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Texas Instruments TMX5703137BZWTQQ1

Part No.:
TMX5703137BZWTQQ1
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
337-LFBGA
Datasheet:
AetrixTMX5703137BZWTQQ1.pdf
Description:
IC MCU 16/32B 3MB FLASH 337NFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,295

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Product details

Overview

TMS570LS3137ZWTQQ1 from Texas Instruments is an automotive-grade 32-bit RISC flash microcontroller with dual lockstep ARM Cortex-R4F CPUs, 3 MB ECC-protected flash, 256 KB ECC RAM, and integrated safety features including BIST, voltage/clock monitoring, and error signaling. It delivers 298 DMIPS at 180 MHz and targets ASIL-D functional safety applications such as electric power steering and braking systems.

For engineers reviewing the TMS570LS3137ZWTQQ1 datasheet, TMS570LS3137ZWTQQ1 pinout, TMS570LS3137ZWTQQ1 application, or TMS570LS3137ZWTQQ1 equivalent, key selection criteria include dual-CPU lockstep architecture, FMPLL clocking with slip detection, FlexRay/DCAN/Ethernet interface support, and full IEC 61508/ISO 26262 diagnostic coverage for safety-critical real-time control.

Technical Context

The TMS570LS3137ZWTQQ1 implements a dual-core lockstep execution model where both Cortex-R4F CPUs run identical instructions and compare results in real time to detect transient faults. Its safety subsystem includes dedicated Error Signaling Module (ESM) with external ERROR pin, built-in self-test (BIST) for CPU and SRAM, and parity protection across all peripheral memories including N2HET instruction RAM and MibADC buffers.

Timing-critical peripherals are hardware-accelerated: two Next Generation High-End Timer (N2HET) modules provide 32+18 programmable channels with dedicated HTUs and MPUs for DMA transfers, while two 12-bit MibADCs support up to 24 shared analog inputs with 64-word parity-protected result buffers per module and configurable conversion sequencing.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-R4F dual-core lockstep, 180 MHz max, 298 DMIPS performance
Memory 3 MB flash with ECC, 256 KB RAM with ECC, 64 KB emulated EEPROM with ECC
Safety Features Dual-CPU lockstep, CPU/RAM BIST, ECC on flash/RAM, parity on peripheral RAMs, ESM with ERROR pin
Communication 3× DCAN (CAN 2.0B), 2× MibSPI + 2× SPI, 1× LIN, 1× SCI, 1× I²C, 1× EMAC (10/100 Mbps), 1× FlexRay (2-channel)
Analog & Timing 2× 12-bit MibADC (24 total channels), 2× N2HET (32+18 channels), RTI timer, CRC module
Power & Environment VCC core: 1.2 V nominal (1.14–1.32 V), VCCIO: 3.3 V nominal (3.0–3.6 V), operating temp: –40°C to +125°C

Pinout & Package

Package: 337-ball NFBGA (ZWT), 16.0 mm × 16.0 mm, 0.8 mm ball pitch, green RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
VCCAD / VSSAD Analog supply/ground Independent 3.0–5.25 V analog domain powering ADCs and reference circuitry
nERROR Error signaling output Active-low open-drain fault indicator driven by ESM upon detected safety violation
N2HET1[31:0] High-end timer I/O bank 32 programmable pins supporting PWM, capture, compare, or GPIO with hardware angle generation
MIBSPI1_nCS[5:0] Multi-buffered SPI chip select 6 independent chip selects enabling concurrent communication with multiple SPI peripherals
EMAC_MII_RXD[3:0] Ethernet MAC receive data 4-bit MII interface supporting 10/100 Mbps Ethernet with MDIO management capability

Key Features

Feature Design Value
Dual lockstep Cortex-R4F CPUs Hardware-level fault detection via real-time result comparison eliminates need for software-based redundancy checks
FMPLL with slip detector Frequency-modulated PLL enables robust clock generation under voltage/temp variation; slip detection flags timing violations
FlexRay Transfer Unit (FTU) Dedicated DMA engine moves FlexRay message RAM data to/from main memory without CPU intervention, reducing latency
Parameter Overlay Module (POM) Redirects flash accesses to RAM or EMIF during runtime, enabling dynamic calibration of production code without reflash
Embedded Trace Macrocell (ETM-R4) Full instruction and data trace capability supports ISO 26262 tool qualification requirements for safety verification

Applications

Braking Systems Electric Power Steering

Use Scenario: Real-time actuation control in ABS and ESC modules requiring deterministic response under fault conditions.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D algorithms with lockstep CPU validation and hardware BIST.

Use Value: Dual-CPU lockstep and ECC memory ensure <10⁻⁹ FIT failure rate; N2HET timers precisely manage solenoid pulse widths.

Use Scenario: Torque assist computation and motor control in column-assist EPS systems exposed to high vibration and thermal stress.

IC Role / Device Role / Timing Role: Central MCU managing CAN bus coordination, ADC sampling of torque sensors, and PWM generation for 3-phase inverter.

Use Value: 12-bit MibADC with 24-channel multiplexing captures sensor data at ≤1 μs conversion time; DCAN interfaces with vehicle CAN backbone.

Battery Management Systems Railway Communications

Use Scenario: Cell voltage monitoring, thermal management, and isolation diagnostics in high-voltage EV battery packs.

IC Role / Device Role / Timing Role: Safety-certified host processor interfacing with isolated ADCs, digital isolators, and CAN FD gateways.

Use Value: EMIF supports external SDRAM for large state-history logging; CRC module validates firmware updates over CAN.

Use Scenario: Vital signaling and train control communication in EN 5012x-certified onboard equipment.

IC Role / Device Role / Timing Role: Redundant controller running SIL-4 logic with FlexRay for deterministic inter-carriage messaging and Ethernet for maintenance telemetry.

Use Value: FlexRay dual-channel operation provides fault-tolerant 10 Mbps communication; ETM-R4 trace supports certification evidence collection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS570LS3135ZWT Same package and pinout, but reduced flash (3 MB → 3 MB same), no EMAC, no ePWM/eCAP/eQEP modules Lacks Ethernet interface and motor control peripherals; suitable for non-networked safety controllers Select when Ethernet and advanced motor control are unnecessary and cost optimization is critical
S32K144HAT0MLHT NXP S32K144 uses single Cortex-M4F core with ASIL-B certified safety library; no lockstep CPU or FMPLL Targeted at ASIL-B applications like body control modules; lacks FlexRay and N2HET timing precision Choose for lower-cost ASIL-B designs where lockstep CPU and sub-microsecond timer resolution are not required

Compared with TMS570LS3137ZWTQQ1, the TMS570LS3135ZWT offers identical safety architecture and package compatibility but omits Ethernet and motor control peripherals, while the S32K144HAT0MLHT provides a cost-optimized ASIL-B alternative without lockstep execution or FlexRay, trading deterministic timing for broader automotive software ecosystem support.

Availability

TMS570LS3137ZWTQQ1 is available at Aetrix Electronics and suitable for electric power steering, braking systems, and battery management systems requiring stable component supply across extended automotive lifecycles.

Supply support for TMS570LS3137ZWTQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive, industrial, and power management solutions.

The TMS570LS3137ZWTQQ1 belongs to TI's Hercules™ safety microcontroller family, designed specifically for ASIL-D and SIL-3 applications demanding hardware-based fault detection, lockstep execution, and comprehensive diagnostic coverage.

FAQ

What safety certifications does the TMS570LS3137ZWTQQ1 support?

The TMS570LS3137ZWTQQ1 is architected to meet ISO 26262 ASIL-D and IEC 61508 SIL-3 requirements. Its dual lockstep CPUs, ECC memory, BIST logic, and ESM with ERROR pin provide hardware-level fault detection. TI supplies safety manuals, FMEDA reports, and diagnostic software libraries to support certification efforts for TMS570LS3137ZWTQQ1-based systems.

Does the TMS570LS3137ZWTQQ1 support Ethernet communication?

Yes, the TMS570LS3137ZWTQQ1 integrates a fully compliant IEEE 802.3 10/100 Mbps Ethernet MAC (EMAC) module supporting MII, RMII, and MDIO interfaces. It operates at 3.3-V I/O levels only and enables real-time vehicle networking, firmware updates over IP, and diagnostic telemetry without external PHY dependency.

How many CAN interfaces does the TMS570LS3137ZWTQQ1 include?

The TMS570LS3137ZWTQQ1 includes three Controller Area Network (DCAN) modules compliant with CAN Protocol Version 2.0B, each supporting up to 1 Mbps communication. These are used for vehicle bus communication, sensor fusion, and actuator coordination in safety-critical domains like braking and steering.

What is the role of the N2HET modules in the TMS570LS3137ZWTQQ1?

The TMS570LS3137ZWTQQ1 integrates two Next Generation High-End Timer (N2HET) modules - N2HET1 with 32 channels and N2HET2 with 18 channels - providing hardware-accelerated timing functions. They execute programmable microcode for PWM generation, input capture, and GPIO control with sub-microsecond resolution, offloading timing-critical tasks from the main CPU.

Can the TMS570LS3137ZWTQQ1 operate in extended temperature ranges?

Yes, the TMS570LS3137ZWTQQ1 is rated for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This makes it suitable for under-hood automotive applications including engine control, transmission, and brake modules where thermal resilience is essential.

TMX5703137BZWTQQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
337-LFBGA
Series:
Hercules™ TMS570 ARM® Cortex®-R
Packaging:
Tube
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

TMX5703137BZWTQQ1 FAQ

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For technical support, including TMX5703137BZWTQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMX5703137BZWTQQ1 requirements.

6.How does Aetrix verify that TMX5703137BZWTQQ1 is sourced from the original manufacturer or authorized distributors?

All TMX5703137BZWTQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMX5703137BZWTQQ1 meets industry standards.

7.What is the process for return or replacement of TMX5703137BZWTQQ1?

All TMX5703137BZWTQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMX5703137BZWTQQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMX5703137BZWTQQ1 part is unused and in its original packaging.

Return procedure for TMX5703137BZWTQQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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