Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments TPS259270DRCR

Part No.:
TPS259270DRCR
Manufacturer:
Texas Instruments
Category:
Current Regulation/Management
Package:
10-VFDFN Exposed Pad
Datasheet:
AetrixTPS259270DRCR.pdf
Description:
IC ELECTRONIC FUSE 8% 10VSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,891

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TPS259270DRCR from Texas Instruments is a 4.5-V to 18-V eFuse IC with integrated 28-mΩ pass MOSFET, latched thermal shutdown, reverse current blocking support via BFET pin, and adjustable 1-A to 5-A current limit set by external RILIM. It protects HDD/SSD drives, PCIe cards, and server AUX supplies against overcurrent, short circuit, inrush, and reverse current.

For engineers reviewing the TPS259270DRCR datasheet, TPS259270DRCR pinout, TPS259270DRCR application, or TPS259270DRCR equivalent, key selection criteria include latched fault response (vs. auto-retry), 28-mΩ RDS(on) at 25°C, ±8% ILIM accuracy at 3.7 A, programmable dV/dT slew rate, and UL 2367 recognition for safety-critical power distribution.

Technical Context

The TPS259270DRCR implements a precision current-limit amplifier with fast-trip comparator (160% of ILIM) for sub-300-ns short-circuit response, coupled with thermal foldback that reduces ILIM by 2–12% when internal power dissipation exceeds 10 W. Its BFET driver provides 2-µA gate charge and 26-Ω discharge path for external back-to-back NFET control.

Operation begins at VIN > 4.3 V (UVLO rising threshold), followed by EN/UVLO sampling; output ramp rate is programmable via dV/dT pin capacitor (0–1000 nF), and ILIM resistor sets both overload and short-circuit limits with single-point failure test compliance (UL60950) at RILIM = open or shorted.

Key Specifications

ParameterValue and Actual Design Meaning
VIN Range4.5 V to 18 V operating; 20 V absolute max - supports wide-input industrial and server rails without external clamping.
RDS(on)28 mΩ typical at 25°C - enables low conduction loss (≤336 mW at 3.7 A) and minimal thermal rise under full load.
ILIM Range1 A to 5 A adjustable via RILIM (10 kΩ to 162 kΩ) - allows precise match to system-level fuse coordination and PCB trace rating.
ILIM Accuracy±8% at 3.7 A - ensures reliable trip margin above normal operating current while avoiding nuisance shutdowns.
Fault ResponseLatched shutdown - requires EN/UVLO toggle or power cycle to recover, preventing uncontrolled restart during persistent faults.
UL RecognitionUL 2367 File E339631 (RILIM ≤130 kΩ) - validates safety compliance for end-equipment certification in data center and storage applications.
Package10-pin VSON (3 mm × 3 mm) - compact footprint with exposed thermal pad for efficient heat dissipation in space-constrained boards.

Pinout & Package

TPS259270DRCR uses a 10-pin VSON package (3.00 mm × 3.00 mm) with exposed thermal pad (EP) on underside for enhanced thermal performance. Pin numbering follows top-view layout with pin 1 at top-left corner.

Pin/TerminalCircuit RoleDesign Meaning
dV/dTOutput slew rate controlConnects to GND via capacitor (1–1000 nF) to set 0.7–1.3 ms ramp time; floating for minimum slew rate.
EN/UVLOEnable input / UVLO senseDual-function pin: high enables device and BFET; low disables pass FET and discharges BFET; also programs UVLO threshold with resistor divider.
GNDPower and signal referencePrimary ground return for all internal circuits; must be connected to PCB thermal pad for thermal management.
ILIMCurrent limit programmingSinks 10 µA bias current; RILIM to GND sets ILIM (1–5 A); open/short detection triggers safe default limits (0.73 A / 0.84 A).
BFETBlocking FET gate driverDrives external NFET gate with 2 µA charge current and 26-Ω discharge path for <1 µs turnoff - enables reverse current blocking in SSD holdup scenarios.
VINMain power inputPins 3–5 are paralleled for low-inductance, high-current input connection; accepts 4.5–18 V with 20 V transient tolerance.
OUTProtected power outputPins 6–8 are paralleled for low-resistance, high-current output path; delivers regulated current-limited power to load.

