Texas Instruments TPS2066DGN

Overview

TPS2066DGN from Texas Instruments is a dual-channel, current-limited, high-side power-distribution switch featuring two 70 mΩ N-channel MOSFETs, 1 A continuous output per channel, thermal and short-circuit protection, and operation from 2.7 V to 5.5 V supply. It is used in USB peripheral ports and hot-swap interfaces where controlled inrush into heavy capacitive loads is required.

For engineers reviewing the TPS2066DGN datasheet, TPS2066DGN pinout, TPS2066DGN application, or TPS2066DGN equivalent, key selection criteria include per-channel current limit accuracy (1.1–1.9 A), rise time (0.6 ms typical), undervoltage lockout threshold (2.0–2.6 V), bidirectional switching capability, and HVSSOP-8 package thermal performance (R_θJA = 53.6 °C/W).

Technical Context

The TPS2066DGN integrates two independent high-side power switches with internal charge-pump gate drive enabling full enhancement down to 2.7 V input. Each channel features dedicated enable (EN1/EN2, active-high) and overcurrent reporting (OC1/OC2, open-drain active-low) pins, supporting discrete control and fault monitoring.

Its flat current-limit architecture maintains constant output current (IOS) during overload without trip-and-shutdown behavior - limiting at 1.5 A typical across temperature - while thermal shutdown activates only under sustained fault conditions (>135 °C junction). The deglitched OC outputs suppress false triggers during power-up or transient load events.

Key Specifications

Pinout & Package

HVSSOP-8 (DGN) package with exposed PowerPAD™ thermally connected to GND; 0.65 mm pitch, 3.0 mm × 3.0 mm footprint, 1.0 mm height. PowerPAD must be soldered to PCB ground plane for thermal compliance (R_θJB = 35.5 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel power-switch applications.

Compared with TPS2066DGN, TPS2062DR trades thermal performance for ease of hand-soldering and legacy footprint compatibility, while TPS2052BDR reduces capability to cut cost - neither offers the same combination of 1 A/channel, accurate current limit, dual OC reporting, and HVSSOP thermal efficiency.

Availability

TPS2066DGN is available at Aetrix Electronics and suitable for USB peripheral protection, industrial hot-swap modules, and embedded power sequencing requiring stable component supply and long-term manufacturability.

Supply support for TPS2066DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management IC design and manufacturing.

The TPS206x family was engineered specifically for robust, low-EMI power distribution in USB and hot-swap applications - emphasizing precise current limiting, thermal resilience, and minimal external component count.

FAQ

What is the maximum continuous current per channel for the TPS2066DGN?

The TPS2066DGN supports 1 A continuous output current per channel under recommended operating conditions (T_A ≤ 85°C, proper PCB thermal design). This rating is maintained across the full 2.7–5.5 V input range and is validated with the HVSSOP-8 PowerPAD™ soldered to a 1-in² ground plane. Exceeding 1 A may trigger current limiting or thermal shutdown depending on ambient and layout conditions.

Does the TPS2066DGN support bidirectional current flow?

Yes, the TPS2066DGN supports bidirectional current flow when enabled - meaning load current can flow from IN to OUT (normal operation) or from OUT to IN (e.g., backfeeding during hot-swap disconnect). However, it does not allow reverse conduction when disabled; the high-side N-MOSFET blocks all current in the off state, preventing backpowering of the input rail.

How does the overcurrent (OC) reporting work on the TPS2066DGN?

The TPS2066DGN provides two independent open-drain, active-low OC outputs (OC1 and OC2), each corresponding to its respective channel. When current exceeds the 1.1–1.9 A limit, the associated OC pin pulls low after a 4–15 ms deglitch delay to reject noise. The output remains low until current falls below the hysteresis threshold, enabling reliable microcontroller interrupt handling without software debouncing.

What is the purpose of the PowerPAD™ on the TPS2066DGN package?

The exposed PowerPAD™ on the HVSSOP-8 package of the TPS2066DGN is internally connected to GND and serves as the primary thermal conduction path. Soldering it to a PCB ground plane reduces R_θJB to 35.5 °C/W - essential for sustaining 1 A per channel at elevated ambient temperatures. Omitting PowerPAD™ soldering risks thermal shutdown even at moderate loads due to excessive junction temperature rise.

Can the TPS2066DGN operate from a 3.3 V supply?

Yes, the TPS2066DGN operates fully across 2.7 V to 5.5 V, including 3.3 V nominal rails. At 3.3 V input, r_DS(on) increases to 135 mΩ typical (vs. 70 mΩ at 5 V), resulting in ~180 mW conduction loss at 1 A. Rise time extends to ~0.8 ms, but remains within specification. All logic thresholds (EN, OC) remain compatible with 3.3 V CMOS/TTL levels.