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Texas Instruments TPS2000EDGNR
- Part No.:
- TPS2000EDGNR
- Manufacturer:
- Texas Instruments
- Package:
- 8-PowerTSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TPS2000EDGNR.pdf
- Description:
- 2-A LOADING, 2.7-V TO 5.5-V, 70-
- Quantity:
- Payment:
- Shipping:
Inventory:2,492
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Product details
Overview
TPS2000EDGNR from Texas Instruments is a 2A current-limited power-distribution switch in an 8-pin HVSSOP PowerPAD™ package, designed for USB and peripheral power rail protection. It features ±20% accurate fixed current limiting, 2µs overcurrent response, reverse current blocking, and built-in soft-start. It operates across 2.7V–5.5V input rails and supports industrial temperature range (–40°C to 85°C) with UL/CB safety certification.
For engineers reviewing the TPS2000EDGNR datasheet, TPS2000EDGNR pinout, TPS2000EDGNR application, or TPS2000EDGNR equivalent, this device serves as a robust, thermally enhanced alternative to SOT-23 switches where higher current, lower RDS(ON), and improved thermal performance are required in USB host ports, gaming peripherals, and enterprise computing power delivery.
Technical Context
The TPS2000EDGNR integrates an N-channel MOSFET power switch with internal charge pump gate drive, enabling low RDS(ON) (70–105 mΩ) without external components. Its constant-current limiting architecture responds within 1.5 µs to short circuits while maintaining predictable fault current (2.1–3.5 A) across –40°C to 125°C junction temperature.
It implements deglitched active-low FLT reporting (6–12 ms), output discharge (~500 Ω), undervoltage lockout (2.0–2.6 V with 75 mV hysteresis), and thermal shutdown (135–175 °C rising threshold). Enable polarity is low-active (EN), compatible with TTL/CMOS logic, and supply current drops to ≤1 µA in shutdown mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 2 A - Fixed current limit enables predictable fault handling in USB and peripheral applications without external sensing. |
| RDS(ON) | 70–105 mΩ - Low conduction loss ensures minimal voltage drop and thermal rise at full load on 3.3V/5V rails. |
| Overcurrent Response Time | 1.5 µs - Enables rapid fault containment before upstream supply collapse or PCB trace damage. |
| Input Voltage Range | 2.7 V to 5.5 V - Supports both legacy 3.3V and standard 5V USB power domains with UVLO hysteresis. |
| Thermal Shutdown Threshold | 135–175 °C - Protects against sustained overload by cycling off/on only when junction exceeds safe limit. |
| FLT Deglitch Time | 6–12 ms - Prevents false fault assertions during startup transients or capacitive load turn-on surges. |
| Output Discharge Resistance | 400–810 Ω - Safely drains residual charge from downstream capacitance when disabled, meeting USB timing requirements. |
Pinout & Package
TPS2000EDGNR uses the DGN (HVSSOP-8 PowerPAD™) package: 3.00 mm × 3.00 mm body with exposed thermal pad. The PowerPAD must be soldered to a GND plane for optimal thermal performance (RθJA = 51.7 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 GND | Ground reference | Primary return path for power and logic; connects to PowerPAD for thermal conduction. |
| 2 IN | Power input | Drain of internal N-MOSFET; requires ≥0.1 µF ceramic bypass capacitor to GND near pin. |
| 3 IN | Power input | Dual IN pins reduce trace inductance and improve current sharing in high-current paths. |
| 4 EN | Enable control | Active-low logic input; pulls device into shutdown (<1 µA ISD) when <0.8 V; TTL/CMOS compatible. |
| 5 FLT | Fault indicator | Open-drain, active-low output asserted during overcurrent or overtemperature; deglitched (6–12 ms). |
| 6 OUT | Power output | Source of internal N-MOSFET; connects to load; reverse current blocked when disabled. |
| 7 OUT | Power output | Dual OUT pins support higher current routing and lower impedance to load. |
| 8 OUT | Power output | Third OUT terminal enhances thermal dissipation and reduces voltage drop under 2A load. |
Key Features
| Feature | Design Value |
|---|---|
| Fixed 2A current limit | ±20% accuracy ensures consistent trip point across voltage/temperature, eliminating need for external current-sense calibration. |
| Reverse current blocking | Prevents backflow from powered loads (e.g., hot-plugged peripherals) into the supply rail, protecting upstream sources. |
| Built-in soft-start | Controlled rise/fall times (0.4–1.5 ms) suppress inrush current and minimize input supply droop during turn-on. |
| PowerPAD™ thermal enhancement | Reduces RθJA to 51.7 °C/W - 3.6× better than SOT-23 DBV variant - enabling sustained 2A operation without heatsink. |
| UL Listed & CB File E169910 | Meets international safety standards for end-equipment certification, reducing compliance burden in USB host designs. |
Applications
| USB Host Port Protection | Gaming Peripheral Hub |
|---|---|
|
Use Scenario: Protecting downstream-facing USB ports in desktop PCs or docking stations against short circuits and hot-plug inrush. IC Role / Device Role / Timing Role: Power-distribution switch enforcing 2A current limit and providing deglitched fault signaling to system controller. Use Value: Prevents bus collapse during cable faults while maintaining USB BC1.2 charging compatibility and meeting 120 µF per-port bulk capacitance requirement. |
Use Scenario: Power management for multi-device gaming hubs (keyboards, mice, headsets) with mixed 3.3V/5V loads. IC Role / Device Role / Timing Role: Independent channel switch with reverse blocking and fast 1.5 µs fault response per port. Use Value: Enables individual port disable/recovery without affecting other connected devices; output discharge clears residual charge before re-enabling. |
| Enterprise Server Backplane | Industrial Human-Machine Interface |
|
