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Texas Instruments TPS2012DRG4
- Part No.:
- TPS2012DRG4
- Manufacturer:
- Texas Instruments
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TPS2012DRG4.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:1 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,328
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Product details
Overview
TPS2012DRG4 from Texas Instruments is a high-side N-channel MOSFET power-distribution switch in SOIC-8 package, featuring 95-mΩ max on-resistance at 5.5 V input, 2-A typical short-circuit current limit, and logic-compatible enable input. It provides integrated short-circuit and thermal protection, controlled rise/fall times (≈3.5–4 ms), and operates across 2.7–5.5 V input range for USB peripheral power management and hot-swap applications.
For engineers reviewing the TPS2012DRG4 datasheet, TPS2012DRG4 pinout, TPS2012DRG4 application, or TPS2012DRG4 equivalent, key selection criteria include its 2-A current-limit threshold, SOIC-8 drop-in compatibility with Siliconix Littlefoot™ PMOS switches (with GND connected), thermal shutdown at ≈180°C, and <10-µA standby current - all critical for robust 5-V rail protection in embedded systems.
Technical Context
The TPS2012DRG4 implements a charge-pump–driven gate control architecture to sustain full enhancement of its high-side N-channel MOSFET down to 2.7 V input. Its internal current-sense FET enables precise constant-current limiting without series resistive loss, while thermal sensing triggers automatic shutdown and hysteresis-based recovery.
Unlike discrete switch solutions, it integrates rise/fall time control (2–4 ms) to suppress inrush current and EMI during capacitive load switching. The EN pin accepts TTL/CMOS logic levels and disables bias to reduce supply current to <10 µA - essential for low-power system states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-resistance (max) | 95 mΩ at VI(IN) = 5.5 V - limits I²R loss and self-heating under 2-A load |
| Short-circuit current limit | 2 A typical at 25°C - defines safe continuous overload handling before thermal shutdown |
| Input voltage range | 2.7 V to 5.5 V - supports single-supply operation across USB 2.0, 3.3-V, and 5-V rails |
| Output rise/fall time | 3.5–4 ms with 1-µF load - actively suppresses inrush surges and EMI generation |
| Standby supply current | ≤10 µA when EN = high - enables ultra-low quiescent power in system sleep modes |
| Thermal shutdown threshold | ≈180°C junction temperature - protects against sustained overloads or shorts |
| ESD rating | 12-kV HBM on OUT, 6-kV on all other terminals - ensures robustness in handling and board assembly |
Pinout & Package
TPS2012DRG4 is housed in an 8-pin SOIC (D) package with exposed pad not present; footprint matches industry-standard SOIC-8 (JEDEC MS-012). Pin 1 is located at top-left corner with notch or dot marking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 1) | Ground reference | Return path for internal charge pump, driver, and thermal sense circuits; must be connected for proper operation |
| IN (Pins 2,3) | Power input | Dual-input configuration reduces trace resistance and voltage drop; parallel connection required per datasheet |
| EN (Pin 4) | Enable control | Active-low logic input; drives switch ON when low (0 V), OFF when high (≥2 V); compatible with TTL/CMOS |
| OUT (Pins 5–8) | Switched output | Four paralleled output pins minimize conduction loss and thermal stress under 2-A load |
Key Features
| Feature | Design Value |
|---|---|
| Integrated charge pump | 100-kHz internal oscillator enabling full gate drive down to 2.7-V input without external components |
| Controlled switching transitions | Rise/fall times fixed at ~3.5–4 ms to limit di/dt, suppress EMI, and prevent bus voltage droop during hot-plug |
| Current-limit accuracy | 2-A typical threshold with ±50% variation over temperature - sufficient for predictable fault containment |
| Thermal protection hysteresis | ≈20°C recovery margin after shutdown - prevents oscillation and allows safe cooldown before re-enabling |
| Logic-level enable interface | EN pin thresholds (0.4 V low / 2 V high) ensure compatibility with 3.3-V and 5-V microcontrollers without level-shifting |
Applications
| USB Peripheral Power Switching | Industrial I/O Module Protection |
|---|---|
|
Use Scenario: Powering USB-connected sensors, actuators, or dongles from a shared 5-V rail where hot-plug events and cable shorts are common. IC Role / Device Role / Timing Role: High-side load switch controlling power delivery; enables/disables downstream bus segments via microcontroller GPIO. Use Value: Prevents host port damage during short circuits, eliminates manual reset requirements, and avoids system-wide brownouts caused by uncontrolled inrush. |
Use Scenario: Isolating field-side 24-V DC-powered I/O channels in programmable logic controllers with 5-V logic interfaces. IC Role / Device Role / Timing Role: Protected power gate between isolated power domain and digital control logic; enables channel-level fault containment. Use Value: Limits fault current to 2 A during wiring errors or sensor failures, preserving upstream regulators and allowing continued operation of unaffected channels. |
| Embedded System Rail Management | Hot-Swap Board Power Control |
|
Use Scenario: Managing auxiliary 5-V supplies for Wi-Fi modules, displays, or audio codecs in battery-powered edge devices. IC Role / Device Role / Timing Role: Low-quiescent power distribution switch activated only during active use; supports deep-sleep mode via EN pin. Use Value: Reduces standby current to <10 µA per switched rail, extending battery life without sacrificing fast wake-up response (<40 ms turn-off delay). |
Use Scenario: Enabling safe insertion/removal of daughterboards in modular test equipment or telecom line cards. IC Role / Device Role / Timing Role: Controlled power sequencer that ramps output voltage gradually to avoid backplane transients. Use Value: Eliminates arcing and contact bounce effects during mating; rise time control ensures smooth voltage ramp and prevents false resets in downstream logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side power-switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS2012DR | Identical electrical specs and SOIC-8 package; differs only in lead finish (NIPDAU vs. NIPDAU-G4) and tape/reel packaging | No functional difference; both rated for –40°C to 85°C ambient and support same PCB layout | Select TPS2012DRG4 if RoHS-compliant NIPDAU-G4 finish and large-tape-reel (2500-unit) logistics are required |
| TPS2051BDBVR | Lower 1.5-A current limit, 115-mΩ RON, same SOIC-5 package but single IN/OUT pin - no multi-pin paralleling | Not pin-compatible; lacks dual IN and quad OUT pins - unsuitable for high-current or low-drop applications requiring TPS2012DRG4's layout | Choose only if design tolerates higher conduction loss and reduced fault-current headroom; verify thermal derating at target load |
Compared with TPS2012DR and TPS2051BDBVR, the TPS2012DRG4 offers identical performance to TPS2012DR but with TI's enhanced G4 finish for improved solderability and reliability, while TPS2051BDBVR trades current capacity and package optimization for cost and footprint reduction - making it suitable only for lower-power implementations.
