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Texas Instruments TMX5703137APGEQQ1

Part No.:
TMX5703137APGEQQ1
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixTMX5703137APGEQQ1.pdf
Description:
IC MCU 16/32BIT 3MB FLSH 144LQFP
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,220

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Product details

Overview

TMX5703137APGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller featuring dual ARM® Cortex®-R4F CPUs in lockstep, 3 MB of ECC-protected flash memory, 256 KB of ECC-protected RAM, and integrated safety mechanisms including BIST, voltage/clock monitoring, and error signaling. It delivers up to 298 DMIPS at 180 MHz and supports safety-critical real-time control in braking systems, electric power steering, and battery management.

For engineers reviewing the TMX5703137APGEQQ1 datasheet, TMX5703137APGEQQ1 pinout, TMX5703137APGEQQ1 application, or TMX5703137APGEQQ1 equivalent, key selection considerations include its ASIL-D-capable safety architecture, 144-pin LQFP (PGE) package with 4 GPIO interrupt-capable pins, triple DCAN support, dual N2HET timing coprocessors, and IEEE 802.3-compliant 10/100 Mbps EMAC interface.

Technical Context

The TMX5703137APGEQQ1 implements a lockstep dual-CPU architecture with hardware-level fault detection, where both cores execute identical instructions and compare results in real time. Its FMPLL and nonmodulating FlexRay PLL provide independent, safety-isolated clock domains for core, peripherals, and communication interfaces.

Memory subsystems include ECC on 3 MB flash and 256 KB RAM, parity protection on 64 KB emulated EEPROM flash, and dedicated MPUs for DMA, HTU, FTU, and RTI modules - ensuring memory access integrity across safety-critical paths.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-R4F dual-core in lockstep, 180 MHz max, 298 DMIPS - enables ASIL-D compliance via hardware redundancy and real-time comparison.
Flash Memory 3 MB with ECC - supports safe over-the-air updates and robust program storage in automotive environments.
RAM 256 KB SRAM with ECC - ensures data integrity for real-time control variables and safety state tracking.
ADC Two 12-bit MibADCs (24 total channels, 64-word parity-protected buffers each) - provides high-resolution sensor acquisition for motor control and battery monitoring.
Communication Three DCAN controllers (CAN 2.0B), dual N2HET (40 total channels), EMAC (MII/RMII/MDIO), FlexRay (dual-channel), LIN, I2C, SPI - meets full vehicle network stack requirements.
Safety Features Built-in self-test (BIST) for CPU and RAM, ESM with ERROR pin, voltage/clock monitors, and parity on peripheral memories - satisfies ISO 26262 ASIL-D diagnostic coverage targets.
Package LQFP-144 (PGE), 20.0 mm × 20.0 mm - enables PCB layout compatibility with industrial and automotive control modules requiring reflow-solderable packages.

Pinout & Package

TMX5703137APGEQQ1 is housed in a 144-pin LQFP (PGE) package with exposed thermal pad, rated for -40°C to +125°C operation. Pin functions are defined per TI SPNS162C Rev C, Section 4.1 (PGE QFP Package Pinout).

Pin/Terminal Circuit Role Design Meaning
nPORRST Power-on reset input Active-low asynchronous reset asserted during power ramp; must be held low ≥2256 oscillator cycles after VCC stabilization.
nERROR Error signaling output Open-drain active-low signal driven by ESM to indicate detected fault (e.g., memory ECC double-bit error, clock failure).
GIOA[0] General-purpose I/O Configurable digital I/O with interrupt capability; one of four GPIO pins supporting interrupt generation in PGE package.
EMAC_MDIO Management Data I/O Bi-directional serial interface for PHY register access per IEEE 802.3 clause 22; supports auto-negotiation and link status polling.
N2HET1[0] N2HET channel 0 I/O Programmable timing pin for PWM generation, capture, or GPIO; part of 32-channel N2HET1 coprocessor for deterministic actuator control.
DCAN1_TX CAN controller 1 transmit Dominant/recessive level output for CAN FD-compatible 1 Mbps bus communication; includes slew-rate control for EMC compliance.

