Texas Instruments TPS2064DGN

Overview

TPS2064DGN from Texas Instruments is a dual-channel, current-limited, high-side power-distribution switch with 70-mΩ on-resistance, 1.5-A continuous output current per channel, active-high enable inputs, and integrated thermal/short-circuit protection. It operates from 2.7 V to 5.5 V and is used in USB host/hub power management and hot-plug module control.

For engineers reviewing the TPS2064DGN datasheet, TPS2064DGN pinout, TPS2064DGN application, or TPS2064DGN equivalent, key selection criteria include dual independent enable control, deglitched open-drain overcurrent reporting (OC1/OC2), reverse current blocking, 0.6-ms typical rise time, and DGN-8 package compatibility with PowerPad thermal grounding.

Technical Context

The TPS2064DGN integrates two independent N-channel MOSFET high-side switches, each driven by an internal charge pump enabling operation down to 2.7 V without external components. Each channel features separate logic-level enable (EN1/EN2, active high) and dedicated open-drain overcurrent flag (OC1/OC2).

Current limiting is implemented via sense-FET architecture with 1.6 A minimum / 2.6 A maximum trip threshold; thermal shutdown activates at ~135°C with 10°C hysteresis. Undervoltage lockout disables switching below ~2 V, and reverse current blocking prevents backflow when IN is unpowered.

Key Specifications

Pinout & Package

DGN-8 package: 3 mm × 3 mm thermally enhanced MSOP with exposed PowerPad (must be soldered to GND for thermal and CB certification compliance).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel power-switch applications.

Compared with TPS2064DRB and TPS2054DGN, the TPS2064DGN uniquely combines 1.5-A dual-channel capability, thermal shutdown, and CB-certified DGN-8 packaging-making it the only option qualified for USB host hubs requiring safety certification and sustained 1-A loads.

Availability

TPS2064DGN is available at Aetrix Electronics and suitable for USB host/hub designs, hot-plug module interfaces, redundant power distribution, and industrial peripheral gating requiring stable component supply across commercial temperature ranges.

Supply support for TPS2064DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade qualification.

The TPS206x product line was designed specifically for USB-compliant power distribution and hot-plug applications-integrating protection, control, and reporting in compact surface-mount packages.

FAQ

What is the recommended PCB layout practice for the PowerPad on the TPS2064DGN?

The PowerPad on the TPS2064DGN must be soldered to a solid GND copper pour with ≥4 thermal vias (0.3-mm diameter) connecting to inner or bottom-layer ground planes. This satisfies CB certification requirements, reduces θJA to 137°C/W, and prevents thermal shutdown under 1.5-A continuous load at 70°C ambient.

Does the TPS2064DGN support simultaneous enablement of both channels, and how is sequencing handled?

Yes, the TPS2064DGN supports simultaneous enablement via independent EN1 and EN2 pins, both active-high. No internal sequencing is enforced-designers may assert EN1 and EN2 together for parallel turn-on or stagger them (e.g., 10-ms delay) to reduce peak inrush. Rise time remains ~0.6 ms per channel regardless of enable timing.

How does the TPS2064DGN handle reverse current, and is external diode protection needed?

TPS2064DGN provides inherent reverse current blocking: when IN is de-energized while OUT1/OUT2 remain biased, the internal N-channel MOSFET body diode is reverse-biased and the gate is held off, preventing backfeed. No external Schottky diode is required-this is confirmed in the "Reverse leakage current" spec (0.2 µA max at 5.5 V).

What is the behavior of OC1 and OC2 during power-up, and can they be safely tied to a microcontroller GPIO?

OC1 and OC2 are open-drain outputs with 4–15 ms deglitching and are inactive (high-impedance) until valid IN voltage exceeds UVLO threshold (~2 V). They can be directly connected to 3.3-V or 5-V microcontroller GPIOs with pull-up resistors (e.g., 10 kΩ). No false assertion occurs at power-up due to built-in deglitch and UVLO synchronization.

Is the TPS2064DGN UL listed, and what certifications apply to the DGN-8 package?

Yes, the TPS2064DGN is UL listed under File No. E169910. The DGN-8 package variant is also CB certified when the PowerPad is connected to GND per TI's SLMA002 guidelines-meeting IEC 60950-1 and IEC 62368-1 safety requirements for end-equipment power distribution.