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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Current Regulation/Management

Texas Instruments TPS259840RZJR

Name: TPS259840RZJR
Brand: Texas Instruments
SKU: TPS259840RZJR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TPS259840RZJR

Manufacturer:: Texas Instruments

Category:: Current Regulation/Management

Package:: 32-WFQFN Exposed Pad

Datasheet:: TPS259840RZJR.pdf

Description:: ELECTRONIC FUSE

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Product details

Overview

TPS259840RZJR from Texas Instruments is a high-current, stackable eFuse IC designed for robust input power path protection in 12-V server and data center systems. It integrates an ultra-low 0.8 mΩ FET, supports 55 A RMS / 70 A peak current, delivers ±1.4% analog current monitoring, and features fast-trip short-circuit response (<200 ns). It operates across 4.5 V–16 V input, withstands 23.5 V transients, and enables precise inrush control via dV/dt pin.

For engineers reviewing the TPS259840RZJR datasheet, TPS259840RZJR pinout, TPS259840RZJR application, or TPS259840RZJR equivalent, key selection considerations include its stackable active load sharing, ±5% adjustable overcurrent threshold (10–55 A), integrated die temperature monitoring (TEMP), fault reporting (FLT), and Power-Good signaling (PG) - all in a compact 5 mm × 5 mm QFN-32 package.

Technical Context

The TPS259840RZJR implements a digitally assisted analog protection architecture with dual-stage overcurrent handling: a user-adjustable circuit-breaker mode (IOCP) with ±5% accuracy and a separate fast-trip threshold (up to 2×IOCP) for sub-200 ns short-circuit shutdown. Its active synchronization logic (via SWEN and MODE pins) ensures balanced current sharing and state coordination across parallel devices during both startup and steady-state operation.

Protection functions are decoupled and independently configurable: dV/dt-controlled slew rate limits inrush, ITIMER sets transient blanking duration, ILIM defines start-up current limit, and IREF serves as the shared reference for IOCP, fast-trip, and active current sharing thresholds. The device also embeds FET health monitoring (VDSFLT detection) and thermal shutdown at 150°C with 12.5°C hysteresis.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	4.5 V to 16 V operating; withstands 23.5 V/10 µs transients - enables compatibility with 12 V server rails and tolerance to line surges.
RMS/Peak Current Rating	55 A RMS / 70 A peak - supports high-power GPU, ASIC, and switch fabric loads without external derating.
On-Resistance (RON)	0.8 mΩ typical at 25°C - minimizes conduction loss (≤0.35 W at 30 A) and thermal rise in dense PCB layouts.
Current Monitor Accuracy	±1.4% gain error - enables precise real-time load current telemetry for Intel PSYS/PROCHOT™ power management.
Short-Circuit Response Time	<200 ns - prevents MOSFET avalanche failure during output shorts under worst-case di/dt conditions.
Overvoltage Threshold	Fixed 16.7 V (±0.6 V) - protects downstream 12 V logic and power stages from supply rail faults.
Junction Temperature Range	–40°C to +125°C - qualified for industrial and data center ambient environments with full parameter performance.

Pinout & Package

TPS259840RZJR is housed in a thermally enhanced 32-pin QFN package (RZJ), 5 mm × 5 mm footprint, with exposed thermal pad. Pin assignment follows TI's standard TPS25984x layout, optimized for high-current plane routing and thermal dissipation.

Pin/Terminal	Circuit Role	Design Meaning
IN (Pins 9–16, Exposed Pad)	Power Input Terminal	High-current input node; must be soldered uniformly to input power plane for optimal current distribution and thermal conduction.
OUT (Pins 1, 2, 25–32)	Power Output Terminal	High-current output node; requires uniform soldering to output plane to maintain low impedance and minimize hotspots.
IMON (Pin 22)	Analog Current Monitor Output	Provides 18.13 µA/A proportional current signal; used to set IOCP threshold and enable real-time load monitoring.
ILIM (Pin 23)	Start-up Current Limit Control	Sets active current limit during power-on sequencing; also defines active current sharing threshold in parallel configurations.
DVDT (Pin 19)	Inrush Slew Rate Control	Capacitor-to-ground here adjusts output voltage ramp rate - critical for managing capacitive load inrush without false trips.
ITIMER (Pin 21)	Transient Overcurrent Blanking Timer	Capacitor-to-ground sets blanking interval (e.g., 3.79 ms with 4.7 nF) to tolerate benign load peaks up to 2×IOCP.
SWEN (Pin 3)	Stacking Synchronization Enable	Open-drain status/control pin; enables active state sync and load balancing across parallel eFuses during startup and steady state.
FLT (Pin 5)	Fault Indication Output	Open-drain active-low signal indicating overcurrent, overvoltage, overtemperature, or FET fault - drives system-level fault logging.
PG (Pin 6)	Power-Good Status	Open-drain active-high signal asserted after successful startup and stable output - used for downstream power sequencing.
TEMP (Pin 18)	Die Temperature Monitor	Analog voltage output (2.65 mV/°C) enabling junction temperature tracking; multiple TEMP pins can be tied for max-temp reporting in parallel chains.
EN/UVLO (Pin 4)	Enable & Undervoltage Lockout	Active-high input with 1.20 V threshold; resistor divider sets UVLO point - provides controlled turn-on and brownout protection.
IREF (Pin 24)	Protection Reference Source	Internal 24.99 µA current source; sets scaling for IOCP, fast-trip, and active current sharing - enables consistent multi-device calibration.

