My Inquiry
My Account
Texas Instruments TPS2001EDGNR
- Part No.:
- TPS2001EDGNR
- Manufacturer:
- Texas Instruments
- Package:
- 8-PowerTSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TPS2001EDGNR.pdf
- Description:
- 2-A LOADING, 2.7-V TO 5.5-V, 70-
- Quantity:
- Payment:
- Shipping:
Inventory:2,250
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS2001EDGNR from Texas Instruments is a 2A current-limited power-distribution switch in an 8-pin HVSSOP PowerPAD™ package, designed for USB and peripheral power rail protection. It features ±20% accurate fixed current limiting, 2µs overcurrent response, reverse current blocking, output discharge, and operates across 2.7V–5.5V input rails with –40°C to 85°C ambient range.
For engineers reviewing the TPS2001EDGNR datasheet, TPS2001EDGNR pinout, TPS2001EDGNR application, or TPS2001EDGNR equivalent, this device serves as a high-reliability, thermally robust load switch for short-circuit-prone 5V/3.3V systems-especially where fast fault reporting, controlled turn-on/turn-off, and thermal cycling resilience are required.
Technical Context
The TPS2001EDGNR integrates an N-channel MOSFET power switch with internal charge pump, enabling gate drive above VIN for low RDS(ON). Its constant-current limiting (2.8 A typical at 25°C, 2.1–3.5 A over temperature) activates within 1.5 µs during overload, maintaining predictable fault current without peaking.
It employs deglitched active-low FLT signaling (8 ms filter), undervoltage lockout (2.6 V rising threshold with 75 mV hysteresis), and built-in soft-start via controlled rise/fall times (0.4–1.5 ms tr, 0.05–0.5 ms tf). Thermal shutdown triggers at 135–175°C in current-limit mode and 155–195°C otherwise, with 10°C hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 2 A - supports sustained loads up to 2 A without derating under recommended conditions |
| Current Limit Accuracy | ±20% - ensures predictable fault current for upstream supply protection and system-level coordination |
| RDS(ON) | 70–105 mΩ - low conduction loss enables <100 mV drop at 2 A, preserving voltage margin on 3.3V/5V rails |
| Overcurrent Response Time | 1.5 µs - rapid detection minimizes energy dissipation during short circuits and prevents bus collapse |
| Input Voltage Range | 2.7 V to 5.5 V - compatible with standard USB, industrial 3.3V, and legacy 5V power domains |
| Enable Polarity | Active-high - logic-compatible with standard microcontroller GPIOs without inversion circuitry |
| Thermal Shutdown Threshold | 135–175°C (in current limit) - protects against sustained overload while allowing brief inrush tolerance |
Pinout & Package
TPS2001EDGNR uses the DGN (HVSSOP-8 PowerPAD™) package: 3.00 mm × 3.00 mm body with exposed thermal pad. The PowerPAD must be soldered to a PCB ground plane for optimal thermal performance (RθJB = 25.2°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN (Pins 2, 3) | Power input / MOSFET drain | Dual-input configuration reduces trace inductance; requires ≥0.1 µF ceramic bypass to GND near pins |
| GND (Pin 1) | Ground reference | Primary return path for power and logic; connects to PowerPAD for thermal and electrical integrity |
| EN (Pin 4) | Enable control input | Active-high TTL/CMOS-compatible signal; VIH ≥ 1.75 V (5.5 V VIN), VIL ≤ 0.8 V |
| FLT (Pin 5) | Open-drain fault flag | Asserts low during overcurrent or overtemperature; 8 ms deglitch prevents false triggers on transients |
| OUT (Pins 6, 7, 8) | Switched power output | Three parallel output pins reduce resistance and inductance; connect directly to load or downstream capacitance |
| PowerPAD | Thermal and electrical ground | Must be soldered to internal/external GND plane; floating use degrades thermal performance by >2× |
Key Features
| Feature | Design Value |
|---|---|
| Reverse current blocking | Prevents backflow from OUT to IN when disabled-critical for multi-rail systems and hot-swap compliance |
| Output discharge | 500 Ω typical pulldown discharges load capacitance rapidly upon disable, preventing floating or latch-up states |
