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Texas Instruments TPS51200DRCTG4

Part No.:
TPS51200DRCTG4
Manufacturer:
Texas Instruments
Category:
Special Purpose Regulators
Package:
10-VFDFN Exposed Pad
Datasheet:
AetrixTPS51200DRCTG4.pdf
Description:
IC REG CONV DDR 1OUT 10VSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,936

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Product details

Overview

TPS51200DRCTG4 from Texas Instruments is a sink-and-source DDR termination regulator designed for VTT rail generation in memory subsystems. It supports DDR through DDR4, delivers ±2 A sourcing/sinking capability, maintains ±25 mV output voltage tolerance over –2 A to +2 A load range, and operates from 2.375 V to 3.5 V VIN with 1.1 V to 3.5 V VLDOIN. It is deployed in notebook and server memory modules requiring fast transient response and remote sensing.

For engineers reviewing the TPS51200DRCTG4 datasheet, TPS51200DRCTG4 pinout, TPS51200DRCTG4 application, or TPS51200DRCTG4 equivalent, key selection criteria include VTT tracking accuracy (±25 mV), droop-compensated dual-direction current capability, PGOOD monitoring with 2 ms startup delay, and compatibility with DDR/DDR2/DDR3/DDR3L/DDR4 termination topologies.

Technical Context

The TPS51200DRCTG4 implements a transconductance (gM)-based LDO architecture optimized for high-speed DDR bus termination, enabling stable regulation with only 20 μF total output capacitance (typically three 10 μF MLCCs). Its feedback loop uses VOSNS for remote sensing to compensate for PCB trace resistance, ensuring tight DC and AC VTT regulation at the load.

It integrates independent REFOUT (±10 mA buffered reference) and VO (sink/source) paths, with EN-controlled discharge of VO during S3 suspend states while maintaining REFOUT active. The device employs non-latching UVLO (2.2–2.375 V VIN threshold), thermal shutdown (150 °C), and symmetrical soft-start with current-clamp control for both ramp-up and ramp-down transitions.

Key Specifications

Parameter Value and Actual Design Meaning
Output Voltage Range0.6 V to 1.25 V (programmable via REFIN; matches DDR4 to DDR1 VTT levels)
VO Current Capability±2 A continuous sink/source (supports DDR3/DDR4 DIMM burst currents without derating)
Output Voltage Tolerance±25 mV over full load range (–2 A to +2 A), meeting JEDEC VTT accuracy requirements)
Minimum Output Capacitance20 μF (enables compact layout using three 10 μF 0805 MLCCs; reduces BOM count)
PGOOD Accuracy Window±20% of REFOUT with 2 ms startup assertion delay and 10 μs fault deassertion latency
Operating Temperature–40 °C to +85 °C ambient (fully specified for industrial and computing environments)
Package Thermal ResistanceRθJA = 84.6 °C/W (10-pin VSON with exposed thermal pad enables >2 W dissipation at 50 °C ΔT)

Pinout & Package

TPS51200DRCTG4 is housed in a thermally enhanced 10-pin VSON package (3.0 mm × 3.0 mm body, 0.5 mm pitch) with an exposed thermal pad on the bottom for PCB-level heat dissipation. The package is RoHS-compliant, green, and Pb-free.

Pin/Terminal Circuit Role Design Meaning
REFIN (Pin 1)Reference inputTracks VDDQ via resistor divider to set VO output; supports 0.5–1.8 V range for DDR1–DDR4 compatibility
VLDOIN (Pin 2)LDO supply inputProvides bias for internal LDO core; accepts 1.1–3.5 V, decoupled separately from VIN
VO (Pin 3)Termination outputSinks and sources up to ±2 A to DDR VTT bus; requires remote sense connection via VOSNS
PGND (Pin 4)Power groundSeparate low-impedance return path for VO current; must be routed directly to thermal pad
VOSNS (Pin 5)Remote voltage senseConnects to positive terminal of output capacitor or load to cancel trace IR drop and improve regulation accuracy
REFOUT (Pin 6)Buffered reference output±10 mA capable VTTREF source; remains active during EN=low (S3 state); requires ≤0.47 μF total capacitance
EN (Pin 7)Enable controlActive-high logic input; drives VO into fast discharge mode (18 Ω internal MOSFET) when low for S3 suspend
GND (Pin 8)Signal groundReference for logic pins (EN, PGOOD); isolated from PGND to minimize noise coupling
PGOOD (Pin 9)Open-drain status indicatorAsserts high when VO is within ±20% of REFOUT; requires external 1–100 kΩ pull-up to stable rail
VIN (Pin 10)Main supply inputAccepts 2.375–3.5 V (2.5 V or 3.3 V rails); requires 1–4.7 μF ceramic decoupling capacitor

