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Texas Instruments TPS50601MHKHV

Part No.:
TPS50601MHKHV
Manufacturer:
Texas Instruments
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
20-CDFF
Datasheet:
AetrixTPS50601MHKHV.pdf
Description:
IC REG BUCK ADJ 6A 20CFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,668

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Product details

Overview

TPS50601MHKHV from Texas Instruments is a radiation-hardened 6-A synchronous buck converter with integrated 55-mΩ/50-mΩ MOSFETs, operating from 1.6–6.3 V on PVIN and 3–6.3 V on VIN. It delivers up to 6 A output current, achieves 95% peak efficiency at 3.3 V output, and supports adjustable switching frequency from 100 kHz to 1 MHz. It is designed for space satellite point-of-load power delivery to FPGAs, microcontrollers, and ASICs under extreme radiation environments.

For engineers reviewing the TPS50601MHKHV datasheet, TPS50601MHKHV pinout, TPS50601MHKHV application, or TPS50601MHKHV equivalent, key selection considerations include radiation hardness assurance (TID 100 krad(Si), SEL immunity to 85 MeV·cm²/mg), monotonic startup into prebiased outputs, split power rail architecture (PVIN/VIN), and thermal performance in HKH ceramic flatpack package.

Technical Context

This device implements constant-frequency peak current mode control with internal slope compensation, enabling stable transient response and simplified loop compensation. Its dual-input architecture separates control bias (VIN) from power switch supply (PVIN), allowing operation down to 1.6 V on PVIN while maintaining 3–6.3 V on VIN for robust controller functionality.

The integrated high-side and low-side N-channel MOSFETs are optimized for low-duty-cycle applications, with RDS(on) of 55 mΩ (high-side, BOOT-PH = 2.2 V) and 50 mΩ (low-side). Protection includes cycle-by-cycle high-side current limiting, bidirectional low-side current limiting (source/sink), thermal shutdown at 175°C with 10°C hysteresis, and BOOT-PH UVLO at 2.2 V.

Key Specifications

Parameter Value and Actual Design Meaning
Output Current6 A continuous - supports high-density FPGA core rail and ASIC I/O rail power delivery
Input Voltage RangePVIN: 1.6–6.3 V; VIN: 3–6.3 V - enables flexible biasing and low-input operation in radiation-tolerant systems
Switching Frequency100 kHz–1 MHz (adjustable via RT resistor or external SYNC) - balances efficiency vs. size for space-constrained PCBs
Voltage Reference0.795 V ±1.258% at 25°C - sets minimum output voltage and defines accuracy of regulated rails
Efficiency95% peak at VOUT = 3.3 V - reduces thermal load in sealed satellite enclosures
Radiation HardnessTID 100 krad(Si), SEL immune to 85 MeV·cm²/mg - qualified for long-duration LEO/GEO missions
Operating Temperature–55°C to +125°C - meets military-grade environmental requirements for space payloads

Pinout & Package

TPS50601MHKHV is housed in a 20-pin thermally enhanced ceramic flatpack (HKH) package, 7.38 × 12.70 mm, with exposed thermal pad on bottom side connected to PGND externally. The package provides low junction-to-case thermal resistance (RθJC(bot) = 0.514°C/W) critical for sustained 6-A operation in vacuum.

Pin/Terminal Circuit Role Design Meaning
GND (Pins 1, 21, 31–34)Analog ground reference & thermal pad connectionMultiple GND pins ensure low-impedance return path; thermal pad must be soldered to PGND plane for thermal integrity
EN (Pin 2)Enable input with internal pullupDevice powers up when floated; UVLO threshold (1.13–1.18 V rising) configurable via external resistors
RT (Pin 3)Frequency setting resistor nodeResistor to GND sets internal oscillator frequency (e.g., 100 kΩ → ~500 kHz)
SYNC (Pin 4)External clock input/outputAccepts 100 kHz–1 MHz sync signal; configurable as 500-kHz master clock output for multi-rail sequencing
VIN (Pin 5)Bias supply for control circuitryMust be 3–6.3 V; powers gate drivers, error amplifier, and logic - independent of PVIN
PVIN (Pins 6–9)Main power input to power stageSupplies high/low-side MOSFETs; operates down to 1.6 V - enables ultra-low-voltage intermediate bus designs
PGND (Pins 10–15)Power ground return for MOSFETsDedicated low-inductance paths minimize switching noise coupling into control circuitry
PH (Pins 16–21, 22–25)Switch nodeConnects to inductor; high di/dt node requiring tight layout; multiple pins reduce parasitic inductance
BOOT (Pin 26)High-side gate drive bootstrap supplyCapacitor between BOOT and PH generates gate voltage > PVIN; monitored by BOOT-PH UVLO (2.2 V)
VSENSE (Pin 27)Feedback input to error amplifierCompares output voltage (via resistor divider) against 0.795-V reference; monitors over/undervoltage
COMP (Pin 28)Error amplifier output & compensation nodeConnects RC network for loop stability; transconductance = 1300 μS, DC gain = 39,000 V/V
SS/TR (Pin 29)Slow-start and tracking controlExternal capacitor sets startup ramp time; overrides reference for sequencing; requires ≥1.4 V before enabling PWRGD
PWRGD (Pin 30)Open-drain power-good statusAsserts low if VOUT < 91% or > 109% of VREF; active during thermal shutdown, dropout, or EN disable

