Texas Instruments TPS5110PWG4

Overview

TPS5110PWG4 from Texas Instruments is a dual-output synchronous buck controller with integrated LDO controller, designed for low-voltage/high-current I/O and peripheral power in notebook PCs and DSP systems. It delivers 0.9–3.5 V from the PWM-controlled buck stage (4.5–28 V input) and 0.9–2.5 V from the external-NMOS LDO stage (1.1–3.6 V input), featuring ±1% reference voltage accuracy, 300–500 kHz programmable switching frequency, and temperature-compensated overcurrent protection.

For engineers reviewing the TPS5110PWG4 datasheet, TPS5110PWG4 pinout, TPS5110PWG4 application, or TPS5110PWG4 equivalent, key selection considerations include its dual-regulator architecture, resistor-less current sensing with thermal compensation, fast LDO transient response with overshoot protection, SKIP/PWM mode selection, and 24-pin TSSOP package compatibility with industrial-temperature operation (−40°C to 85°C).

Technical Context

The TPS5110PWG4 integrates two independent control loops: a high-speed PWM synchronous buck regulator controller (SBRC) with auto PWM/SKIP mode selection via PWM_SEL, and a separate LDO controller driving an external N-channel MOSFET. The SBRC uses a 0.85-V precision reference and a 2.5-MHz unity-gain bandwidth error amplifier for fast load transient response.

Current protection is implemented without sense resistors: the SBRC monitors R_DS(on) voltage drop across high-side and low-side MOSFETs using a temperature-compensated 13-µA trip current source (ITRIP), while the LDO employs a 50-mV current-limit threshold on LDO_CUR. Both regulators share a common FLT latch timer and POWERGOOD monitoring of ±7% output tolerance.

Key Specifications

Pinout & Package

The TPS5110PWG4 is housed in a 24-pin plastic TSSOP (PW) package, thermally rated for 1404 mW at TA ≤ 25°C and 730 mW at TA = 85°C, with JEDEC-standard 2-layer board layout assumptions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output controller applications.

Compared with TPS5110PWG4, TPS51200DRCR provides only LDO control in a smaller package but cannot replace the full dual-regulator function, while TPS51220ARUKR adds digital control at the cost of increased complexity and reduced analog protection fidelity-making TPS5110PWG4 optimal for cost-sensitive, analog-focused notebook and DSP designs requiring proven transient resilience.

Availability

TPS5110PWG4 is available at Aetrix Electronics and suitable for notebook PC power management, DSP core/I/O supply, consumer game system power conversion, embedded peripheral power hubs, and industrial portable electronics requiring stable component supply and long-lifecycle support.

Supply support for TPS5110PWG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management ICs for computing and portable electronics.

The TPS5110PWG4 belongs to TI's notebook and mobile power controller product line, engineered specifically to deliver tightly regulated, thermally robust, and sequenced dual-rail power for space- and efficiency-critical portable digital systems.

FAQ

What is the primary function of the TPS5110PWG4?

The TPS5110PWG4 is a dual-output power controller integrating a synchronous buck regulator controller (SBRC) and an external-NMOS LDO controller. It regulates two independent output rails-typically 1.8 V/6 A from the buck stage and 1.5 V/3 A from the LDO stage-for I/O and peripheral power in notebook PCs and DSP systems. Its architecture supports coordinated soft-start, shared fault latching, and precise ±7% power-good monitoring, making it purpose-built for portable digital power applications.

How does the TPS5110PWG4 implement overcurrent protection without external sense resistors?

The TPS5110PWG4 implements resistor-less overcurrent protection using an internal temperature-compensated current source (ITRIP = 13 µA typ. at 25°C, with 3400 ppm/°C coefficient) that sets a trip voltage across the R_DS(on) of external high-side and low-side MOSFETs. During conduction, the drain-to-source voltage is compared against this threshold. This eliminates external sense resistors, reduces BOM count, and maintains accuracy across temperature-key for reliable operation in thermally varying notebook environments.

What is the role of the FLT pin on the TPS5110PWG4?

The FLT pin on the TPS5110PWG4 serves as the fault latch timer input. An external capacitor connected between FLT and GND sets the timeout duration for overvoltage (OVP) and undervoltage (UVP) protection events. When either protection comparator triggers, the FLT circuit charges this capacitor using a current source (125 µA for OVP, 2.3 µA for UVP). Once the FLT voltage reaches 1.185 V, the device latches both the SBRC and LDO drivers OFF, ensuring coordinated shutdown and preventing cascading failures in multi-rail systems.

Can the TPS5110PWG4 operate in both PWM and SKIP modes, and how is mode selection controlled?

Yes, the TPS5110PWG4 supports both fixed-frequency PWM and auto PWM/SKIP modes. Mode selection is controlled by the logic level on the PWM_SEL pin: a voltage <0.3 V selects fixed PWM mode across all loads, while ≥2.5 V enables auto PWM/SKIP mode, where the controller automatically switches to energy-saving SKIP operation under light loads. This feature improves light-load efficiency without compromising transient response during load steps-critical for battery-powered applications like notebooks and handheld game systems.

What package type and thermal specifications apply to the TPS5110PWG4?

The TPS5110PWG4 is packaged in a 24-pin plastic TSSOP (PW) package, rated for operation from −40°C to +85°C ambient temperature. Its thermal dissipation rating is 1404 mW at TA ≤ 25°C and derates linearly to 730 mW at TA = 85°C, assuming mounting on a JEDEC high-k board (2 oz. surface traces, 2-layer 1-oz internal plane). This package balances PCB footprint, thermal performance, and manufacturability for high-volume portable electronics assembly.