant operation in harsh automotive environments |
Key Features
| Feature | Design Value |
|---|---|
| Dual-lockstep Cortex-R4F CPUs | Continuous instruction-level comparison with automatic fault detection and error signaling via nERROR pin |
| ECC-protected memory subsystem | Single-bit correction/double-bit detection on 1 MB flash and 128 KB RAM ensures data integrity in radiation-prone environments |
| N2HET timing coprocessors | Two independent intelligent timers (32 + 18 channels) offload complex waveform generation and sensor capture from main CPU |
| Functional safety diagnostic coverage | Built-in self-test (BIST) for CPU cores and SRAM, voltage/clock monitors, and ESM enable ASIL-D compliance per ISO 26262 |
| Real-time peripheral integration | Seven ePWM modules with deadband and trip-zone protection, six eCAP, two eQEP, and dual MibADCs enable closed-loop motor control |
| Automotive communication suite | Three CAN 2.0B controllers (1 Mbps), LIN 2.1-capable SCI, MibSPI, I2C, and SPI support distributed vehicle network architectures |
Applications
| Electric Power Steering (EPS) | Braking Systems (ABS/ESC) |
|---|---|
Use Scenario: Real-time torque assist calculation and motor phase control under dynamic load conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU verification and hardware-accelerated PWM timing. Use Value: Enables deterministic <10 µs loop closure using N2HET-triggered ADC sampling synchronized to ePWM edges, reducing torque ripple by >35% versus single-core solutions. |
Use Scenario: High-speed wheel speed acquisition, pressure modulation, and fail-operational brake actuation. IC Role / Device Role / Timing Role: Safety-critical actuator controller with dual-redundant CAN interfaces for cross-domain communication and eQEP-based wheel position tracking. Use Value: Achieves <50 µs worst-case interrupt latency for ABS pulse-width modulation using dedicated ePWM trip zones and hardware CRC validation of sensor data. |
| HEV/EV Inverter Control | Battery Management Systems (BMS) |
Use Scenario: Isolated gate driver control, DC-link voltage/current monitoring, and thermal management in traction inverters. IC Role / Device Role / Timing Role: Real-time inverter controller with simultaneous multi-channel ADC sampling and isolated ePWM output generation. Use Value: Supports 16 kHz switching frequency with 12-bit ADC sampling at 1 MSps across 24 channels, enabling precise IGBT/SiC gate timing and overcurrent protection. |
Use Scenario: Cell voltage, temperature, and current measurement with isolation barrier communication in high-voltage battery packs. IC Role / Device Role / Timing Role: Safety monitor unit performing periodic BIST, ECC memory checks, and secure CAN messaging to master BMS controller. Use Value: Provides SIL-3 diagnostic coverage via on-chip BIST and ECC, reducing external watchdog requirements and simplifying ISO 26262 FMEDA analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS1227ZWT | 337-ball BGA, 180 MHz, 1280 KB flash, 192 KB RAM, adds EMAC and FlexRay | Targeted at gateway ECUs requiring Ethernet/FlexRay backbone connectivity | Select when higher performance, larger memory, or automotive network expansion beyond CAN/LIN is required |
| TMS570LS0432PZ | 100-pin LQFP, 80 MHz, 384 KB flash, 32 KB RAM, 2 CAN, 1 eQEP, no I2C | Cost-optimized variant for non-ASIL-D applications like HVAC or lighting control | Choose for lower-complexity safety applications where reduced peripheral count and smaller footprint are prioritized |
Compared with TMS570LS0914PGEQQ1, the TMS570LS1227ZWT offers higher compute throughput and expanded networking but requires BGA assembly and larger PCB area, while the TMS570LS0432PZ reduces cost and size at the expense of ASIL-D capability, memory, and peripheral richness - making it suitable only for ASIL-B designs.
Availability
TMS570LS0914PGEQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, and HEV/EV inverter control requiring stable component supply across automotive production lifecycles.
Supply support for TMS570LS0914PGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of automotive IC leadership.
The TMS570LS0914PGEQQ1 belongs to the Hercules™ safety MCUs product line, engineered specifically for ISO 26262 ASIL-D and IEC 61508 SIL-3 applications in automotive, industrial, and transportation systems.
FAQ
What safety certifications does the TMS570LS0914PGEQQ1 support out of the box?
The TMS570LS0914PGEQQ1 is architected to meet ISO 26262 ASIL-D and IEC 61508 SIL-3 requirements. It includes dual-lockstep CPUs, ECC on flash and RAM, BIST for CPU and memory, voltage/clock monitoring, and an Error Signaling Module with nERROR pin - all documented in TI's functional safety FIT rate reports and safety manuals. TMS570LS0914PGEQQ1 qualification data is provided in the TMS570 Functional Safety Documentation Package (SPNU612).
Does the TMS570LS0914PGEQQ1 support CAN FD or only classical CAN?
The TMS570LS0914PGEQQ1 supports only Classical CAN (ISO 11898-1, CAN 2.0A/B) up to 1 Mbps across its three DCAN controllers. It does not implement CAN FD physical layer or protocol features such as flexible data-rate, extended data length, or bit-rate switching. TMS570LS0914PGEQQ1 DCAN modules are fully compatible with legacy automotive networks but require external transceivers for CAN FD migration.
What is the maximum ADC sampling rate achievable with the TMS570LS0914PGEQQ1's dual MibADCs?
The TMS570LS0914PGEQQ1's MibADC1 and MibADC2 each support up to 1 MSPS aggregate sampling rate when configured in high-speed mode. With 24 + 16 total channels (16 shared), simultaneous sampling across all 24 channels of ADC1 is possible at 41.7 kSPS per channel. TMS570LS0914PGEQQ1 achieves this using hardware-triggered group conversions synchronized to ePWM events or N2HET timers.
Can the TMS570LS0914PGEQQ1's N2HET modules replace FPGA-based timing logic in motor control?
Yes - the two N2HET modules (32 + 18 programmable channels) in the TMS570LS0914PGEQQ1 execute deterministic, low-latency timing sequences independently of the CPU. Each includes 160-word instruction RAM with parity, hardware angle generation, and HTU for DMA transfers. TMS570LS0914PGEQQ1 N2HETs are widely used to replace FPGA logic in EPS and inverter applications, reducing BOM cost and design complexity while maintaining sub-microsecond jitter.
Is the TMS570LS0914PGEQQ1 pin-compatible with other devices in the TMS570LS family?
The TMS570LS0914PGEQQ1 in the 144-pin PGE package shares identical pinout and signal mapping with the TMS570LS1224PGE and TMS570LS3137ZWT (in PGE-compatible ballout), enabling hardware reuse across performance tiers. However, peripheral enablement (e.g., EMAC, FlexRay) and clock speeds differ - software must be validated per device. TMS570LS0914PGEQQ1 pin compatibility is confirmed in TI's SPNS225D datasheet Section 4.1.1.
TMX5700914PGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b, 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMX5700914PGEQQ1 FAQ
1.How can I place an order for TMX5700914PGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMX5700914PGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMX5700914PGEQQ1 reliable?
The price and inventory of TMX5700914PGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX5700914PGEQQ1 is usually 5 days.
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Once your TMX5700914PGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMX5700914PGEQQ1?
For technical support, including TMX5700914PGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX5700914PGEQQ1 requirements.
6.How does Aetrix verify that TMX5700914PGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMX5700914PGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX5700914PGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMX5700914PGEQQ1?
All TMX5700914PGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMX5700914PGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMX5700914PGEQQ1 part is unused and in its original packaging.
Return procedure for TMX5700914PGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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