My Inquiry
My Account
Texas Instruments TMX5701227BZWTQQ1
- Part No.:
- TMX5701227BZWTQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 337-LFBGA
- Datasheet:
-
TMX5701227BZWTQQ1.pdf
- Description:
- IC MCU 32BIT 1.25MB FLASH 337BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,704
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS570LS1227ZWTQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 1.25MB ECC-protected flash, 192KB ECC RAM, and integrated safety features including BIST, error signaling, and voltage/clock monitoring - deployed in electric power steering and ABS systems.
For engineers reviewing the TMS570LS1227ZWTQQ1 datasheet, TMS570LS1227ZWTQQ1 pinout, TMS570LS1227ZWTQQ1 application, or TMS570LS1227ZWTQQ1 equivalent, key selection criteria include ASIL-D compliance support, N2HET timing coprocessor count, ePWM channel availability, FlexRay/Ethernet interface presence, and ZWT package ball-map compatibility for high-density PCB routing.
Technical Context
The TMS570LS1227ZWTQQ1 implements a dual-CPU lockstep architecture with real-time error detection via CPU BIST and memory ECC, enabling ISO 26262 ASIL-D system certification. Its two N2HET modules (32 + 18 programmable channels) operate independently with dedicated HTUs for DMA-style data transfers and built-in MPUs for memory protection.
Peripheral timing is managed by FMPLL with slip detection and a nonmodulating PLL, supporting up to 180-MHz system clock. The device integrates three DCAN controllers compliant with CAN 2.0A/B, one FlexRay controller with dual 10-Mbps channels, and a 10/100-Mbps Ethernet MAC supporting MII, RMII, and MDIO interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F, 1.66 DMIPS/MHz, up to 180 MHz → delivers 298 DMIPS real-time compute for motor control loops |
| Flash Memory | 1.25 MB with ECC → enables robust firmware storage and field updates without corruption risk in harsh environments |
| RAM | 192 KB SRAM with ECC → supports safe real-time data buffering and stack operations for ASIL-D software partitions |
| N2HET Modules | Two units: N2HET1 (32 channels), N2HET2 (18 channels) → offloads complex timing tasks like PWM generation and sensor capture from main CPU |
| ePWM Modules | 7 modules with trip-zone protection → provides fault-tolerant, high-resolution motor phase control with hardware deadband and synchronization |
| ADC | Two 12-bit MibADCs: ADC1 (24 channels), ADC2 (16 shared) → enables simultaneous sampling of torque, current, and position sensors in EPS systems |
| Communication | 3× DCAN, 1× FlexRay (2-channel), 1× EMAC, 3× MibSPI → meets automotive domain controller requirements for multi-bus redundancy and deterministic latency |
Pinout & Package
Package: 337-ball NFBGA (ZWT), 16.0 mm × 16.0 mm, 0.8-mm pitch, green RoHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nERROR | Error signaling output | Active-low external fault indicator tied to system watchdog or safety monitor; asserts on ESM-detected critical errors |
| VCC, VCCIO | Power supply rails | VCC = 1.14–1.32 V core; VCCIO = 3.0–3.6 V I/O → requires dual-rail power design with tight regulation for functional safety compliance |
| N2HET1[31:0] | N2HET1 I/O terminals | 32 programmable timing pins supporting PWM, capture, compare, or GIO → used for valve actuation or resolver excitation in traction inverters |
| EMAC_MII_RXD[3:0] | Ethernet receive data | 4-bit MII interface for 10/100 Mbps Ethernet → enables time-sensitive networking (TSN) readiness in ADAS domain controllers |
| DCAN1_TX / DCAN1_RX | CAN bus differential pair | Compliant with ISO 11898-1; supports up to 1 Mbps → connects to vehicle body control modules with galvanic isolation |
| FRAY_TX1 / FRAY_RX1 | FlexRay Channel 1 | Dual-channel 10 Mbps deterministic bus → used for x-by-wire applications requiring sub-microsecond jitter and fault containment |
Key Features
| Feature | Design Value |
|---|---|
| Dual lockstep CPUs | Hardware-level fault detection with zero-latency comparison; enables ASIL-D decomposition per ISO 26262 Part 5 |