Key Features

Feature Design Value
Dual-lockstep Cortex-R4F CPU Hardware-enforced instruction-level redundancy with real-time result comparison - eliminates single-point failures in safety-critical execution paths.
ECC on flash and RAM Single-bit correction and double-bit detection across all program and data memory - prevents silent data corruption in long-life automotive deployments.
Two N2HET modules N2HET1 (32 channels) and N2HET2 (18 channels) with dedicated HTUs and MPUs - enable precise, offload-based timing for valve control, encoder sampling, and LED dimming without CPU intervention.
Triple DCAN + FlexRay + EMAC Simultaneous support for CAN 2.0B (1 Mbps), FlexRay (10 Mbps dual-channel), and Ethernet (10/100 Mbps) - allows integration into multi-bus vehicle architectures with deterministic latency guarantees.
Integrated safety monitoring Voltage supervisors, clock fail detectors, and BIST logic feed into Error Signaling Module (ESM) - provides centralized fault reporting via nERROR pin and interrupt vectoring for ASIL-D system response.

Applications

Braking Systems Electric Power Steering (EPS)

Use Scenario: Real-time pressure modulation and wheel-speed-based slip control in ABS and ESC modules.

IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D software, managing DCAN communication with wheel speed sensors and hydraulic valves.

Use Value: Lockstep CPU and ECC memory ensure functional integrity under EMI stress; N2HET timers generate precise PWM for solenoid drivers with <1 µs jitter.

Use Scenario: Torque assist calculation, motor phase commutation, and torque sensor fusion in column-assist EPS systems.

IC Role / Device Role / Timing Role: Real-time motor control unit interfacing with 12-bit ADCs for current sensing and N2HET for gate driver timing.

Use Value: Dual MibADCs acquire 24 synchronized samples per cycle; EMAC enables firmware updates via vehicle Ethernet backbone without CAN bus congestion.

Battery Management Systems Railway Communications

Use Scenario: Cell voltage monitoring, thermal management, and isolation barrier communication in high-voltage traction battery packs.

IC Role / Device Role / Timing Role: Safety monitor co-processor communicating via isolated DCAN and SPI to front-end analog monitors (e.g., BQ796xx).

Use Value: 3 MB flash stores redundant SOC/SOH algorithms; built-in CRC module validates firmware images before execution to prevent corrupted updates.

Use Scenario: Onboard train control unit handling ETCS Level 2 radio gateway, balise transmission, and interlocking interface protocols.

IC Role / Device Role / Timing Role: Deterministic communication hub managing FlexRay for vehicle-to-vehicle coordination and DCAN for legacy subsystems.

Use Value: Dual FlexRay channels support hot-standby redundancy; IEEE 802.3 EMAC enables secure remote diagnostics via GSM/railway Ethernet infrastructure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS570LS3137ZWT 337-ball NFBGA package (16 mm × 16 mm); 144 GPIO pins vs. 58 on PGE; includes EMIF and ETM trace support not present in PGE variant. Preferred for space-constrained, high-I/O designs requiring external SDRAM or instruction trace; unsuitable for PGE footprint replacement. Select ZWT only when board layout supports BGA and additional peripherals (EMIF, ETM) are required.
TMS570LS1227ZWT Lower memory configuration: 1.28 MB flash, 192 KB RAM, no EMAC or FlexRay; same Cortex-R4F core and safety architecture. Targeted at cost-sensitive ASIL-B/C applications like HVAC control or lighting modules where Ethernet/FlexRay are unnecessary. Choose LS1227 only when full TMS570LS3137 feature set is unused and BOM cost reduction is critical.

Compared with TMX5703137APGEQQ1, the ZWT variant offers higher I/O count and external memory expansion but requires BGA assembly and lacks pin compatibility; the LS1227 reduces memory and communication peripherals while retaining core safety features - making it a functional subset rather than a drop-in alternative.

Availability

TMX5703137APGEQQ1 is available at Aetrix Electronics and suitable for automotive braking systems, electric power steering units, and battery management systems requiring stable component supply across extended product lifecycles and rigorous AEC-Q100 qualification.