Availability
TPS2012DRG4 is available at Aetrix Electronics and suitable for USB peripheral power management, industrial I/O protection, and embedded rail sequencing requiring stable component supply and long-term lifecycle support.
Supply support for TPS2012DRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power IC design.
The TPS201x family was engineered specifically for robust power distribution in environments prone to heavy capacitive loads and short circuits - targeting USB, industrial control, and embedded computing applications demanding fault resilience and minimal external components.
FAQ
What is the maximum continuous output current supported by the TPS2012DRG4?
The TPS2012DRG4 is internally current-limited to a typical 2-A short-circuit threshold at 25°C. Its recommended maximum continuous load current is 1 A per the datasheet's operating conditions table. Sustained operation near the 2-A limit requires careful thermal design due to power dissipation in the 95-mΩ MOSFET, especially at elevated ambient temperatures or low input voltages.
Does the TPS2012DRG4 require external components for basic operation?
No, the TPS2012DRG4 requires no external components for core functionality: its internal 100-kHz charge pump, current-sense circuitry, and thermal protection operate autonomously. However, TI recommends a 0.047–0.1-µF ceramic bypass capacitor between IN and GND, plus a 0.1-µF capacitor at OUT, to ensure stability, ESD immunity, and optimal transient response in production designs.
Is the TPS2012DRG4 pin-compatible with Siliconix Littlefoot™ PMOS switches?
Yes - the TPS2012DRG4 in SOIC-8 (D) package is explicitly designed as a drop-in replacement for Siliconix Littlefoot™ PMOS power switches, provided GND (Pin 1) is connected. This compatibility simplifies legacy design upgrades while delivering superior performance: lower on-resistance, tighter current limiting, and integrated thermal protection absent in the older PMOS devices.
How does the TPS2012DRG4 behave during a sustained short circuit?
When a short occurs, the TPS2012DRG4 immediately enters constant-current mode at ≈2 A, reducing output voltage to maintain current. If power dissipation raises junction temperature to ≈180°C, thermal protection shuts off the switch. After cooling by ≈20°C, it automatically recovers - cycling on/off until the fault is removed. This prevents permanent damage while maintaining system awareness of the fault condition.
What is the significance of the "G4" suffix in TPS2012DRG4?
The "G4" suffix denotes Texas Instruments' enhanced lead finish: matte tin (NIPDAU-G4), optimized for superior solderability, reduced voiding, and improved reliability in lead-free reflow processes. It meets JEDEC J-STD-020 moisture sensitivity Level-1 (260°C peak) and is RoHS-compliant - distinguishing it from standard NIPDAU-finished variants like TPS2012DR while maintaining full electrical and mechanical equivalence.
TPS2012DRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 1A
- Rds On (Typ):
- 75mOhm
- Input Type:
- Non-Inverting
- Features:
- -
- Fault Protection:
- Current Limiting (Fixed), Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TPS2012DRG4 FAQ
1.How can I place an order for TPS2012DRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS2012DRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS2012DRG4 reliable?
The price and inventory of TPS2012DRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS2012DRG4 is usually 5 days.
3.What payment methods are accepted for TPS2012DRG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS2012DRG4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS2012DRG4?
TPS2012DRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS2012DRG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS2012DRG4?
For technical support, including TPS2012DRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS2012DRG4 requirements.
6.How does Aetrix verify that TPS2012DRG4 is sourced from the original manufacturer or authorized distributors?
All TPS2012DRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS2012DRG4 meets industry standards.
7.What is the process for return or replacement of TPS2012DRG4?
All TPS2012DRG4 units undergo pre-shipment inspection (PSI). If there is an issue with TPS2012DRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS2012DRG4 part is unused and in its original packaging.
Return procedure for TPS2012DRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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