| ECC on Flash & RAM | Single-bit correction / double-bit detection across all program and data memory → eliminates silent data corruption in safety-critical code execution |
| N2HET with HTU | Autonomous timing coprocessor with DMA-like transfers → reduces CPU load by >40% in high-channel-count motor control applications |
| FMPLL with slip detector | Real-time clock integrity monitoring → triggers fail-safe response within 1 µs if reference clock fails or drifts beyond ±1% |
| FlexRay + EMAC + DCAN | Triple-bus redundancy for communication-critical domains → satisfies AUTOSAR COM stack requirements for gateway and domain controller roles |
Applications
| Braking Systems (ABS/ESC) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time wheel speed sensing, hydraulic pressure modulation, and yaw rate control under dynamic road conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D braking algorithms with lockstep CPU verification and N2HET-driven solenoid timing. Use Value: Enables <100 µs loop closure for pressure control using ePWM trip zones and eCAP-based wheel speed capture - meeting UNECE R13-H requirements. | Use Scenario: Torque assist calculation, motor phase commutation, and torque sensor signal conditioning in column-assist EPS systems. IC Role / Device Role / Timing Role: Main MCU managing dual-motor control via 7 ePWM modules and dual 12-bit ADCs with synchronized sampling. Use Value: Achieves <5 µs current-loop latency using N2HET-driven PWM updates and hardware deadband - reducing torque ripple below 0.5% RMS. |
| HEV/EV Inverter Control | Railway Communications |
Use Scenario: IGBT gate driving, DC-link voltage monitoring, and thermal management in 400-V traction inverters. IC Role / Device Role / Timing Role: Safety-certified inverter controller interfacing with isolated gate drivers via ePWM outputs and isolated ADC inputs. Use Value: Supports SIL-3 functional safety via dual-core lockstep, ECC memory, and hardware BIST - certified per IEC 61508 for railway traction applications. | Use Scenario: Secure train-to-trackside communication, brake command arbitration, and diagnostic data aggregation in ETCS Level 2 systems. IC Role / Device Role / Timing Role: Domain controller running EN 50128-compliant software with FlexRay for inter-carriage sync and EMAC for trackside IP backhaul. Use Value: Delivers <1 µs timestamp resolution via N2HET for event synchronization across distributed nodes - meeting EN 50159-1 determinism requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS0432ZWTQQ1 | Lower memory: 384 KB flash, 64 KB RAM; single N2HET (32-ch); no FlexRay | Suitable for ASIL-B steering angle sensors or battery monitors - lacks dual-N2HET and FlexRay needed for full-domain control | Select when cost-sensitive ASIL-B functionality suffices and FlexRay/Ethernet are not required. |
| SPC574SADK1AKLQ1 | Power Architecture core; 2 MB flash; dual e200z4 cores; includes SENT interface; no N2HET | Optimized for engine control with analog/digital sensor fusion; lacks N2HET's deterministic timing for motor control | Prefer for ICE powertrain applications requiring SENT or LIN-focused sensor hubs over N2HET-based actuator control. |
Compared with TMS570LS1227ZWTQQ1, the TMS570LS0432ZWTQQ1 reduces safety scope and peripheral count for cost-constrained ASIL-B designs, while the SPC574SADK1AKLQ1 shifts architecture toward legacy Power Architecture and sensor-centric interfaces - neither offers the N2HET timing precision or FlexRay+EMAC dual-bus capability required for next-gen x-by-wire domain controllers.
Availability
TMS570LS1227ZWTQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, and HEV/EV inverter control requiring stable component supply across extended automotive lifecycles.
Supply support for TMS570LS1227ZWTQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with broad automotive qualification expertise.
The TMS570 Hercules™ family delivers ASIL-D-capable MCUs designed specifically for safety-critical automotive control - emphasizing lockstep execution, memory integrity, and deterministic peripheral timing for braking, steering, and propulsion systems.
FAQ
What safety certifications does the TMS570LS1227ZWTQQ1 support?