Supply support for TMX5703137APGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for automotive, industrial, and communications markets since 1930.

The TMS570 Hercules™ family was designed specifically for ISO 26262 ASIL-D and IEC 61508 SIL-3 safety-critical applications, integrating hardware safety mechanisms directly into the MCU silicon to reduce system-level validation effort.

FAQ

What safety certifications does the TMX5703137APGEQQ1 support?

The TMX5703137APGEQQ1 is qualified to AEC-Q100 Grade 1 (-40°C to +125°C) and supports ISO 26262 ASIL-D development per TI's Functional Safety Package (SPNU570). It includes hardware safety features such as lockstep CPUs, ECC memory, BIST, and ESM - enabling certified safety applications without external safety monitors. Documentation for TMX5703137APGEQQ1 includes FMEDA reports and safety manuals aligned with automotive functional safety standards.

Does the TMX5703137APGEQQ1 include an Ethernet MAC interface?

Yes, the TMX5703137APGEQQ1 integrates a fully compliant IEEE 802.3 10/100 Mbps Ethernet Media Access Controller (EMAC) with MII, RMII, and MDIO interfaces. It supports full-duplex operation, hardware checksum offload, and configurable packet filtering. The EMAC is accessible in the TMX5703137APGEQQ1's PGE package via dedicated pins including EMAC_MDC, EMAC_MDIO, EMAC_RXD[3:0], and EMAC_TXD[3:0].

How many CAN controllers are integrated into the TMX5703137APGEQQ1?

The TMX5703137APGEQQ1 includes three fully independent DCAN controllers compliant with CAN Protocol Version 2.0B, supporting bit rates up to 1 Mbps. Each DCAN has 32 message objects with individual acceptance masking, and all support loopback self-test mode. These controllers are accessible on the TMX5703137APGEQQ1's 144-pin PGE package through dedicated TX/RX pin pairs (e.g., DCAN1_TX/DCAN1_RX on pins 121/122).

What is the maximum operating frequency of the TMX5703137APGEQQ1?

The TMX5703137APGEQQ1 operates at a maximum system clock frequency of 180 MHz, delivering up to 298 DMIPS performance using its dual ARM Cortex-R4F CPUs. This frequency is achieved using the integrated Frequency-Modulated PLL (FMPLL), which multiplies an external crystal or clock source. The core supply voltage range is 1.14 V to 1.32 V, and the I/O supply is 3.0 V to 3.6 V - both specified for reliable operation at 180 MHz in the TMX5703137APGEQQ1 datasheet.

Is the TMX5703137APGEQQ1 pin-compatible with other TMS570 devices?

No, the TMX5703137APGEQQ1 is not pin-compatible with other TMS570 family members beyond the TMS570LS3137PGE series. While it shares the same 144-pin LQFP (PGE) mechanical footprint as TMS570LS3137PGE, differences in peripheral mapping, power domain assignments, and safety configuration registers mean direct substitution requires full schematic and layout review. TI does not designate TMX5703137APGEQQ1 as a drop-in replacement for any alternate part number.

TMX5703137APGEQQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
144-LQFP
Series:
Hercules™ TMS570 ARM® Cortex®-R
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
58
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

TMX5703137APGEQQ1 FAQ

1.How can I place an order for TMX5703137APGEQQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMX5703137APGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMX5703137APGEQQ1 reliable?

The price and inventory of TMX5703137APGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX5703137APGEQQ1 is usually 5 days.

3.What payment methods are accepted for TMX5703137APGEQQ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMX5703137APGEQQ1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMX5703137APGEQQ1?

TMX5703137APGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMX5703137APGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMX5703137APGEQQ1?

For technical support, including TMX5703137APGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX5703137APGEQQ1 requirements.

6.How does Aetrix verify that TMX5703137APGEQQ1 is sourced from the original manufacturer or authorized distributors?

All TMX5703137APGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX5703137APGEQQ1 meets industry standards.

7.What is the process for return or replacement of TMX5703137APGEQQ1?

All TMX5703137APGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMX5703137APGEQQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMX5703137APGEQQ1 part is unused and in its original packaging.

Return procedure for TMX5703137APGEQQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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