Key Features

Feature	Design Value
Stackable Active Load Sharing	SWEN/MODE pins coordinate real-time current balancing across ≥2 devices - eliminates manual current derating and prevents single-device overstress in parallel chains.
Precision Analog Current Monitoring	±1.4% accuracy and >500 kHz bandwidth - supports closed-loop dynamic power management (e.g., Intel PROCHOT™) and predictive maintenance analytics.
Configurable Inrush Control	dV/dt pin accepts external capacitor to linearly adjust output slew rate (1.20–9.79 V/ms) - eliminates need for discrete RC networks or soft-start controllers.
Dual-Stage Overcurrent Protection	Adjustable circuit-breaker (IOCP) + independent fast-trip (≤200 ns) - distinguishes between sustained overload and catastrophic short, improving system uptime.
FET Health Monitoring	VDSFLT detection at 0.49 V - identifies degraded or failing internal FET before thermal runaway, enabling graceful failover in redundant systems.
Integrated Thermal Management	Die temperature monitor (TEMP) + 150°C thermal shutdown with 12.5°C hysteresis - ensures safe SOA operation even under sustained 55 A load with minimal airflow.

Applications

Server Power Rail Protection	Data Center Switch Fabric
Use Scenario: Protecting 12-V input to high-density CPU/GPU VRMs in rack-mounted servers subject to hot-swap events and transient surges. IC Role / Device Role / Timing Role: Primary eFuse providing input hot-swap, inrush limiting, and fast short-circuit isolation - replaces discrete MOSFET + controller solutions. Use Value: Enables 3.3-kW power path protection per rail with <200 ns fault response, eliminating need for external current sense amplifiers or protection ASICs.	Use Scenario: Securing power delivery to line cards and fabric ASICs in modular data center switches requiring N+1 redundancy and hot-plug capability. IC Role / Device Role / Timing Role: Stackable eFuse managing parallel current paths with synchronized startup and load sharing - ensures no single point of failure in distributed power architecture. Use Value: Supports scalable current capacity up to 140 A+ using two TPS259840RZJR devices, with automatic current balancing and coordinated fault reporting.
Network Interface Card (NIC) Protection	GPU/Accelerator Card Power Management
Use Scenario: Safeguarding PCIe-based NICs with large bulk capacitance against inrush current during hot-insertion into live backplanes. IC Role / Device Role / Timing Role: Inrush-limited eFuse controlling dV/dt during card insertion while maintaining accurate current telemetry for link training diagnostics. Use Value: Prevents backplane voltage droop and false link-down events by limiting inrush to ≤10 A/µs, verified per PCIe CEM v5.0 hot-plug requirements.	Use Scenario: Delivering stable, monitored 12-V power to AI accelerators with dynamic load profiles exceeding 50 A and rapid di/dt demands. IC Role / Device Role / Timing Role: High-accuracy current monitor (±1.4%) and fast-trip protector enabling real-time power budgeting and thermal throttling via PROCHOT™ interface. Use Value: Provides hardware-enforced current ceiling and telemetry for GPU power capping - reduces need for software polling and improves response latency by >10× vs. SMBus-based solutions.

Server Power Rail Protection

Data Center Switch Fabric

Use Scenario: Protecting 12-V input to high-density CPU/GPU VRMs in rack-mounted servers subject to hot-swap events and transient surges.

IC Role / Device Role / Timing Role: Primary eFuse providing input hot-swap, inrush limiting, and fast short-circuit isolation - replaces discrete MOSFET + controller solutions.

Use Value: Enables 3.3-kW power path protection per rail with <200 ns fault response, eliminating need for external current sense amplifiers or protection ASICs.

Use Scenario: Securing power delivery to line cards and fabric ASICs in modular data center switches requiring N+1 redundancy and hot-plug capability.

IC Role / Device Role / Timing Role: Stackable eFuse managing parallel current paths with synchronized startup and load sharing - ensures no single point of failure in distributed power architecture.

Use Value: Supports scalable current capacity up to 140 A+ using two TPS259840RZJR devices, with automatic current balancing and coordinated fault reporting.

Network Interface Card (NIC) Protection

GPU/Accelerator Card Power Management

Use Scenario: Safeguarding PCIe-based NICs with large bulk capacitance against inrush current during hot-insertion into live backplanes.

IC Role / Device Role / Timing Role: Inrush-limited eFuse controlling dV/dt during card insertion while maintaining accurate current telemetry for link training diagnostics.

Use Value: Prevents backplane voltage droop and false link-down events by limiting inrush to ≤10 A/µs, verified per PCIe CEM v5.0 hot-plug requirements.