Key Features

Feature Design Value
Radiation-hardened designQualified to 5962R10221: TID 100 krad(Si), ELDRS-free, SEL immune to 85 MeV·cm²/mg - eliminates single-event functional interrupts in orbit
Split power rail architectureIndependent VIN (3–6.3 V) and PVIN (1.6–6.3 V) inputs - enables low-voltage intermediate bus operation without compromising controller stability
Monotonic prebiased startupLow-side MOSFET remains off until SS/TR ≥ 1.4 V - prevents output discharge and ensures controlled ramp-up into powered systems
Integrated boot recharge circuitAutomatic PH-pull-low action recharges BOOT capacitor when BOOT-PH falls below 2.2 V - eliminates external charge pump complexity
Comprehensive fault protectionCycle-by-cycle high-side current limit, bidirectional low-side current limit (7–10 A source / 3 A sink), thermal shutdown (175°C), and overvoltage lockout - ensures fail-safe operation in unattended systems
Flexible power sequencingEN input, open-drain PWRGD, and SS/TR pin enable precise multi-rail coordination - supports FPGA configuration sequencing and ASIC power-up order compliance

Applications

Space Satellite FPGA Core Rail Space Satellite Payload ASIC I/O Rail

Use Scenario: Powering Xilinx or Microsemi radiation-tolerant FPGAs in LEO communication satellites where ambient temperature swings from –55°C to +125°C and total ionizing dose accumulates over 15+ years.

IC Role / Device Role / Timing Role: Primary synchronous buck regulator delivering 1.0 V @ 6 A to FPGA core logic with tight regulation (<±1.5%) and fast transient response.

Use Value: Radiation-hardened architecture eliminates need for derating or shielding; 95% efficiency minimizes heat dissipation in thermally isolated payload bays.

Use Scenario: Supplying 3.3 V @ 4 A to mixed-signal ASICs in scientific instrument modules aboard deep-space probes, where reliability must exceed 15-year mission life.

IC Role / Device Role / Timing Role: Point-of-load converter with programmable soft-start and PWRGD signaling to coordinate with FPGA configuration sequence and ADC power-up timing.

Use Value: Monotonic startup prevents back-driving of partially powered ASICs; SEL immunity ensures no latchup during solar particle events.

Radiation-Tolerant Avionics Power Military Spacecraft Payload Regulation

Use Scenario: Regulating 1.2 V for flight computer processors in UAVs operating in high-altitude nuclear test environments with pulsed gamma exposure.

IC Role / Device Role / Timing Role: High-reliability DC/DC converter with thermal shutdown and overvoltage protection, interfaced to MIL-STD-1553B sequencer via EN and PWRGD.

Use Value: TID 100 krad(Si) rating exceeds DoD radiation survivability thresholds; HKH ceramic package withstands mechanical shock and thermal cycling.

Use Scenario: Generating 2.5 V @ 5 A for radar signal processing modules in classified military satellites requiring zero field failures over 12-year orbital lifetime.

IC Role / Device Role / Timing Role: Radiation-hardened buck converter with external SYNC capability to align switching edges across multiple rails and reduce EMI in sensitive RF front-ends.

Use Value: 100 kHz–1 MHz frequency agility avoids interference with telemetry bands; 20-pin CFP package supports hermetic sealing and conformal coating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck converter applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS7H3301-SPSingle-output 3-A radiation-hardened buck converter; lower current rating; fixed 500-kHz frequency; no external SYNC or RT adjustmentSuitable for lower-power subsystems (e.g., sensor interfaces) but cannot replace 6-A load capability of TPS50601MHKHVSelect when board space or cost constraints outweigh need for 6-A output and frequency flexibility
LM70880QRNXTQ1Automotive AEC-Q100 Grade 1 (–40°C to +125°C); non-radiation-hardened; 8-A output; 2.7–5.5 V input; no TID/SEL qualificationValid for terrestrial automotive or industrial use, but not certified for space radiation environmentsChoose only for ground-based test benches or non-flight hardware where radiation tolerance is unnecessary

Compared with TPS7H3301-SP and LM70880QRNXTQ1, TPS50601MHKHV uniquely combines 6-A output, 100 krad(Si) TID rating, SEL immunity, and dual-input (VIN/PVIN) architecture - making it irreplaceable for high-current, radiation-critical spaceborne point-of-load applications.