Key Features

Feature Design Value
Droop-compensated sink/source regulationTransconductance (gM) LDO architecture maintains VTT accuracy under fast load transients without external compensation components
Integrated S3 suspend supportEN pin controls independent VO discharge (18 Ω internal MOSFET) while preserving REFOUT for memory retention during suspend-to-RAM
JEDEC-compliant VTT accuracy±25 mV VO tolerance over full ±2 A load range satisfies DDR/DDR2/DDR3/DDR3L/DDR4 VTT specification (JEDEC JESD8-9B, JESD8-15A)
Low-external-component footprintOnly 20 μF total output capacitance required (3 × 10 μF MLCCs); eliminates need for bulk electrolytics or complex RC networks
Robust protection suiteNon-latching UVLO (VIN), thermal shutdown (150 °C), overcurrent limiting (OCL), and soft-start sequencing prevent system faults during power-up/down

Applications

DDR Memory Modules Notebook Memory Subsystems

Use Scenario: Termination of DDR3/DDR4 address, command, and control lines on 240-pin or 288-pin UDIMMs.

IC Role / Device Role / Timing Role: Provides dynamically tracked VTT rail synchronized to VDDQ via REFIN, enabling SSTL-15/18 signaling integrity.

Use Value: Ensures ±25 mV VTT regulation at the DIMM connector under ±2 A transient loads, meeting JEDEC DDR3/DDR4 VTT tolerance requirements.

Use Scenario: Powering VTT for dual-channel DDR3L memory in space-constrained ultrabook platforms.

IC Role / Device Role / Timing Role: Delivers 0.675 V VTT with S3-aware EN control, allowing rapid suspend/resume while retaining REFOUT for memory refresh.

Use Value: Enables <10 μs PGOOD fault detection and 2 ms startup timing alignment with VDDQ rail, supporting Intel Platform Environment Control Interface (PECI) compliance.

Server Memory Interconnects Telecom Baseband Memory

Use Scenario: High-density DDR4 RDIMM termination in 1U rack servers with multi-rank configurations.

IC Role / Device Role / Timing Role: Sinks and sources peak currents across 34+ VTT-connected signals while maintaining remote-sensed regulation at each DIMM slot.

Use Value: Supports 1600 MT/s data rates with <15 mV droop under 2 A step load, verified per JEDEC DDR4-2400 timing margin requirements.

Use Scenario: VTT regulation for LPDDR3 in 5G baseband processing units requiring low quiescent current and thermal resilience.

IC Role / Device Role / Timing Role: Supplies 0.6 V VTT with 80 μA shutdown current (VEN = 0 V, VREFIN = 0 V), minimizing standby power in always-on radio units.

Use Value: Achieves 30.0 °C/W junction-to-board thermal resistance, enabling operation at 85 °C ambient without derating in sealed telecom enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR termination regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS51200DRCTSame silicon die and electrical specs; differs only in packaging marking (G4 suffix indicates green/Pb-free tape-and-reel per TI spec)No functional difference; identical thermal, electrical, and mechanical behavior in all DDR termination use casesSelect TPS51200DRCTG4 for RoHS-compliant production requiring TI's green packaging standard.
ISL6521CRZ-TFixed 1.25 V output (no REFIN tracking); lacks REFOUT buffer and S3 discharge MOSFET; requires external PGOOD comparatorRestricted to legacy DDR1 systems; cannot support DDR2+ VTT tracking or S3 suspend modesChoose only for cost-sensitive DDR1-only designs where programmability and S3 support are unnecessary.