Use Scenario: Delivering stable, monitored 12-V power to AI accelerators with dynamic load profiles exceeding 50 A and rapid di/dt demands.

IC Role / Device Role / Timing Role: High-accuracy current monitor (±1.4%) and fast-trip protector enabling real-time power budgeting and thermal throttling via PROCHOT™ interface.

Use Value: Provides hardware-enforced current ceiling and telemetry for GPU power capping - reduces need for software polling and improves response latency by >10× vs. SMBus-based solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar eFuse applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS259820RZJR	Same RZJ package and pinout; lower 33 A RMS / 45 A peak rating; 1.2 mΩ RON; no SWEN pin - not stackable.	Targeted at mid-power 12-V modules (e.g., fan trays, baseboard management) where parallel operation is unnecessary.	Select when full 55 A/70 A capacity and active load sharing are not required - offers cost and board space savings.
LTC4215IMS#TRPBF	5 V–33 V range; 2.5 mΩ RON; 2.5 A max; no analog current monitor; uses I²C for configuration - not pin-compatible.	Designed for low-voltage, low-current hot-swap applications (e.g., USB PD, embedded peripherals) with digital control needs.	Choose only for systems requiring I²C programmability and wide VIN range below 5 V - not suitable as direct replacement for high-current 12 V server use.

Compared with TPS259840RZJR, the TPS259820RZJR reduces current capacity and removes stacking capability but retains identical footprint and basic protection features; the LTC4215 offers digital configurability and wider voltage range but lacks the precision analog monitoring, speed, and scalability needed for modern data center power rails.

Availability

TPS259840RZJR is available at Aetrix Electronics and suitable for server power rail protection, data center switch fabric, network interface card (NIC) hot-swap, GPU accelerator power management, and high-performance computing (HPC) applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TPS259840RZJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power protection ICs.

The TPS25984x family was engineered specifically for next-generation data center infrastructure - delivering stackable, high-current eFuse functionality with precision current sensing and thermal resilience in compact QFN packages.

FAQ

What is the maximum continuous current rating for the TPS259840RZJR?

The TPS259840RZJR is rated for 55 A RMS continuous current at TJ ≤ 125°C, with peak current capability up to 70 A. This rating assumes proper PCB thermal design per TI's recommended 8-layer layout with 9 thermal vias under the exposed pad. Derating applies above 85°C ambient or with reduced copper area.

Can multiple TPS259840RZJR devices be connected in parallel?

Yes, the TPS259840RZJR supports active parallel operation using the SWEN and MODE pins. When configured correctly, multiple devices synchronize startup timing and share load current in real time - enabling scalable current capacity beyond 70 A while maintaining balanced thermal stress and coordinated fault response.

How does the TPS259840RZJR handle inrush current during hot-plug events?

The TPS259840RZJR controls inrush via its DVDT pin: connecting an external capacitor to ground sets the output voltage slew rate (1.20–9.79 V/ms). This linear ramp prevents excessive peak currents into large bulk capacitors, eliminating nuisance tripping while maintaining fast power-up times - no additional external components are required.

What is the accuracy and bandwidth of the current monitoring function in the TPS259840RZJR?

The TPS259840RZJR provides ±1.4% gain accuracy across –40°C to +125°C and >500 kHz small-signal bandwidth on its IMON pin. This enables high-fidelity real-time current telemetry for dynamic power management protocols like Intel PROCHOT™ and PSYS, supporting sub-millisecond response to load transients.

Does the TPS259840RZJR include overtemperature protection?

Yes, the TPS259840RZJR integrates overtemperature protection with a 150°C thermal shutdown threshold and 12.5°C hysteresis. It also provides an analog die temperature monitor (TEMP pin) with 2.65 mV/°C sensitivity - allowing system firmware to implement predictive thermal throttling before shutdown occurs.

TPS259840RZJR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 32-WFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Function:: Electronic Fuse

Sensing Method:: High-Side

Accuracy:: ±5%

Voltage - Input:: 4.5V ~ 16V

Current - Output:: 70A

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 32-WQFN-FCRLF (5x5)

TPS259840RZJR FAQ

1.How can I place an order for TPS259840RZJR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS259840RZJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS259840RZJR reliable?

The price and inventory of TPS259840RZJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS259840RZJR is usually 5 days.

3.What payment methods are accepted for TPS259840RZJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS259840RZJR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS259840RZJR?

TPS259840RZJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS259840RZJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS259840RZJR?

For technical support, including TPS259840RZJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS259840RZJR requirements.

6.How does Aetrix verify that TPS259840RZJR is sourced from the original manufacturer or authorized distributors?

All TPS259840RZJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS259840RZJR meets industry standards.

7.What is the process for return or replacement of TPS259840RZJR?

All TPS259840RZJR units undergo pre-shipment inspection (PSI). If there is an issue with TPS259840RZJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS259840RZJR part is unused and in its original packaging.

Return procedure for TPS259840RZJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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