Texas Instruments TPS259631DDAT

Overview

TPS259631DDAT from Texas Instruments is a 2.7–19 V, 0.125–2-A eFuse IC with 89-mΩ on-resistance, adjustable overvoltage lockout (OVLO), auto-retry thermal shutdown, and accurate current monitoring via ILM pin. It protects power rails in energy meters and UL 60335-1–compliant appliances against overcurrent, overvoltage, and inrush surges.

For engineers reviewing the TPS259631DDAT datasheet, TPS259631DDAT pinout, TPS259631DDAT application, or TPS259631DDAT equivalent, key selection factors include its 1.3-μs OVLO response time, ±5.5% current limit accuracy at 1 A, SOIC-8 package with exposed thermal pad, and auto-retry behavior during thermal fault events.

Technical Context

The TPS259631DDAT integrates a precision current-sense amplifier (656 µA/A gain), adjustable OVLO threshold set by resistor divider on pin 8, and internal retry timer for thermal shutdown recovery. Its gate driver enables fast FET switching with dV/dt control via external capacitor on pin 2.

Unlike TPS25962x variants, it uses OVLO instead of OVCSEL for overvoltage response-no fixed clamp thresholds-and features open-drain FLT pin assertion on overcurrent, overvoltage, or overtemperature faults, with 11.5-Ω internal pull-down resistance when asserted.

Key Specifications

Pinout & Package

TPS259631DDAT is housed in an 8-pin SOIC package (4.91 mm × 3.9 mm) with exposed thermal pad soldered to PCB ground for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar eFuse applications.

Compared with TPS259630DDAT and TPS25942ARVCR, the TPS259631DDAT uniquely balances auto-recovery behavior, user-adjustable OVLO, and SOIC-8 manufacturability - making it optimal for cost-sensitive, thermally dynamic appliance designs needing field resilience without manual reset.

Availability

TPS259631DDAT is available at Aetrix Electronics and suitable for energy metering, UL 60335-1 appliance control, and IP camera power management requiring stable component supply and long-term production continuity.

Supply support for TPS259631DDAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs for industrial, automotive, and consumer applications.

The TPS2596xx family was designed specifically for robust, integrated circuit protection in space-constrained, thermally demanding applications such as smart meters and white goods - delivering eFuse functionality with minimal external components.

FAQ

What is the overvoltage protection mechanism used in the TPS259631DDAT?

The TPS259631DDAT implements adjustable overvoltage lockout (OVLO), not clamping. A resistor divider from IN to OVLO (Pin 8) sets the trip threshold - typically 1.2 V at the pin - enabling user-defined cutoff voltages like 12 V or 15 V. When exceeded, the FET turns off within 1.3 µs. Unlike TPS25962x devices, it does not clamp output voltage.

How does the TPS259631DDAT differ from the TPS259630DDAT?

The TPS259631DDAT features auto-retry thermal shutdown, recovering automatically after ~95 ms once junction temperature falls below hysteresis threshold. The TPS259630DDAT latches off permanently until EN/UVLO is cycled. Both share identical OVLO, current limit, and pinout - only thermal response differs.

Can the TPS259631DDAT monitor load current accurately across temperature?

Yes. The TPS259631DDAT provides current monitoring via the ILM pin with 656 µA/A nominal gain and ≤±2% error over –40°C to +125°C. At 1-A load, ILM outputs ~656 mV, enabling direct ADC measurement without external amplification or calibration.

What is the recommended layout practice for the thermal pad of the TPS259631DDAT?

The exposed thermal pad of the TPS259631DDAT must be soldered to a solid PCB ground plane. TI recommends ≥4.93 cm² copper area across two layers (top and bottom) with ≥4 thermal vias (0.3-mm diameter) connecting to inner ground planes. This achieves R_θJA = 52.7°C/W and prevents thermal shutdown under 2-A continuous load.

Does the TPS259631DDAT support dV/dt control for inrush current limiting?

Yes. Connecting a capacitor from dVdt (Pin 2) to GND directly controls output voltage slew rate. With 3300 pF, SR_ON drops from 75.1 V/ms (no cap) to 13.6 V/ms at 12 V - extending turn-on time to ~1 ms and limiting inrush to <1.5 A into 100-µF loads.