Availability

TPS50601MHKHV is available at Aetrix Electronics and suitable for space satellite FPGA power, radiation-tolerant avionics, and military spacecraft payload regulation requiring stable component supply across extended mission lifecycles.

Supply support for TPS50601MHKHV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability aerospace components, with decades of heritage in space-grade IC development.

The TPS50601MHKHV belongs to TI's radiation-hardened power management portfolio, engineered specifically for mission-critical satellite and defense electronics demanding guaranteed operation under extreme ionizing radiation and thermal stress.

FAQ

What is the radiation hardness specification of the TPS50601MHKHV?

The TPS50601MHKHV is qualified per 5962R10221 with total ionizing dose (TID) hardness up to 100 krad(Si), is ELDRS-free at 10 mrad(Si)/s, and exhibits single-event latchup (SEL) immunity up to 85 MeV·cm²/mg. These specifications are verified in the official TI radiation report SLVSD45, making TPS50601MHKHV suitable for long-duration LEO and GEO satellite missions.

Can the TPS50601MHKHV operate with PVIN lower than VIN?

Yes - the TPS50601MHKHV supports split-rail operation where PVIN can be as low as 1.6 V while VIN remains within 3–6.3 V. This architecture allows efficient use of low-voltage intermediate buses (e.g., 1.8 V or 2.5 V) to power the MOSFETs, while maintaining full control functionality via the higher VIN rail. The TPS50601MHKHV datasheet explicitly specifies these independent ranges in Section 7.5.

What is the purpose of the SS/TR pin on the TPS50601MHKHV?

The SS/TR (Slow-Start/Tracking) pin on the TPS50601MHKHV controls output voltage ramp rate during startup and enables voltage tracking in multi-rail systems. An external capacitor sets the rise time of the internal reference; the pin also accepts an external voltage for coordinated sequencing. Critically, the TPS50601MHKHV requires SS/TR ≥ 1.4 V before enabling the PWRGD signal, ensuring safe monotonic startup into prebiased loads.

Does the TPS50601MHKHV support external clock synchronization?

Yes - the TPS50601MHKHV features a dedicated SYNC pin (Pin 4) that accepts an external 100 kHz–1 MHz clock signal for synchronization across multiple converters. When not used, the pin may be left open to enable internal oscillator operation. Additionally, the SYNC pin can be configured as a 500-kHz output to serve as a master clock for slave regulators - a capability confirmed in the TPS50601MHKHV functional description and pin table.

What thermal management provisions does the TPS50601MHKHV require?

The TPS50601MHKHV uses a 20-pin HKH ceramic flatpack with an exposed thermal pad on the bottom side, which must be soldered to a PGND plane. Its junction-to-case (bottom) thermal resistance is 0.514°C/W. TI recommends a 4-layer PCB with 2-oz copper planes and 40 thermal vias under the package. The TPS50601MHKHV thermal design guidance is detailed in Section 7.4 and Figure 1 of SLVSD45, targeting ≤150°C junction temperature for 15+ year reliability.

TPS50601MHKHV Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
SWIFT™
Package/Case:
20-CDFF
Packaging:
Tube
Product Status:
Discontinued at Digi-Key
Function:
Step-Down
Output Configuration:
Positive
Topology:
Buck
Output Type:
Adjustable
Number of Outputs:
1
Voltage - Input (Min):
3V
Voltage - Input (Max):
6.3V
Voltage - Output (Min/Fixed):
0.795V
Voltage - Output (Max):
5.5V
Current - Output:
6A
Frequency - Switching:
500kHz
Synchronous Rectifier:
Yes
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-CFP

TPS50601MHKHV FAQ

1.How can I place an order for TPS50601MHKHV through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS50601MHKHV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS50601MHKHV reliable?

The price and inventory of TPS50601MHKHV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS50601MHKHV is usually 5 days.

3.What payment methods are accepted for TPS50601MHKHV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS50601MHKHV transactions.

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4.How is shipping managed for TPS50601MHKHV?

TPS50601MHKHV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS50601MHKHV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS50601MHKHV?

For technical support, including TPS50601MHKHV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS50601MHKHV requirements.

6.How does Aetrix verify that TPS50601MHKHV is sourced from the original manufacturer or authorized distributors?

All TPS50601MHKHV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS50601MHKHV meets industry standards.

7.What is the process for return or replacement of TPS50601MHKHV?

All TPS50601MHKHV units undergo pre-shipment inspection (PSI). If there is an issue with TPS50601MHKHV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS50601MHKHV part is unused and in its original packaging.

Return procedure for TPS50601MHKHV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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