Use Scenario: Hot-swap power control for modular I/O cards in data center servers requiring fault-isolated 5V distribution. IC Role / Device Role / Timing Role: Current-limited power switch with thermal cycling protection and FLT-driven system-level fault logging. Use Value: Sustains 2A continuous load with RDS(ON) <105 mΩ, minimizing power loss and enabling compact layout on dense backplanes. |
Use Scenario: Safe power enable for touchscreens, encoders, or sensors in factory automation panels subject to ESD and cable faults. IC Role / Device Role / Timing Role: Robust power switch with ±8 kV IEC 61000-4-2 contact ESD rating on OUT pin and reverse leakage <1 µA. Use Value: Eliminates need for external TVS diodes or current-sense ICs; UL/CB certification simplifies CE/UKCA marking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power-distribution switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS2001EDGK | VSSOP-8 package (no PowerPAD); RθJA = 169.6 °C/W; same electrical specs and pinout except thermal pad omission. | Limited to lower ambient temperatures or pulsed 2A loads; unsuitable for sustained 2A in enclosed enclosures. | Select TPS2001EDGK only when PCB lacks thermal plane capability or cost sensitivity outweighs thermal margin. |
| TPS2069EDGNR | 1.5A fixed current limit; identical DGN package, pinout, and feature set except lower IOS (1.6–2.66 A) and higher RDS(ON) (70–105 mΩ at 1.5A). | Better suited for USB 2.0 ports or low-power peripherals where 2A headroom is unnecessary. | Choose TPS2069EDGNR when design load is ≤1.5A and lower power dissipation is prioritized over peak current capability. |
Compared with TPS2001EDGK, TPS2000EDGNR delivers superior thermal performance via PowerPAD™; compared with TPS2069EDGNR, it provides 33% higher current capacity with identical footprint and control interface-enabling direct upgrade in existing DGN-layout designs.
Availability
TPS2000EDGNR is available at Aetrix Electronics and suitable for USB host protection, gaming peripheral hubs, and enterprise server backplane power distribution requiring stable component supply, long-term lifecycle support, and certified safety compliance.
Supply support for TPS2000EDGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-reliability power-switch design.
The TPS20xxE family was engineered specifically for USB-compliant, current-limited power distribution in consumer, computing, and industrial systems-emphasizing fast fault response, thermal resilience, and safety certification readiness.
FAQ
What is the enable polarity of the TPS2000EDGNR?
The TPS2000EDGNR features active-low enable (EN). When the EN pin voltage falls below 0.8 V, the device enters shutdown mode with supply current ≤1 µA. Logic high (>1.8 V) enables the power switch. This matches TI's low-enable switch portfolio and simplifies interface with microcontrollers lacking open-drain outputs.
Does the TPS2000EDGNR support reverse current blocking?
Yes, the TPS2000EDGNR blocks reverse current flow from OUT to IN when disabled or in UVLO. This prevents backfeeding from powered downstream loads into the supply rail-a critical requirement for USB host ports and hot-swap applications. Reverse leakage is specified at 0 µA (typical) at 25°C.
What is the purpose of the PowerPAD™ on the TPS2000EDGNR package?
The exposed thermal pad (PowerPAD™) on the TPS2000EDGNR must be soldered to a PCB ground plane to achieve its rated RθJA of 51.7 °C/W. Without this connection, thermal resistance degrades significantly, risking thermal shutdown under 2A continuous load. It serves as both thermal sink and electrical ground return.
How does the FLT pin behave during overtemperature events?
During overtemperature events, the FLT pin asserts active-low immediately upon thermal shutdown activation (≥135 °C). However, de-assertion is deglitched (6–12 ms), meaning FLT remains low until the junction cools ≥10 °C and stays stable. Disabling EN clears FLT instantly, enabling fast software-controlled recovery.
Can the TPS2000EDGNR operate from a 3.3V input rail?
Yes, the TPS2000EDGNR supports input voltages from 2.7 V to 5.5 V, including nominal 3.3V rails. Its internal charge pump ensures proper N-MOSFET gate drive across this range, and RDS(ON) remains within 70–110 mΩ at 3.3V/2A. UVLO releases at ≥2.6 V, ensuring reliable turn-on.
TPS2000EDGNR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 8-PowerTSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2A
- Rds On (Typ):
- 70mOhm
- Input Type:
- Non-Inverting
- Features:
- Output Discharge
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-HVSSOP
TPS2000EDGNR FAQ
1.How can I place an order for TPS2000EDGNR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS2000EDGNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS2000EDGNR reliable?
The price and inventory of TPS2000EDGNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS2000EDGNR is usually 5 days.
3.What payment methods are accepted for TPS2000EDGNR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS2000EDGNR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS2000EDGNR?
TPS2000EDGNR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS2000EDGNR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS2000EDGNR?
For technical support, including TPS2000EDGNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS2000EDGNR requirements.
6.How does Aetrix verify that TPS2000EDGNR is sourced from the original manufacturer or authorized distributors?
All TPS2000EDGNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS2000EDGNR meets industry standards.
7.What is the process for return or replacement of TPS2000EDGNR?
All TPS2000EDGNR units undergo pre-shipment inspection (PSI). If there is an issue with TPS2000EDGNR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS2000EDGNR part is unused and in its original packaging.
Return procedure for TPS2000EDGNR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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