Texas Instruments TPS3307-25DGN

Overview

TPS3307-25DGN from Texas Instruments is a triple-voltage supervisor IC designed for DSP and microprocessor-based systems requiring independent monitoring of 3.3V, 2.5V, and adjustable supply rails. It delivers fixed 200ms power-on reset delay, operates from 2V to 6V supply, draws ≤40µA quiescent current, and guarantees defined RESET assertion down to VDD ≥1.1V - used in industrial programmable controllers and automotive ECUs.

For engineers reviewing the TPS3307-25DGN datasheet, TPS3307-25DGN pinout, TPS3307-25DGN application, or TPS3307-25DGN equivalent, key selection criteria include triple-sense threshold accuracy (2.93V/2.25V/1.25V typ), active-low + active-high RESET outputs, manual reset (MR) support, MSOP-8 (DGN) package compatibility, and –40°C to +85°C industrial temperature operation.

Technical Context

The TPS3307-25DGN integrates three independent voltage comparators with temperature-compensated 1.25V reference, enabling precise monitoring of nominal 3.3V (SENSE1), 2.5V (SENSE2), and user-defined >1.25V (SENSE3) supplies. Each sense input features hysteresis (20mV typ at 2.25V threshold) and defined negative-going thresholds (VIT–) for noise immunity.

Its internal 200ms reset timer initiates only after all three SENSE inputs exceed their respective VIT+ thresholds, ensuring synchronized system initialization. The MR input provides asynchronous reset control, while dual complementary RESET outputs simplify interface with both high- and low-active logic domains in processor reset chains.

Key Specifications

Pinout & Package

HVSSOP-8 (DGN) package: 3mm × 3mm, 0.65mm pitch, exposed thermal pad, 1.1mm max height - optimized for space-constrained PCB layouts and thermal performance in dense power systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple-supervisor applications.

Compared with TPS3307-25D, the TPS3307-25DGN offers superior thermal dissipation and 30% smaller PCB area; compared with MAX6832ASD+T, it provides wider supply range and dual-reset polarity - making it optimal for new industrial and automotive designs demanding compactness and interface flexibility.

Availability

TPS3307-25DGN is available at Aetrix Electronics and suitable for industrial programmable controls, automotive engine management systems, and portable medical diagnostics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TPS3307-25DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in industrial, automotive, and communications markets.

The TPS3307 family was engineered specifically for robust multi-rail supervision in DSP and microprocessor systems - addressing the need for deterministic reset timing, low quiescent power, and precise voltage thresholding in mission-critical embedded applications.

FAQ

What is the exact function of the SENSE3 pin on the TPS3307-25DGN?

The SENSE3 pin on the TPS3307-25DGN is an adjustable voltage sense input with a nominal threshold of 1.25V. It allows monitoring of any supply voltage greater than 1.25V by configuring an external resistor divider. Unlike SENSE1 and SENSE2, which are factory-trimmed for fixed 3.3V and 2.5V rails, SENSE3 provides design flexibility for custom voltage rails such as 1.8V, 5V, or intermediate values - all while maintaining the same hysteresis and temperature stability as the other sense inputs. This makes the TPS3307-25DGN adaptable across diverse power architectures without redesigning the supervisor circuit.

Does the TPS3307-25DGN require an external capacitor for its 200ms reset delay?

No, the TPS3307-25DGN does not require an external capacitor for its 200ms reset delay. The delay is generated by an internal precision timer that activates only after all three SENSE inputs rise above their respective VIT+ thresholds. This eliminates timing component variability, PCB area, and reliability concerns associated with external RC networks. The fixed 200ms (typ) delay ensures consistent, repeatable power-on reset behavior across temperature and voltage - a key advantage of the TPS3307-25DGN over discrete or capacitor-timed supervisor solutions.

Can the TPS3307-25DGN operate reliably at VDD = 2.0V?

Yes, the TPS3307-25DGN is fully specified to operate at VDD = 2.0V, the minimum rated supply voltage. At this level, it maintains functional RESET assertion (active-low and active-high outputs) and valid sense input thresholds, with supply current remaining ≤40µA. The device guarantees defined RESET behavior down to VDD ≥1.1V, meaning it begins asserting reset well before reaching the 2.0V operational floor - ensuring fail-safe supervision even during deep brownout conditions. This capability is explicitly validated across the full –40°C to +85°C temperature range per TI's SLVS199C datasheet.

How does the manual reset (MR) input interact with the SENSE inputs on the TPS3307-25DGN?

The MR input on the TPS3307-25DGN is an asynchronous, dominant control signal: pulling MR low forces immediate assertion of both RESET outputs regardless of SENSE1/SENSE2/SENSE3 voltage levels. When MR returns high, the device resumes normal supervision - but RESET remains asserted until all three SENSE inputs exceed their VIT+ thresholds *and* the internal 200ms timer completes. This behavior ensures that manual reset overrides transient faults while preserving the integrity of the power-on sequence. The MR pin also features Schmitt-trigger input characteristics and supports standard TTL/CMOS logic levels referenced to VDD.

What is the thermal pad on the TPS3307-25DGN HVSSOP package used for, and must it be soldered?

The exposed thermal pad on the TPS3307-25DGN's HVSSOP-8 (DGN) package is electrically connected to GND and serves dual purposes: enhancing thermal dissipation (critical for sustained operation at elevated ambient temperatures) and improving mechanical mounting strength. TI's datasheet and packaging documentation specify that the pad must be soldered to a PCB copper pour tied to GND - failure to do so degrades thermal performance and may violate JEDEC MSL-1 reflow compliance. Recommended layout includes 9×9 array of thermal vias (0.3mm diameter, 0.65mm pitch) connecting the pad to inner-layer GND planes to achieve optimal θ_JA of 137°C/W.