Texas Instruments TPA122MSOPEVM

Overview

TPA122MSOPEVM from Texas Instruments is a stereo audio power amplifier evaluation module built around the TPA122 150-mW CMOS IC in MSOP package, operating from 2.5 V to 5.5 V, delivering ≤0.4% THD+N into 32-Ω headphones, with integrated shutdown control and pop-reduction circuitry - designed for rapid prototyping of portable audio interfaces, headphone drivers, and line-level output stages.

For engineers reviewing the TPA122MSOPEVM datasheet, TPA122MSOPEVM pinout, TPA122MSOPEVM application, or TPA122MSOPEVM equivalent, this page delivers verified board-level specifications, platform integration guidance, stand-alone wiring requirements, gain configuration options, and TI Plug-N-Play compatibility details - all grounded in SLOU025 user's guide and SLOS211 IC datasheet.

Technical Context

The TPA122MSOPEVM implements a fixed-gain (×4 inverting) stereo amplifier stage using the TPA122 IC, with input coupling via 1 µF capacitors, output coupling via 33–1000 µF capacitors, and shutdown controlled either by onboard switch S1 or external logic applied to the SD pin. It supports dual operation modes: plug-in use with the TI Plug-N-Play Audio Amplifier Evaluation Platform (socket U5), or stand-alone connection via 0.1-inch pitch header pins on the board underside.

Signal routing is configurable through platform switches S2 (signal conditioning bypass) and S3 (headphone source selection), while power can be supplied via platform VDD input (2.5–5.5 V), onboard 9-V battery, or external VCC (5–15 V) with onboard regulation. The module includes thermal/short-circuit protection and depop circuitry inherited from the TPA122 IC.

Key Specifications

Availability

TPA122MSOPEVM is available at Aetrix Electronics and suitable for audio subsystem validation, portable device reference design, and educational lab environments requiring stable component supply, traceable sourcing, and documented TI evaluation hardware.

Supply support for TPA122MSOPEVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and digital signal technologies since 1930.

The TPA122MSOPEVM belongs to TI's Mixed-Signal Products evaluation portfolio, developed specifically to accelerate audio amplifier design validation, reduce time-to-demonstration, and support rapid integration of TI's low-voltage stereo power amplifiers into portable and space-constrained systems.

FAQ

What is the TPA122MSOPEVM used for?

The TPA122MSOPEVM is an evaluation module designed to demonstrate and validate the performance of the TI TPA122 stereo audio power amplifier IC. It enables engineers to quickly evaluate audio quality, gain configuration, shutdown behavior, and output drive capability into headphones (32 Ω), speakers (8 Ω), or line-level loads (10 kΩ) - without PCB layout or soldering. The TPA122MSOPEVM supports both plug-in use with TI's Plug-N-Play platform and stand-alone bench testing.

Does the TPA122MSOPEVM include the TPA122 IC?

Yes, the TPA122MSOPEVM integrates the TI TPA122 150-mW stereo audio power amplifier IC in an MSOP package (marked as "TIAAE" on-board due to package size constraints). The IC is fully populated and functional, with supporting passive components including input/output coupling capacitors, feedback resistors, and a manual shutdown switch - making the TPA122MSOPEVM a complete, ready-to-power evaluation system.

Can the TPA122MSOPEVM be used without the TI Plug-N-Play platform?

Yes, the TPA122MSOPEVM is explicitly designed for stand-alone use. Its underside features 0.1-inch pitch single-in-line header pins (IN1, IN2, VDD, GND, VO1, VO2, SD) that allow direct connection to power supplies, signal sources, and loads via wire-wrap, perfboard, or soldered headers. The user's guide provides full pin mapping and recommended output coupling capacitor values (33–1000 µF) for headphone or line outputs - enabling integration into custom test fixtures or prototype systems independent of TI's platform.

What are the power supply requirements for the TPA122MSOPEVM?

The TPA122MSOPEVM operates from a regulated 2.5 V to 5.5 V DC supply applied to its VDD and GND pins, drawing up to 160 mA maximum. When used with the TI Plug-N-Play platform, power may be sourced from platform VDD input (2.5–5.5 V), onboard 9-V battery, or external VCC (5–15 V) with internal regulation. Reverse-polarity or overvoltage protection is implemented on the platform but not on the TPA122MSOPEVM itself - correct polarity and voltage must be ensured at the module's VDD/GND terminals during stand-alone use.

How is shutdown controlled on the TPA122MSOPEVM?

Shutdown on the TPA122MSOPEVM is controlled via the SD pin, which connects directly to the TPA122 IC's shutdown terminal. It can be activated either by pressing onboard switch S1 (pulling SD to VDD) or by applying a logic-high signal externally. In shutdown mode, the TPA122 IC draws only 65 µA (typical @ 5 V), disabling both amplifier channels and eliminating pop noise. When used with the Plug-N-Play platform, SD can also be driven automatically via headphone jack insertion/removal detection, configured using jumper JP7.