The TMS570LS1227ZWTQQ1 supports ISO 26262 ASIL-D development per TI's Functional Safety Package, including FMEDA reports, safety manuals, and diagnostic software libraries. It also meets IEC 61508 SIL-3 requirements and has been validated for use in automotive braking and steering systems per UNECE R13-H and R79 standards. All safety mechanisms - dual-CPU lockstep, ECC, BIST, and ESM - are documented in the TMS570LS1227ZWTQQ1 safety manual SPNU522.
Does the TMS570LS1227ZWTQQ1 include hardware support for CAN FD?
No, the TMS570LS1227ZWTQQ1 integrates three DCAN controllers compliant only with CAN 2.0A and 2.0B protocols (up to 1 Mbps), not CAN FD. It lacks the bit-rate switching capability, extended data length (up to 64 bytes), and CRC enhancements defined in ISO 11898-1:2015. For CAN FD support, TI recommends the newer TMS570LC4357 or RM48L952 devices. The TMS570LS1227ZWTQQ1 remains widely deployed in legacy CAN-based vehicle networks where 2.0B suffices.
What is the maximum operating temperature range for the TMS570LS1227ZWTQQ1?
The TMS570LS1227ZWTQQ1 is qualified for operation from –40°C to 125°C ambient temperature (TA), meeting AEC-Q100 Grade 1 requirements. This range applies to the ZWT package variant and is validated across voltage, frequency, and process corners. Thermal derating begins above 105°C ambient when operating at full 180-MHz clock speed; TI recommends using the device's internal temperature sensor and thermal management firmware in TMS570LS1227ZWTQQ1-based designs targeting continuous 125°C operation.
How many N2HET channels does the TMS570LS1227ZWTQQ1 provide, and are they configurable?
The TMS570LS1227ZWTQQ1 provides two independent N2HET modules: N2HET1 with 32 programmable channels and N2HET2 with 18 programmable channels, totaling 50 I/O-capable timing terminals. Each channel is fully configurable in firmware for PWM output, input capture, compare, or general-purpose I/O mode. Configuration is performed via N2HET RAM microcode loaded at runtime, allowing dynamic reassignment without CPU intervention - a capability confirmed in the TMS570LS1227ZWTQQ1 Technical Reference Manual SPRUHL8.
Is the TMS570LS1227ZWTQQ1 pin-compatible with other TMS570LS1227 package variants?
No, the TMS570LS1227ZWTQQ1 (337-ball NFBGA) is not pin-compatible with the TMS570LS1227PGE (144-pin LQFP). Ball/pin functions differ significantly between packages: the ZWT exposes all 50 N2HET channels, both FlexRay lanes, and full EMAC MII signals, while the PGE omits FlexRay, reduces N2HET to 32 total channels, and supports only RMII. Migration requires PCB redesign and signal mapping validation per Section 4.2 (ZWT ball map) and Section 4.1 (PGE pinout) of the TMS570LS1227ZWTQQ1 datasheet SPNS192B.
TMX5701227BZWTQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 337-LFBGA
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SPI, UCI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 101
- Program Memory Size:
- 1.25MB (1.25M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMX5701227BZWTQQ1 FAQ
1.How can I place an order for TMX5701227BZWTQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMX5701227BZWTQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMX5701227BZWTQQ1 reliable?
The price and inventory of TMX5701227BZWTQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX5701227BZWTQQ1 is usually 5 days.
3.What payment methods are accepted for TMX5701227BZWTQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMX5701227BZWTQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMX5701227BZWTQQ1?
TMX5701227BZWTQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMX5701227BZWTQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMX5701227BZWTQQ1?
For technical support, including TMX5701227BZWTQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX5701227BZWTQQ1 requirements.
6.How does Aetrix verify that TMX5701227BZWTQQ1 is sourced from the original manufacturer or authorized distributors?
All TMX5701227BZWTQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX5701227BZWTQQ1 meets industry standards.
7.What is the process for return or replacement of TMX5701227BZWTQQ1?
All TMX5701227BZWTQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMX5701227BZWTQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMX5701227BZWTQQ1 part is unused and in its original packaging.
Return procedure for TMX5701227BZWTQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMX5701227BZWTQQ1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
