Texas Instruments TPS2062ADRBR

Overview

TPS2062ADRBR from Texas Instruments is a dual-channel, current-limited, high-side power-distribution switch featuring two 70 mΩ N-channel MOSFETs, 1 A continuous per-channel output, 2.7 V to 5.5 V input operation, thermal/short-circuit protection, and active-low enable logic - used in USB host ports, industrial I/O modules, and embedded systems requiring robust hot-swap capability.

For engineers reviewing the TPS2062ADRBR datasheet, TPS2062ADRBR pinout, TPS2062ADRBR application, or TPS2062ADRBR equivalent, this page delivers verified electrical specs, validated SO-8 (DRB) package mapping, confirmed dual-channel current-limit behavior (1.2–2.0 A), real-world soft-start timing (0.6 ms rise), and precise OCx fault reporting with 8 ms deglitch - all critical for USB-compliant power rail design and fault-tolerant system architecture.

Technical Context

The TPS2062ADRBR integrates an internal charge pump enabling full gate drive of its dual N-channel MOSFETs down to 2.7 V input, eliminating external boost components. Its current-limit architecture operates in constant-current mode above 1.2 A (min), with thermal shutdown triggered at ≥135°C and automatic recovery after cooling by ~10°C.

Each channel features independent overcurrent detection with open-drain OC1/OC2 outputs (active low, deglitched 4–15 ms), undervoltage lockout (2.0–2.6 V turn-on threshold), and bidirectional switching capability. Enable inputs are active low, and PowerPAD™ must be externally connected to GND for thermal compliance in the DRB-8 SON package.

Key Specifications

Pinout & Package

TPS2062ADRBR uses the DRB-8 (SON) 2 mm × 2 mm, 0.65 mm pitch, thermally enhanced package with exposed PowerPAD™ on bottom - requires external solder connection of PowerPAD™ to GND plane for optimal thermal performance and UL certification compliance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel current-limited power-switch applications.

Compared with TPS2062AD and TPS2052BDR, the TPS2062ADRBR uniquely balances 1 A per-channel capacity, ultra-low thermal resistance (47.5°C/W), and UL-certified ganged operation - making it the optimal choice for space-constrained, high-reliability USB and industrial power-distribution designs.

Availability

TPS2062ADRBR is available at Aetrix Electronics and suitable for USB host ports, industrial I/O modules, and embedded system power sequencing requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for TPS2062ADRBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, precision, and industrial-grade performance.

The TPS206xA family was designed specifically for robust power distribution in USB, industrial, and medical systems where short-circuit resilience, accurate current limiting, and thermal fault containment are mandatory.

FAQ

What is the maximum continuous current per channel for the TPS2062ADRBR?

The TPS2062ADRBR supports 1 A continuous output current per channel under recommended operating conditions (–40°C to 85°C ambient, proper PCB thermal design). Its current-limit threshold is specified from 1.2 A (min) to 2.0 A (max), ensuring reliable operation within this range without damage. The device enters constant-current mode above the trip threshold and maintains output regulation until thermal shutdown intervenes.

Does the TPS2062ADRBR require external components for gate drive or current sensing?

No, the TPS2062ADRBR integrates an internal charge pump and gate driver, eliminating the need for external boost capacitors or gate resistors. It also uses a sense FET instead of an external current-sense resistor, preserving low rDS(on) and minimizing board space. Only 0.1 μF ceramic bypass capacitors on IN and each OUT are required for stable operation - no external current-sense or gate-drive components needed for basic functionality.

How does the OC1 and OC2 fault reporting work on the TPS2062ADRBR?

OC1 and OC2 are open-drain, active-low outputs that assert during overcurrent or thermal fault on their respective channels. Each is deglitched with a 4–15 ms internal delay to suppress false triggers from inrush transients, but thermal faults de-assert immediately upon cooling. The TPS2062ADRBR's OCx pins require external pull-up resistors (typically 10 kΩ to VCC) and interface directly with microcontroller GPIOs for real-time fault logging and recovery control.

Can the TPS2062ADRBR be used in ganged (parallel) mode for higher current delivery?

Yes, the TPS2062ADRBR supports ganged operation: tying OUT1 and OUT2 together enables combined current delivery with a ganged short-circuit limit of 2.4–4.0 A (min–max). UL certification (File E169910) explicitly covers ganged configurations. However, EN1 and EN2 must be tied together, and OC1/OC2 should be wire-OR'd to detect any channel fault - full ganged behavior is validated and documented in TI's SLVS798G datasheet.

What is the role of the PowerPAD™ on the TPS2062ADRBR DRB-8 package?

The PowerPAD™ on the TPS2062ADRBR is an exposed thermal pad on the underside of the DRB-8 SON package. It must be soldered directly to a PCB ground plane to achieve rated thermal performance (RθJA = 47.5°C/W) and meet UL safety certification requirements. Leaving it unconnected degrades thermal resistance by >3× and voids UL listing - TI specifies external connection to the GND pin as mandatory for production use.