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Texas Instruments TMX5703137BPGEQQ1
- Part No.:
- TMX5703137BPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TMX5703137BPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 3MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,046
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Product details
Overview
TMX5703137BPGEQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 3 MB ECC-protected flash, 256 KB ECC-protected RAM, and integrated safety features including BIST, voltage/clock monitoring, and error signaling. It targets ASIL-D functional safety applications such as electric power steering and braking systems.
For engineers reviewing the TMX5703137BPGEQQ1 datasheet, TMX5703137BPGEQQ1 pinout, TMX5703137BPGEQQ1 application, or TMX5703137BPGEQQ1 equivalent, this page delivers verified technical context, real-world use cases, validated alternatives, and supply-chain support for high-integrity embedded control designs.
Technical Context
The TMX5703137BPGEQQ1 implements a dual-core lockstep architecture with built-in CPU and memory BIST, ECC on flash and SRAM, parity on peripheral memories, and loopback-capable I/Os - all aligned to ISO 26262 ASIL-D requirements. Its safety-critical subsystems include Error Signaling Module (ESM), FMPLL with slip detection, and dedicated MPU for DMA, HTU, and FTU.
It integrates two 12-bit MibADCs (24 total channels, 64-word parity-protected buffers each), three DCAN controllers compliant with CAN 2.0B up to 1 Mbps, dual N2HET modules (32 + 18 programmable channels), and a 10/100 Mbps Ethernet MAC supporting MII, RMII, and MDIO - all operating under a unified 180 MHz system clock with 1.2 V core and 3.3 V I/O supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core in lockstep, 180 MHz max, 298 DMIPS, FPU with single/double precision |
| Memory | 3 MB flash with ECC, 256 KB RAM with ECC, 64 KB emulated EEPROM flash with ECC |
| Safety Features | Dual-CPU lockstep, BIST for CPU/RAM, ESM with ERROR pin, voltage/clock monitoring, parity on peripherals |
| Analog Peripherals | Two 12-bit MibADCs: ADC1 (24 channels), ADC2 (16 shared), 64-result buffers each with parity |
| Timers & Control | N2HET1 (32 channels), N2HET2 (18 channels), RTI timer, 96-channel VIM, 2-channel CRC |
| Communication | Three DCANs, two MibSPIs, two SPIs, one LIN, one SCI, one I²C, one EMAC (10/100 Mbps), one FlexRay (dual-channel) |
| Package | LQFP-144 (PGE), green RoHS-compliant, 20.0 mm × 20.0 mm body size |
Pinout & Package
LQFP-144 (PGE) package with 0.5 mm pitch, exposed thermal pad, and green RoHS-compliant finish. Pinout defined per TI SPNS162C Section 4.1 (PGE QFP Package Pinout).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nRST | Reset Input | Active-low asynchronous reset; initiates warm reset sequence and clears internal state |
| nERROR | Error Output | Open-drain active-low signal asserted by ESM upon detected fault (e.g., memory ECC double-bit error) |
| VCCAD / VSSAD | ADC Power Supply | Separate 3.0–5.25 V analog domain; decoupling required for 12-bit ADC accuracy and noise immunity |
| GIOA[7:0], GIOB[7:0] | General-Purpose I/O | 16 pins configurable as GPIO with interrupt capability; four of these support fast edge-triggered interrupts |
| MIBSPI1_nCS[5:0] | Chip Select Outputs | Six independent chip select lines for MibSPI1, enabling concurrent interface to up to six external peripherals |
Key Features
| Feature | Design Value |
|---|---|
| Dual Lockstep CPUs | Real-time hardware comparison of instruction execution between two Cortex-R4F cores ensures immediate fault detection for ASIL-D compliance |
| ECC Memory Protection | Single-bit correction and double-bit detection on 3 MB flash and 256 KB RAM prevents silent data corruption in safety-critical code/data storage |
| N2HET Timing Coprocessors | Two independent high-resolution timers (32 + 18 channels) offload complex PWM, capture, and actuator timing from main CPU |
| EMAC + FlexRay + DCAN | Triple-networking capability enables simultaneous high-speed (100 Mbps Ethernet), deterministic (10 Mbps FlexRay), and robust (1 Mbps CAN) communication stacks |
| Parameter Overlay Module (POM) | Enables runtime calibration by redirecting flash accesses to RAM without halting CPU or reprogramming flash - critical for field-tuned control algorithms |
Applications
| Braking Systems | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time monitoring of wheel speed sensors, hydraulic pressure, and yaw rate during ABS and ESC operation. IC Role / Device Role / Timing Role: Primary safety controller executing certified ASIL-D brake actuation logic with sub-100 µs latency on critical paths. Use Value: Dual-lockstep execution and ECC memory ensure deterministic response even under transient radiation-induced faults. |
Use Scenario: Closed-loop torque assist control using motor current, torque sensor, and vehicle speed inputs. IC Role / Device Role / Timing Role: Real-time motor control unit managing N2HET-driven PWM generation, ADC sampling at 1 MSPS, and CAN-based diagnostic reporting. Use Value: Integrated 12-bit MibADCs with 64-word parity buffers and N2HET timing co-processors eliminate external timing ICs and reduce BOM count. |
| Battery Management Systems | Railway Communications |
|
Use Scenario: Cell voltage, temperature, and current monitoring across high-voltage traction battery packs in HEV/EV platforms. IC Role / Device Role / Timing Role: Safety monitor collecting analog data via dual MibADCs, validating integrity with parity/ECC, and communicating status over isolated CAN/FlexRay. Use Value: Independent ADC result buffers with parity allow concurrent acquisition and validation - preventing single-point failure in voltage measurement chain. |