Compared with TPS51200DRCT and ISL6521CRZ-T, the TPS51200DRCTG4 uniquely combines REFIN-based VTT tracking across five DDR generations, integrated S3 discharge, and ±25 mV regulation accuracy - enabling single-part support for notebook, server, and telecom DDR memory platforms without redesign.

Availability

TPS51200DRCTG4 is available at Aetrix Electronics and suitable for DDR memory modules, notebook platform designs, and telecom baseband systems requiring stable component supply, JEDEC-compliant VTT regulation, and S3 suspend functionality.

Supply support for TPS51200DRCTG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of DDR power architecture expertise.

The TPS51200DRCTG4 belongs to TI's DDR termination regulator product line, engineered specifically for high-speed memory interface power integrity - delivering precise, low-noise, bidirectional VTT regulation in space-constrained computing and communications equipment.

FAQ

What is the minimum output capacitance required for stable operation of the TPS51200DRCTG4?

The TPS51200DRCTG4 requires a minimum total output capacitance of 20 μF, typically implemented as three 10 μF X5R/X7R MLCCs in 0805 case size. This value ensures stability across DDR1–DDR4 load profiles and enables the fast transient response needed for memory bus termination without external compensation.

How does the TPS51200DRCTG4 support S3 suspend-to-RAM states?

The TPS51200DRCTG4 supports S3 suspend via its EN pin: when EN is driven low, the VO output is actively discharged through an internal 18 Ω MOSFET while REFOUT remains powered and stable. This preserves memory VTTREF for refresh operations during suspend, enabling compliant low-power states in Intel and AMD platforms.

Can the TPS51200DRCTG4 be used for DDR4 memory termination?

Yes, the TPS51200DRCTG4 is explicitly qualified for DDR4 VTT applications, delivering 0.6 V output with ±25 mV tolerance over ±2 A load range. Its REFIN input tracks VDDQ/2 for DDR4, and its 10 μs PGOOD fault response meets DDR4 timing margin requirements for reliable memory initialization.

What is the purpose of the VOSNS pin on the TPS51200DRCTG4?

The VOSNS pin on the TPS51200DRCTG4 provides remote voltage sensing at the load to compensate for PCB trace resistance between the VO pin and memory DIMM. Connecting VOSNS directly to the positive terminal of the output capacitor or DIMM VTT pin ensures ±25 mV regulation accuracy at the point of load, not just at the IC output.

Does the TPS51200DRCTG4 integrate thermal protection?

Yes, the TPS51200DRCTG4 includes thermal shutdown protection that disables both VO and REFOUT outputs when the junction temperature exceeds 150 °C. The protection is non-latching and automatically recovers once temperature falls below the hysteresis threshold, ensuring robust operation in thermally dense memory modules.

TPS51200DRCTG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
10-VFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Applications:
Converter, DDR
Voltage - Input:
2.38V ~ 3.5V
Number of Outputs:
1
Voltage - Output:
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-VSON (3x3)

TPS51200DRCTG4 FAQ

1.How can I place an order for TPS51200DRCTG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS51200DRCTG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS51200DRCTG4 reliable?

The price and inventory of TPS51200DRCTG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS51200DRCTG4 is usually 5 days.

3.What payment methods are accepted for TPS51200DRCTG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS51200DRCTG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS51200DRCTG4?

TPS51200DRCTG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS51200DRCTG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS51200DRCTG4?

For technical support, including TPS51200DRCTG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS51200DRCTG4 requirements.

6.How does Aetrix verify that TPS51200DRCTG4 is sourced from the original manufacturer or authorized distributors?

All TPS51200DRCTG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS51200DRCTG4 meets industry standards.

7.What is the process for return or replacement of TPS51200DRCTG4?

All TPS51200DRCTG4 units undergo pre-shipment inspection (PSI). If there is an issue with TPS51200DRCTG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS51200DRCTG4 part is unused and in its original packaging.

Return procedure for TPS51200DRCTG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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