| Built-in soft start | Controlled rise/fall times (0.4–1.5 ms) suppress inrush current surges that could destabilize shared input rails |
| UL Listed & CB File E169910 | Meets safety certification requirements for end-equipment without additional external isolation components |
| Fast, deglitched fault reporting | 8 ms FLT deglitch ensures reliable host MCU interrupt handling without software filtering overhead |
Applications
| USB Host Port Protection | Gaming Peripheral Hub |
|---|---|
|
Use Scenario: Protecting downstream-facing USB ports in desktop PCs or docking stations from short circuits caused by faulty cables or misinserted devices. IC Role / Device Role / Timing Role: Acts as a per-port current-limited power switch, enforcing BC1.2-compliant 2A delivery while isolating faults. Use Value: Enables safe hot-plug operation and prevents upstream 5V rail collapse-no manual reset or system reboot required after overload. |
Use Scenario: Power management for multi-device gaming hubs connecting keyboards, mice, headsets, and RGB lighting. IC Role / Device Role / Timing Role: Provides independent, current-limited 5V distribution with fast fault isolation between peripherals. Use Value: Eliminates cross-talk during short events; maintains uptime of non-faulted devices while FLT signals enable firmware-level diagnostics. |
| Industrial Printer Power Rail | Enterprise Server USB Expansion |
|
Use Scenario: Controlling power to motor drivers, sensors, and interface ICs in networked printers subject to capacitive inrush and cable shorts. IC Role / Device Role / Timing Role: Serves as a robust, thermally managed load switch on 5V auxiliary rails with reverse-blocking capability. Use Value: Prevents damage from reverse feed during maintenance; thermal cycling behavior avoids permanent shutdown during transient overloads. |
Use Scenario: Adding USB 3.x expansion capability to rack-mounted servers where reliability and fault containment are critical. IC Role / Device Role / Timing Role: Delivers stable 2A per port with UL-certified isolation, supporting hot-swap and remote monitoring via FLT. Use Value: Meets enterprise serviceability requirements-faults are contained per port and reported to BMC without affecting host CPU or other I/O. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power-distribution switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS2001EDBVR | SOT-23-5 package (2.9 × 1.6 mm); single IN/OUT pin; no PowerPAD; RθJA = 184.6°C/W vs. 51.7°C/W | Limited to lower-power, space-constrained designs; unsuitable for sustained 2A loads without significant derating | Select only when board area is critical and thermal margin exceeds 25°C at full load. |
| TPS2061DR | 1.5A rated; DGK (VSSOP-8) package; same footprint but no PowerPAD; RDS(ON) = 87 mΩ min | Lower current rating and higher thermal resistance make it incompatible for 2A continuous use cases | Use only if design load is capped at 1.5A and thermal budget allows ~30°C higher junction rise. |
Compared with TPS2001EDGNR, the DBVR offers smaller footprint but sacrifices thermal performance and current capacity, while the TPS2061DR shares the 8-pin layout but lacks PowerPAD cooling and delivers only 1.5A-neither provides drop-in replacement capability for 2A, high-reliability USB or industrial applications.
Availability
TPS2001EDGNR is available at Aetrix Electronics and suitable for USB host port protection, gaming peripheral hubs, industrial printer power rails, and enterprise server USB expansion requiring stable component supply and long-term lifecycle support.
Supply support for TPS2001EDGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power-switch solutions.
The TPS20xxE family was engineered specifically for USB-compliant, short-circuit-prone power distribution-delivering precise current limiting, fast fault response, and integrated thermal protection in compact packages.
FAQ
What is the maximum continuous output current supported by the TPS2001EDGNR?