Key Features

FeatureDesign Value
Integrated 28-mΩ Pass MOSFETEliminates need for external power switch and associated gate drive circuitry, reducing BOM count and board area in hot-swap applications.
Programmable Output Slew RateCapacitor-controlled dV/dT pin enables precise inrush current limiting (0.7–1.3 ms ramp) without external timers or op-amps.
Reverse Current Blocking SupportBFET pin drives external back-to-back NFET to prevent holdup capacitor discharge into drooping or shorted input bus - critical for SSD reliability.
Latched Thermal ShutdownShuts down permanently at 150°C junction temperature until EN/UVLO is toggled or power cycled - prevents unsafe automatic recovery in overheated systems.
UL 2367 RecognitionValidated per File E339631 for use in safety-certified equipment, reducing design validation effort for enterprise storage and server OEMs.

Applications

HDD and SSD DrivesServers / AUX Supplies

Use Scenario: Protecting SATA/NVMe SSDs from inrush surges during hot-plug and reverse current flow during power loss.

IC Role / Device Role / Timing Role: eFuse controller managing power sequencing, current limiting, and bidirectional isolation via BFET-driven external NFET.

Use Value: Prevents damage to host controller and SSD NAND from bus droop-induced reverse discharge, extending drive lifetime in enterprise storage arrays.

Use Scenario: Securing 12-V or 5-V auxiliary rails powering fans, sensors, and management controllers in 1U/2U servers.

IC Role / Device Role / Timing Role: Fault-tolerant power switch with latched shutdown ensuring no uncontrolled restart during thermal overload or short circuit.

Use Value: Maintains system stability by isolating faulty AUX rail without affecting main CPU/memory power domains - simplifies FRU replacement.

PCI/PCIe CardsSet Top Boxes

Use Scenario: Enabling hot-swap capability for add-in PCIe cards (GPUs, accelerators) while limiting inrush and protecting motherboard traces.

IC Role / Device Role / Timing Role: High-side eFuse with programmable ILIM and dV/dT control, coordinating with PCIe slot power sequencing requirements.

Use Value: Meets PCIe CEM spec for controlled power-up ramp and fault containment, avoiding motherboard brownouts during card insertion.

Use Scenario: Safeguarding 12-V power delivery to video processing SoCs and tuners in consumer STBs subject to frequent power cycling.

IC Role / Device Role / Timing Role: Overcurrent protector with ±8% ILIM accuracy and 28-mΩ RDS(on), minimizing voltage drop across long PCB traces.

Use Value: Ensures consistent SoC supply voltage under varying load conditions while meeting energy efficiency standards (e.g., ENERGY STAR).

Equivalent & Alternatives

The following parts are listed as comparable options for similar eFuse protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS259271DRCRAuto-retry thermal shutdown vs. latched; identical pinout, RDS(on), ILIM range, and feature set.Preferred where automatic recovery after cooling is acceptable (e.g., non-critical peripherals); unsuitable for safety-latched systems.Select TPS259271DRCR only if fault persistence monitoring and manual reset are not required.
TPS25942ARVCRWider VIN range (2.7–24 V), lower RDS(on) (19 mΩ), but no BFET pin or UL 2367 recognition; 16-pin WQFN package.Better suited for portable or mixed-voltage systems; lacks reverse current blocking and safety certification for server/storage use.Choose TPS25942ARVCR for cost-sensitive, non-certified designs needing wider input range and lower conduction loss.

Compared with TPS259271DRCR and TPS25942ARVCR, the TPS259270DRCR uniquely combines latched fault response, BFET-controlled reverse blocking, and UL 2367 recognition in a 3-mm × 3-mm VSON package - making it the only option qualified for safety-critical, hot-swap-capable storage and server AUX rails.

Availability

TPS259270DRCR is available at Aetrix Electronics and suitable for HDD/SSD drives, server AUX supplies, and PCIe card power management requiring stable component supply, long-term lifecycle support, and certified safety compliance.

Supply support for TPS259270DRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The TPS25927x product line is engineered for robust power distribution in high-reliability computing infrastructure, emphasizing precise current limiting, thermal safety, and reverse current prevention in storage and server subsystems.

FAQ

What is the fault response behavior of the TPS259270DRCR during thermal shutdown?

The TPS259270DRCR features latched thermal shutdown: when junction temperature exceeds 150°C, the internal MOSFET turns off and remains latched in the OFF state until either the EN/UVLO pin is toggled (driven low then high) or main power is cycled. This prevents automatic restart into a sustained fault condition, enhancing system safety in server and storage applications where uncontrolled recovery could cause cascading failures. The TPS259270DRCR does not implement auto-retry like the TPS259271DRCR variant.

How does the BFET pin function in the TPS259270DRCR, and what external component is required?

