Texas Instruments TPS2069CDGNR-2

Overview

TPS2069CDGNR-2 from Texas Instruments is a 1.5-A current-limited power-distribution switch in an 8-pin MSOP-PowerPAD package, designed for 5-V USB and peripheral power rails. It features ±20% accurate fixed current limiting, 2-µs overcurrent response, reverse current blocking, built-in soft start, and operates from –40°C to 85°C ambient temperature.

For engineers reviewing the TPS2069CDGNR-2 datasheet, TPS2069CDGNR-2 pinout, TPS2069CDGNR-2 application, or TPS2069CDGNR-2 equivalent, key selection criteria include output discharge absence (C-2 variant), thermal shutdown at 135°C (in current limit), R_DS(on) of 69 mΩ (typ) at 25°C, and compatibility with TTL/CMOS enable logic.

Technical Context

The TPS2069CDGNR-2 integrates an N-channel MOSFET power switch with internal charge pump gate drive, enabling low R_DS(on) without external high-side driver circuitry. Its constant-current limiting architecture maintains predictable fault current under short-circuit conditions, independent of load impedance.

Unlike the TPS2069C variant, the TPS2069CDGNR-2 omits output discharge (RPD), resulting in no active pulldown on OUT when disabled-critical for systems requiring voltage hold-up or isolation during disable. Fault reporting uses a deglitched active-low open-drain FLT signal with 6–12 ms blanking.

Key Specifications

Pinout & Package

TPS2069CDGNR-2 is housed in an 8-pin MSOP-PowerPAD (DGN) package measuring 3.00 mm × 3.00 mm, with the exposed PowerPAD thermally and electrically connected to GND for enhanced heat dissipation and EMI reduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power-distribution switch applications.

Compared with TPS2069CDGNR and TPS2068CDGNR, the TPS2069CDGNR-2 uniquely omits output discharge-making it optimal for systems needing voltage retention post-disable-while retaining identical current rating, thermal shutdown behavior, and pin-compatible layout.

Availability

TPS2069CDGNR-2 is available at Aetrix Electronics and suitable for USB host port protection, set-top box peripheral rails, and HD TV USB hub applications requiring stable component supply, long-term lifecycle support, and automotive-grade reliability validation.

Supply support for TPS2069CDGNR-2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The TPS20xxC family was engineered specifically for USB-compliant 5-V power distribution, emphasizing fast fault response, thermal resilience, and integration to replace discrete protection circuits in space-constrained endpoints.

FAQ

What is the key functional difference between TPS2069CDGNR-2 and TPS2069CDGNR?

The TPS2069CDGNR-2 lacks output discharge (RPD) functionality, whereas TPS2069CDGNR includes a 470-Ω pulldown resistor on OUT when disabled. This makes TPS2069CDGNR-2 ideal for applications requiring voltage hold-up on the load side after disable-such as preserving state in USB-connected peripherals-while TPS2069CDGNR is suited for fast discharge to meet USB suspend timing. Both share identical current rating, pinout, and thermal shutdown behavior.

Does TPS2069CDGNR-2 support 3.3-V input operation?

No, TPS2069CDGNR-2 is specified only for 4.5 V to 5.5 V input operation per its Recommended Operating Conditions. It does not support 3.3-V rails. Attempting to operate below 4.5 V may cause undervoltage lockout (UVLO) activation, disabling the switch and asserting FLT. For 3.3-V applications, consider TI's TPS229xx ultra-low-I_Q load switches instead.

How does the FLT pin behave during thermal shutdown on TPS2069CDGNR-2?

During thermal shutdown, the FLT pin on TPS2069CDGNR-2 asserts low (active) and remains low throughout the thermal cycle-i.e., while the junction temperature exceeds 135°C (in current limit) and during the cooldown phase until temperature drops by ≥20°C. FLT deasserts only after the device fully recovers and resumes normal regulation, providing unambiguous fault status to the host controller.

Can TPS2069CDGNR-2 be used in parallel to increase current capacity?

No, TPS2069CDGNR-2 is not designed for parallel operation. Its current-limit threshold has ±20% tolerance, and mismatched turnon/turnoff timing between devices would cause uneven current sharing and potential thermal runaway. For >1.5-A applications, select a higher-rated switch such as TPS2001C (2-A) or use a discrete solution with current-sharing circuitry.

What is the recommended PCB layout practice for the PowerPAD on TPS2069CDGNR-2?

The PowerPAD on TPS2069CDGNR-2 must be soldered to a solid, low-thermal-resistance GND copper pour covering ≥50% of the pad area. Use ≥4 thermal vias (0.3-mm diameter, spaced ≤1 mm apart) connecting the pad to inner-layer or backside GND planes. Avoid solder mask over the PowerPAD and ensure stencil aperture matches the land pattern exactly to prevent voiding and ensure consistent thermal performance (R_θJA = 67.1°C/W).