Use Scenario: Interlocking and signaling control in rail infrastructure requiring SIL-4 certification and deterministic message delivery. IC Role / Device Role / Timing Role: Central safety processor running lockstep firmware, interfacing to trackside sensors via DCAN and to central control via Ethernet. Use Value: IEEE 802.3-compliant EMAC with MDIO management and dual-channel FlexRay provide redundant, time-triggered communication paths meeting EN 50128 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS3137ZWT | 337-ball NFBGA (16 mm × 16 mm); higher pin count (144 → 337), supports EMIF and additional GPIO/N2HET channels | Required for designs needing external SDRAM, FPGA interface, or >58 GPIOs; not drop-in compatible due to package and pinout mismatch | Select ZWT only when board layout supports BGA and system requires expanded memory/peripheral I/O beyond PGE limits. |
| TMS570LS3135PGE | Same PGE package and pinout; reduced flash (3 MB → 3 MB same), but lower max frequency (160 MHz vs. 180 MHz) and no EMAC | Suitable for cost-sensitive ASIL-B/C applications lacking Ethernet connectivity or requiring lower compute throughput | Choose LS3135PGE only if Ethernet is unused and 20 MHz CPU headroom is acceptable; verify EMAC removal does not impact system architecture. |
Compared with TMX5703137BPGEQQ1, the ZWT variant enables scalable system expansion via EMIF and higher I/O density, while the LS3135PGE offers pin-compatible cost reduction at the expense of Ethernet and peak performance - making TMX5703137BPGEQQ1 the optimal choice for full-featured ASIL-D automotive control with integrated networking.
Availability
TMX5703137BPGEQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, and battery management systems requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.
Supply support for TMX5703137BPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of automotive qualification expertise and ISO/TS 16949-certified manufacturing.
The TMS570 Hercules™ family - including TMX5703137BPGEQQ1 - was designed specifically for ASIL-D and SIL-3 safety-critical applications in automotive, industrial, and transportation systems, emphasizing lockstep redundancy, memory protection, and diagnostic coverage.
FAQ
What safety certifications apply to the TMX5703137BPGEQQ1?
The TMX5703137BPGEQQ1 is architected to meet ISO 26262 ASIL-D requirements and IEC 61508 SIL-3 standards. Its dual lockstep CPUs, ECC memory, BIST logic, ESM, and voltage/clock monitors are documented in TI's Functional Safety Manual (SPNU526). Certification evidence is provided through FMEDA reports and safety analysis documentation - not inherent to the device alone but validated within system-level integration.
Does the TMX5703137BPGEQQ1 support Ethernet PHY interface directly?
No, the TMX5703137BPGEQQ1 integrates only the Ethernet MAC (EMAC) layer and requires an external PHY chip. It supports MII and RMII physical interfaces with dedicated pins (e.g., MII_TXD[3:0], RMII_REF_CLK), and includes MDIO for PHY register configuration. The device does not contain a built-in PHY transceiver or analog front-end.
How many CAN interfaces does the TMX5703137BPGEQQ1 support, and are they fully independent?
The TMX5703137BPGEQQ1 integrates three fully independent DCAN controllers, each compliant with CAN 2.0B protocol and capable of 1 Mbps operation. They share no internal resources - each has dedicated message RAM (64 mailboxes with parity), filtering logic, and TX/RX FIFOs - enabling concurrent operation on separate networks without arbitration or scheduling conflicts.
Can the TMX5703137BPGEQQ1 operate without external crystal oscillation?
Yes, the TMX5703137BPGEQQ1 supports internal oscillator modes including HF LPO (low-power oscillator) and software-trimmable RC oscillators, allowing crystal-free startup and operation. However, for Ethernet, FlexRay, or precise timing-critical functions, TI recommends using the external 20 MHz crystal with FMPLL for jitter-controlled clock synthesis - as internal oscillators lack required stability.
What is the role of the Parameter Overlay Module (POM) in TMX5703137BPGEQQ1-based systems?
The POM in TMX5703137BPGEQQ1 enables dynamic rerouting of flash memory accesses to internal RAM or EMIF address space at runtime - allowing calibration tables and control parameters to be updated in RAM without halting the CPU or reprogramming flash. This supports field updates, adaptive tuning, and fail-safe parameter rollback without disrupting real-time control loops.
TMX5703137BPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMX5703137BPGEQQ1 FAQ
1.How can I place an order for TMX5703137BPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMX5703137BPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMX5703137BPGEQQ1 reliable?
The price and inventory of TMX5703137BPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMX5703137BPGEQQ1 is usually 5 days.
3.What payment methods are accepted for TMX5703137BPGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMX5703137BPGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMX5703137BPGEQQ1?
TMX5703137BPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMX5703137BPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMX5703137BPGEQQ1?
For technical support, including TMX5703137BPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX5703137BPGEQQ1 requirements.
6.How does Aetrix verify that TMX5703137BPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All TMX5703137BPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX5703137BPGEQQ1 meets industry standards.
7.What is the process for return or replacement of TMX5703137BPGEQQ1?
All TMX5703137BPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMX5703137BPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMX5703137BPGEQQ1 part is unused and in its original packaging.
Return procedure for TMX5703137BPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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