Texas Instruments TPS2096DG4

Overview

TPS2096DG4 from Texas Instruments is a quad-channel high-side power-distribution switch featuring four independent 80-mΩ N-channel MOSFETs, 250 mA continuous current per channel, 2.7-V to 5.5-V operating range, and integrated thermal/short-circuit protection with open-drain overcurrent outputs. It enables controlled hot-plug insertion in USB peripheral hubs and multi-rail embedded systems.

For engineers reviewing the TPS2096DG4 datasheet, TPS2096DG4 pinout, TPS2096DG4 application, or TPS2096DG4 equivalent, key selection criteria include per-channel enable logic polarity (active-low for all four inputs), SOIC-16 package footprint, 2.5-ms typical rise time, undervoltage lockout threshold (~2 V), and bidirectional switching capability under defined conditions.

Technical Context

The TPS2096DG4 implements four independent high-side N-channel MOSFET switches driven by an internal charge pump that operates down to 2.7 V and eliminates external components. Each channel features dedicated enable input (EN1–EN4) and associated overcurrent reporting via two shared open-drain outputs (OCA for channels 1–2, OCB for channels 3–4).

Thermal protection uses dual trip points: ~140°C isolates only the faulted channel; ~160°C disables all channels. Current limiting activates at 0.5 A (typical short-circuit output), holding output current constant while reducing voltage - distinct from latch-off behavior.

Key Specifications

Pinout & Package

TPS2096DG4 is housed in a 16-pin SOIC (D) package with 1.27-mm pitch, RoHS-compliant NiPdAu lead finish, and MSL Level-1 rating. Thermal resistance θJA = 111°C/W enables operation up to 85°C ambient with appropriate PCB copper area.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad high-side power switch applications.

Compared with TPS2096D, TPS2096DG4 offers identical performance with RoHS-compliant packaging; versus TPS2056D, it trades higher current capacity for superior fault containment via per-channel thermal trip and dual OC outputs - critical for mission-critical multi-load systems.

Availability

TPS2096DG4 is available at Aetrix Electronics and suitable for USB peripheral hubs, industrial I/O modules, hot-pluggable compute cards, and multi-rail embedded systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for TPS2096DG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management ICs with broad industrial, automotive, and communications applications.

The TPS209x family was designed specifically for robust hot-plug and overcurrent-protected power distribution in multi-load systems - emphasizing channel independence, low quiescent current, and integrated protection without external components.

FAQ

What is the maximum continuous current per channel for the TPS2096DG4?

The TPS2096DG4 supports 250 mA continuous current per channel under recommended operating conditions (TA ≤ 85°C, VI(IN) = 5.5 V). This rating is thermally limited - exceeding it risks junction temperature rise beyond 125°C, triggering thermal shutdown. Derating is required above 25°C ambient per the dissipation table: at 70°C ambient, max power per switch drops to 464 mW (≈215 mA at 5 V).

Does the TPS2096DG4 support bidirectional current flow, and under what conditions?

Yes, the TPS2096DG4 supports bidirectional current flow when the body diode of its internal N-channel MOSFET is forward-biased - i.e., when OUTx voltage exceeds INx voltage. This occurs during certain fault conditions or backup power scenarios. However, active switching (gate-controlled conduction) is unidirectional: from INx to OUTx only. Bidirectional capability is inherent to the MOSFET structure, not a designed feature for normal operation.

How does the dual thermal trip architecture work in the TPS2096DG4?

The TPS2096DG4 implements two thermal thresholds: ~140°C triggers isolation of only the overloaded channel, preserving operation of the other three; ~160°C forces full shutdown of all four channels. This architecture allows continued system functionality during single-point faults. Recovery is automatic after cooling by ~20°C, with hysteresis preventing oscillation. The OCA and OCB pins reflect the fault status of their respective channel pairs.

What is the purpose of separate GNDA and GNDB pins on the TPS2096DG4?

GNDA and GNDB provide isolated ground return paths for channels 1–2 and channels 3–4 respectively. This separation minimizes ground bounce and crosstalk between channel groups, especially during simultaneous switching or heavy transient loads. It improves noise immunity in mixed-signal systems and supports accurate current sensing by preventing shared impedance errors between channel current-sense paths.

Can the TPS2096DG4 be used with a 3.3-V supply, and how does rDS(on) change at that voltage?

Yes, the TPS2096DG4 operates fully across 2.7 V to 5.5 V, including 3.3-V systems. At 3.3 V input and 25°C, typical rDS(on) is 90–125 mΩ (vs. 80–100 mΩ at 5 V). Higher on-resistance increases conduction loss and self-heating - at 250 mA, power dissipation rises from ~5 mW (5 V) to ~7.8 mW (3.3 V), requiring attention to thermal design in compact layouts.