Texas Instruments TPS2069EDGNR

Overview

TPS2069EDGNR from Texas Instruments is a 1.5A current-limited, high-side power-distribution switch in an 8-pin HVSSOP PowerPAD™ package, designed for USB and peripheral power rail protection. It features ±20% accurate fixed current limiting, 2µs overcurrent response, reverse current blocking, output discharge, and operates across 2.7V–5.5V input rails with –40°C to 85°C ambient range.

For engineers reviewing the TPS2069EDGNR datasheet, TPS2069EDGNR pinout, TPS2069EDGNR application, or TPS2069EDGNR equivalent, this device serves as a robust, UL-listed solution for short-circuit-prone 5V/3.3V loads in computing, gaming, and connected peripherals-where predictable fault current, fast deglitched fault reporting, and thermal shutdown coordination are critical selection criteria.

Technical Context

The TPS2069EDGNR integrates an N-channel MOSFET power switch with internal charge pump, enabling gate drive above VIN for low R_DS(ON) (70–105 mΩ) without external components. Its constant-current limiting engages within 1.5 µs during short circuits, maintaining output current at 1.5 A regardless of load impedance while regulating V_OUT = I_OS × R_LOAD.

Functional modes include active operation (EN > 1.8 V, VIN > 2.6 V), UVLO shutdown (<2.0 V), and thermal cycling (shutdown at 135–175°C with 10°C hysteresis). The FLT pin delivers deglitched (6–12 ms), active-low open-drain fault signaling, and the PowerPAD™ must be connected to GND for optimal thermal performance (R_θJA = 51.7°C/W).

Key Specifications

Pinout & Package

TPS2069EDGNR uses the DGN (HVSSOP-8 PowerPAD™) package: 3.00 mm × 3.00 mm body with exposed thermal pad. The PowerPAD™ must be soldered to a GND plane for effective heat dissipation (R_θJC(bot) = 6.4°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power-distribution switch applications.

Compared with TPS2068EDGNR and TPS2051BDGNR, the TPS2069EDGNR uniquely combines active-high enable, 1.5 A current limit with ±20% accuracy, full thermal shutdown with hysteresis, and UL listing-making it the only option among the three qualified for mid-power USB-compliant peripheral protection with safety certification.

Availability

TPS2069EDGNR is available at Aetrix Electronics and suitable for PC and notebook power management, gaming peripheral protection, and enterprise docking station designs requiring stable component supply, long-term lifecycle assurance, and UL-certified short-circuit resilience.

Supply support for TPS2069EDGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-reliability power-switch solutions.

The TPS20xxE family was engineered specifically for USB-compliant, high-capacitance load environments-delivering predictable current limiting, fast fault response, and integrated thermal protection without external components.

FAQ

What is the maximum continuous output current supported by the TPS2069EDGNR?

The TPS2069EDGNR supports a maximum continuous output current of 1.5 A, with a fixed current-limit threshold accurate to ±20% across –40°C to 125°C junction temperature. This value is guaranteed under all operating conditions including short-circuit events, and the device enters constant-current mode immediately upon exceeding the limit-ensuring predictable fault behavior without peaking. The TPS2069EDGNR maintains this 1.5 A limit regardless of input voltage (2.7–5.5 V) or load configuration.

Does the TPS2069EDGNR provide reverse current blocking, and how does it function?

Yes, the TPS2069EDGNR provides inherent reverse current blocking when disabled. Its internal N-channel MOSFET architecture ensures that current cannot flow from VOUT back to VIN when the switch is off-even with VOUT > VIN. This eliminates the need for an external blocking diode in applications like USB downstream ports or hot-swap slots. Reverse leakage is specified at 0 µA (typical) at 25°C, confirming effective isolation without added conduction loss or voltage drop.

How does the FLT pin on the TPS2069EDGNR behave during overcurrent and overtemperature events?

The FLT pin on the TPS2069EDGNR is an active-low, open-drain output that asserts (pulls low) during both overcurrent and overtemperature conditions. It features a built-in 6–12 ms deglitch timer on both assertion and de-assertion edges to prevent false triggering from transient spikes. When the TPS2069EDGNR is disabled or in UVLO, FLT floats high-impedance. Clearing FLT requires either removing the fault condition for longer than the deglitch period or disabling the device via EN-both actions reset the internal fault latch.

What is the role of the PowerPAD™ on the TPS2069EDGNR package, and how should it be connected?

The PowerPAD™ on the TPS2069EDGNR is an exposed thermal pad located on the bottom of the HVSSOP-8 package, serving as the primary thermal conduction path from the die to the PCB. It must be soldered directly to a solid GND copper pour to achieve the rated R_θJA of 51.7°C/W and ensure reliable operation under continuous 1.5 A load. Leaving the PowerPAD™ unconnected or floating significantly degrades thermal performance and risks thermal shutdown during sustained current limiting. TI recommends using thermal vias beneath the pad for enhanced heat transfer.

Can the TPS2069EDGNR operate from a 3.3 V input rail, and what impact does that have on performance?

Yes, the TPS2069EDGNR fully supports 3.3 V input operation within its 2.7–5.5 V recommended range. At 3.3 V, R_DS(ON) remains within 70–105 mΩ (typical), ensuring low conduction loss and minimal voltage drop at full 1.5 A load. The current-limit threshold stays stable at 1.5 A ±20%, and overcurrent response time remains ≤1.5 µs. Undervoltage lockout activates at 2.0–2.6 V, providing margin for 3.3 V rail tolerance. All protections-including thermal shutdown and FLT reporting-function identically across the entire input range.