The TPS2001EDGNR supports a continuous output current of 2 A under recommended operating conditions (VIN = 2.7 V to 5.5 V, TJ ≤ 125°C). Its current limit is specified as 2.1–3.5 A over temperature, ensuring robust short-circuit protection without false triggering during normal 2 A operation. This rating is validated for the DGN package with proper PCB thermal design.
Does the TPS2001EDGNR provide reverse current blocking, and how does it function?
Yes, the TPS2001EDGNR provides reverse current blocking when disabled: the internal N-channel MOSFET prevents current flow from OUT to IN, eliminating backfeed risks in multi-rail or hot-swap systems. This feature is inherent to its architecture and requires no external components-verified across –40°C to 85°C ambient and confirmed in TI's Electrical Characteristics table (IREV = 0 µA at 25°C).
How does the FLT pin behave during overcurrent and overtemperature events on the TPS2001EDGNR?
The FLT pin on the TPS2001EDGNR is an active-low open-drain output that asserts low during overcurrent or overtemperature faults. It includes an 8 ms deglitch filter on both edges to suppress transient noise. FLT clears immediately upon disabling EN or exiting UVLO, and remains high-impedance in those states-enabling direct connection to microcontroller interrupt inputs without pull-up conflicts.
What is the role of the PowerPAD in the TPS2001EDGNR DGN package, and is it mandatory to connect?
The PowerPAD in the TPS2001EDGNR DGN package serves as both thermal heatsink and electrical ground connection. TI specifies RθJB = 25.2°C/W only when the PowerPAD is soldered to a PCB ground plane; leaving it floating increases thermal resistance to >100°C/W, risking thermal shutdown at <1.2 A. Therefore, grounding the PowerPAD is mandatory for rated 2 A operation.
Can the TPS2001EDGNR be used in USB 2.0 or USB 3.x downstream-facing port (DFP) applications?
Yes-the TPS2001EDGNR is explicitly designed for USB applications, including downstream-facing ports. Its 2 A current limit, 2.7–5.5 V input range, fast 1.5 µs fault response, and UL/CB safety certification align with USB Battery Charging 1.2 and USB 3.x power delivery requirements. TI's Typical Application Diagram confirms 120 µF output capacitance support per hub, satisfying USB specification hold-up time mandates.
TPS2001EDGNR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 8-PowerTSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2A
- Rds On (Typ):
- 70mOhm
- Input Type:
- Non-Inverting
- Features:
- Output Discharge
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-HVSSOP
TPS2001EDGNR FAQ
1.How can I place an order for TPS2001EDGNR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS2001EDGNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS2001EDGNR reliable?
The price and inventory of TPS2001EDGNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS2001EDGNR is usually 5 days.
3.What payment methods are accepted for TPS2001EDGNR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS2001EDGNR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS2001EDGNR?
TPS2001EDGNR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS2001EDGNR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS2001EDGNR?
For technical support, including TPS2001EDGNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS2001EDGNR requirements.
6.How does Aetrix verify that TPS2001EDGNR is sourced from the original manufacturer or authorized distributors?
All TPS2001EDGNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS2001EDGNR meets industry standards.
7.What is the process for return or replacement of TPS2001EDGNR?
All TPS2001EDGNR units undergo pre-shipment inspection (PSI). If there is an issue with TPS2001EDGNR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS2001EDGNR part is unused and in its original packaging.
Return procedure for TPS2001EDGNR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS2001EDGNR Tags
-
TPS22919DCKR
Texas Instruments
-
MIC2091-1YM5-TR
Microchip Technology
-
MIC2090-1YM5-TR
Microchip Technology
-
TPS22995RZFR
Texas Instruments
-
TPS22975DSGR
Texas Instruments
-
SIP32510DT-T1-GE3
Vishay Siliconix
-
ULN2003D1013TR
STMicroelectronics
-
MIC2005A-1YM5-TR
Microchip Technology
-
MIC2005A-1YM6-TR
Microchip Technology
-
TPS22916BYFPR
Texas Instruments
-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