The BFET pin on the TPS259270DRCR drives the gate of an external N-channel MOSFET connected back-to-back with the output to block reverse current flow from load to source - essential for SSDs with holdup capacitors. It sources 2 µA to charge the external FET gate and discharges it through a 26-Ω internal resistor for sub-microsecond turnoff. No additional driver IC is needed; only a single discrete NFET (e.g., DMN3025LSD) is required, connected between OUT and the load, with its gate tied to BFET and source to OUT.

What is the accuracy and adjustment range of the current limit in the TPS259270DRCR?

The TPS259270DRCR supports adjustable current limiting from 1 A to 5 A using a single external resistor (RILIM) connected between ILIM and GND. At 3.7 A, the limit accuracy is ±8% over temperature and process variation. The relationship is approximately ILIM ≈ 0.7 + (3 × 10−5 × RILIM), with validated points at RILIM = 10 kΩ (1.02 A), 45.3 kΩ (2.10 A), 100 kΩ (3.75 A), and 150 kΩ (5.1 A). Open or shorted RILIM defaults to safe limits of 0.73 A or 0.84 A respectively.

Does the TPS259270DRCR support programmable output voltage ramp rate, and how is it implemented?

Yes, the TPS259270DRCR supports programmable output voltage ramp rate via the dV/dT pin. Connecting a capacitor (1–1000 nF) from dV/dT to GND sets the output slew time from 0.7 ms (1 nF) to 1.3 ms (1000 nF) for a full 0–VIN transition. The internal 220-nA current source charges the capacitor, and the resulting voltage controls the gate drive ramp of the internal MOSFET. Leaving dV/dT floating yields the minimum ramp time. This eliminates need for external RC timing networks or dedicated ramp controllers.

Is the TPS259270DRCR certified for safety standards, and which certifications apply?

Yes, the TPS259270DRCR is UL 2367 recognized (File E339631) when RILIM ≤130 kΩ, validating its use in end-equipment requiring safety certification. It also meets UL60950 single-point-failure test requirements for both open and shorted RILIM conditions. These certifications confirm robust fault handling for enterprise storage, servers, and industrial systems - distinguishing it from non-certified eFuses. TI provides supporting documentation including test reports and certification marks in the official product folder.

TPS259270DRCR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
10-VFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Electronic Fuse
Sensing Method:
-
Accuracy:
±8%
Voltage - Input:
4.5V ~ 18V
Current - Output:
5A
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-VSON (3x3)

TPS259270DRCR FAQ

1.How can I place an order for TPS259270DRCR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS259270DRCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS259270DRCR reliable?

The price and inventory of TPS259270DRCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS259270DRCR is usually 5 days.

3.What payment methods are accepted for TPS259270DRCR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS259270DRCR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS259270DRCR?

TPS259270DRCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS259270DRCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS259270DRCR?

For technical support, including TPS259270DRCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS259270DRCR requirements.

6.How does Aetrix verify that TPS259270DRCR is sourced from the original manufacturer or authorized distributors?

All TPS259270DRCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS259270DRCR meets industry standards.

7.What is the process for return or replacement of TPS259270DRCR?

All TPS259270DRCR units undergo pre-shipment inspection (PSI). If there is an issue with TPS259270DRCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS259270DRCR part is unused and in its original packaging.

Return procedure for TPS259270DRCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TPS259270DRCR Tags

  • TPS259270DRCR
  • TPS259270DRCR PDF
  • TPS259270DRCR Datasheet
  • TPS259270DRCR Specifications
  • TPS259270DRCR Images
  • Texas Instruments
  • Texas Instruments TPS259270DRCR
  • Buy TPS259270DRCR
  • TPS259270DRCR Price
  • TPS259270DRCR Distributor
  • TPS259270DRCR Supplier
  • TPS259270DRCR Wholesale
Related Products
PSSI2021SAY,115
PSSI2021SAY,115

Nexperia USA Inc.

BCR401RE6327HTSA1
BCR401RE6327HTSA1

Infineon Technologies

INA199B2DCKR
INA199B2DCKR

Texas Instruments

INA199A1DCKR
INA199A1DCKR

Texas Instruments

INA199B1DCKR
INA199B1DCKR

Texas Instruments

NSI45015WT1G
NSI45015WT1G

onsemi

NSI45020T1G
NSI45020T1G

onsemi

NSI45030AT1G
NSI45030AT1G

onsemi

NSI45025AT1G
NSI45025AT1G

onsemi

NSI45020AT1G
NSI45020AT1G

onsemi

NSI50010YT1G
NSI50010YT1G

onsemi

LM334Z/NOPB
LM334Z/NOPB

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER