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Texas Instruments TMX5701227APGEQQ1
- Part No.:
- TMX5701227APGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMX5701227APGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 1.25MB 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,256
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Product details
Overview
TMS570LS1227APGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 1.25MB ECC-protected flash, 192KB ECC RAM, and integrated safety features including BIST, error signaling, and voltage/clock monitoring - deployed in electric power steering and braking systems.
For engineers reviewing the TMS570LS1227APGEQQ1 datasheet, TMS570LS1227APGEQQ1 pinout, TMS570LS1227APGEQQ1 application, or TMS570LS1227APGEQQ1 equivalent, key selection criteria include ASIL-D compliance support, dual-CPU lockstep architecture, N2HET timing coprocessor count, ePWM channel availability, and 144-pin LQFP (PGE) package compatibility with automotive PCB layouts.
Technical Context
The TMS570LS1227APGEQQ1 implements a dual-core lockstep execution model where both Cortex-R4F CPUs execute identical instructions and compare results in real time to detect transient or permanent faults. Its safety architecture includes on-chip BIST for CPU and SRAM, ECC on flash and RAM, parity protection on peripheral memories, and dedicated error signaling via nERROR pin.
Timing subsystems include two independent Next Generation High-End Timer (N2HET) modules - N2HET1 with 32 programmable channels and N2HET2 with 18 - each featuring hardware angle generation, HTU-assisted DMA transfers, and MPU-protected memory access. The device supports IEEE 802.3-compliant 10/100 Mbps Ethernet MAC with MII/RMII/MDIO interfaces and three DCAN controllers compliant with CAN 2.0A/B protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core in lockstep, 1.66 DMIPS/MHz, up to 180 MHz (298 DMIPS) |
| Flash Memory | 1.25 MB with ECC, 64-bit bus, 3.3-V I/O supply for all operations |
| RAM | 192 KB data RAM with ECC + 64 KB emulated EEPROM with ECC |
| N2HET Modules | Two independent modules: N2HET1 (32 channels), N2HET2 (18 channels), each with HTU and parity-protected RAM |
| ePWM Outputs | 7 modules supporting up to 14 PWM outputs with deadband, trip zone, and synchronization to MibADC |
| ADC Resolution | Two 12-bit MibADCs: ADC1 (24 channels), ADC2 (16 shared channels), 64-word parity-protected buffer each |
| Communication | Three DCANs (CAN 2.0A/B), one FlexRay (dual-channel), one Ethernet MAC (MII/RMII/MDIO), three MibSPI, two SPI, one LIN, one SCI, one I2C |
Pinout & Package
LQFP-144 (PGE) package, 20.0 mm × 20.0 mm body size, green RoHS-compliant finish, 0.5-mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core supply input | 1.14–1.32 V for CPU and internal logic; requires tight regulation and local decoupling |
| VCCIO | I/O supply input | 3.0–3.6 V for all digital I/Os, including CAN, SPI, Ethernet PHY interface, and GPIO |
| nERROR | Error signaling output | Active-low open-drain fault indicator tied to ESM; asserts on detected CPU, memory, or clock errors |
| nRST | Warm reset input | Asynchronous active-low reset that initiates warm boot sequence without power cycle |
| GIOA[7:0] | General-purpose I/O bank A | 8-bit configurable GPIO group supporting interrupt generation and peripheral multiplexing |
| N2HET1[31:0] | N2HET1 I/O terminals | 32 dedicated pins for high-precision timing functions: PWM, capture, compare, or GIO |
| EMAC_MII_RXD[3:0] | Ethernet receive data | 4-bit MII interface for 10/100 Mbps Ethernet; requires impedance-controlled routing and PHY termination |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Lockstep | Real-time comparison of instruction execution between two Cortex-R4F cores enables ASIL-D fault detection without software overhead |
| ECC Memory Protection | Single-bit correction and double-bit detection on 1.25MB flash and 192KB RAM prevents silent data corruption in safety-critical control loops |
| N2HET Timing Coprocessors | Two autonomous timers with hardware angle generation and HTU-assisted DMA offload complex motor timing from CPU |
| Integrated Safety Monitor | Error Signaling Module (ESM) aggregates faults from CPU, memory, clocks, and peripherals into single nERROR pin for system-level fail-safe response |
| FlexRay + CAN + Ethernet | Multi-protocol connectivity enables centralized domain controller architecture in modern ADAS and vehicle networks |
Applications
| Electric Power Steering (EPS) | Braking Systems (ABS/ESC) |
|---|---|
Use Scenario: Real-time torque assist calculation and motor phase control under varying road load and temperature conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU verification and ePWM-driven inverter gate drivers. Use Value: Dual-core lockstep and ECC RAM ensure deterministic response within 100 µs worst-case latency while maintaining functional safety integrity per ISO 26262. | Use Scenario: Closed-loop hydraulic pressure modulation during emergency braking events with redundancy validation across sensor inputs. IC Role / Device Role / Timing Role: Central brake controller managing DCAN communication with wheel speed sensors, solenoid drivers, and yaw rate modules. Use Value: Three DCAN controllers and CRC module enable concurrent fault-tolerant messaging across multiple braking sub-systems at up to 1 Mbps. |
| HEV/EV Inverter Control | Railway Communications |
Use Scenario: Synchronized switching of IGBTs in traction inverters using precise dead-time compensated PWM waveforms. IC Role / Device Role / Timing Role: Real-time inverter controller generating 14-channel ePWM with trip-zone protection and synchronized sampling via MibADC trigger. Use Value: Seven ePWM modules with hardware deadband and synchronization reduce CPU load by >70% versus software-timed implementations. | Use Scenario: Interlocking and signaling control in rail signaling cabinets requiring SIL-4 certification and deterministic I/O response. IC Role / Device Role / Timing Role: Safety-certified host processor managing FlexRay backbone communication, discrete I/O monitoring, and watchdog supervision. Use Value: Built-in BIST, ESM, and lockstep execution provide certified evidence for SIL-4 compliance without external safety monitors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS0432APZQQ1 | Lower memory: 384 KB flash, 64 KB RAM; single N2HET (18 channels); no Ethernet MAC | Suitable for cost-sensitive ASIL-B systems like seat control or lighting, not for full-domain controllers | Select when Ethernet, dual N2HET, or >1 MB flash are unnecessary and BOM cost is critical |
| SPC574S40E1MLU3 | Power Architecture core (e200z4), 2 MB flash, 256 KB RAM, dual-lockstep but no N2HET; includes STCU2 safety monitor | Targeted at chassis control with CAN FD and SENT, lacks Ethernet/FlexRay but offers higher flash density | Prefer for legacy Power Architecture ecosystems or when CAN FD and SENT sensor integration outweigh N2HET requirement |
Compared with TMS570LS1227APGEQQ1, the TMS570LS0432APZQQ1 reduces safety capability and peripheral count for lower-tier automotive functions, while the SPC574S40E1MLU3 trades N2HET timing precision for broader CAN FD/Sent support and higher flash capacity in a different ISA ecosystem.
Availability
TMS570LS1227APGEQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, HEV/EV inverter control, and railway signaling applications requiring stable component supply across extended automotive lifecycles.
Supply support for TMS570LS1227APGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for automotive, industrial, and communications markets.
The TMS570 Hercules™ family is designed specifically for ASIL-D and SIL-3 safety-critical applications, integrating lockstep CPUs, memory ECC, self-test logic, and fault-reporting peripherals to simplify ISO 26262 and IEC 61508 certification.
FAQ
What safety certifications does the TMS570LS1227APGEQQ1 support?
The TMS570LS1227APGEQQ1 is architected to support ISO 26262 ASIL-D and IEC 61508 SIL-3 certification. It includes dual lockstep CPUs, memory BIST, ECC on flash and RAM, parity on peripheral memories, and an Error Signaling Module (ESM) with nERROR output - all documented in TI's Functional Safety Documentation Package (SPNU570). Certification evidence for TMS570LS1227APGEQQ1 is provided through FMEDA reports, safety manuals, and diagnostic coverage analysis.
Does the TMS570LS1227APGEQQ1 include an Ethernet MAC, and what interfaces does it support?
Yes, the TMS570LS1227APGEQQ1 integrates a fully featured 10/100 Mbps Ethernet MAC compliant with IEEE 802.3. It supports MII, RMII, and MDIO interfaces, enabling direct connection to external PHYs without external glue logic. The EMAC module includes dedicated message RAM (8 KB with parity), DMA arbitration, and MPU-protected access - confirmed in Section 7.13 of the SPNS192B datasheet.
What is the maximum operating frequency and power supply configuration for the TMS570LS1227APGEQQ1?
The TMS570LS1227APGEQQ1 operates at up to 180 MHz system clock frequency. It requires two independent supply domains: core voltage VCC = 1.14–1.32 V (for CPU and logic), and I/O voltage VCCIO = 3.0–3.6 V (for all digital I/Os, including CAN, SPI, Ethernet, and GPIO). These specifications are defined in Section 5.4 (Recommended Operating Conditions) of the SPNS192B datasheet.
How many enhanced PWM (ePWM) modules does the TMS570LS1227APGEQQ1 have, and what advanced features do they support?
The TMS570LS1227APGEQQ1 includes seven enhanced PWM (ePWM) modules supporting up to 14 total outputs. Each module provides deadband generation, trip-zone protection, synchronization with MibADC, and high-side/low-side complementary output control - essential for motor inverter gate driving. These capabilities are detailed in Section 7.1 of the SPNS192B datasheet and validated in TMS570LS1227-specific peripheral tables.
Is the TMS570LS1227APGEQQ1 pin-compatible with other devices in the TMS570LS family?
No - the TMS570LS1227APGEQQ1 in the 144-pin LQFP (PGE) package is not pin-compatible with ZWT (337-ball BGA) variants like TMS570LS1227ZWT. Pin functions differ significantly between packages, especially for N2HET, EMAC, and FlexRay signals. Table 4-1 (PGE QFP Pinout) and Table 4-2 (PGE Terminal Functions) in SPNS192B confirm unique signal mapping; migration requires PCB redesign.
TMX5701227APGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SPI, UCI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 1.25MB (1.25M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMX5701227APGEQQ1 FAQ
1.How can I place an order for TMX5701227APGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMX5701227APGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMX5701227APGEQQ1 reliable?
The price and inventory of TMX5701227APGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX5701227APGEQQ1 is usually 5 days.
3.What payment methods are accepted for TMX5701227APGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMX5701227APGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMX5701227APGEQQ1?
TMX5701227APGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMX5701227APGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMX5701227APGEQQ1?
For technical support, including TMX5701227APGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX5701227APGEQQ1 requirements.
6.How does Aetrix verify that TMX5701227APGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMX5701227APGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX5701227APGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMX5701227APGEQQ1?
All TMX5701227APGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMX5701227APGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMX5701227APGEQQ1 part is unused and in its original packaging.
Return procedure for TMX5701227APGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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