Texas Instruments TPS51611RHBR
- Part No.:
- TPS51611RHBR
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
TPS51611RHBR.pdf
- Description:
- IC REG CTRL IMVP-6.5 1OUT 32VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,384
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Product details
Overview
TPS51611RHBR from Texas Instruments is a dual-phase, synchronous buck controller IC designed exclusively for IMVP-7/8 mobile CPU core power delivery in ultrabooks and thin-and-light notebooks. It supports 0.25–1.5 V output with ±0.5% DC accuracy, 400 kHz–1.2 MHz programmable switching frequency, and integrated MOSFET drivers for high-efficiency phase interleaving. It operates under Intel's CNDA and targets Intel Core i-series processor VR12.5/VR13 platforms.
For engineers reviewing the TPS51611RHBR datasheet, TPS51611RHBR pinout, TPS51611RHBR application, or TPS51611RHBR equivalent, key selection criteria include IMVP compliance, dual-phase timing control, adaptive voltage positioning (AVP), differential remote sensing, and thermal-aware phase shedding - all critical for mobile CPU VR design validation and qualification.
Technical Context
The TPS51611RHBR implements a digital PWM controller with two independent phase channels, each supporting high-side and low-side gate drive outputs (PHASE1/PHASE2, BOOT1/BOOT2). It integrates an internal 10-bit DAC for VID code decoding and supports dynamic AVP via SVID bus communication with the CPU.
It features built-in current sensing via DCR or resistor-based methods, overvoltage/undervoltage protection with fast response (<200 ns), and thermal monitoring through an external NTC input. The device requires external power stages and relies on Intel SVID protocol for real-time voltage command updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Range | 0.25 V to 1.5 V, digitally set via SVID commands with ±0.5% DC accuracy at load |
| Switching Frequency | 400 kHz to 1.2 MHz, programmable in 50-kHz steps for EMI optimization and efficiency trade-off |
| Phase Configuration | Dual-phase interleaved operation with 180° phase shift, enabling ripple cancellation and reduced input/output capacitance |
| Control Interface | SVID v3.0 compliant - supports VR ready, thermal alert, and dynamic AVP commands from Intel CPU |
| Current Sensing | Supports both DCR sensing (with RDS(on) compensation) and precision shunt resistor inputs |
| Protection Features | OVP/UVP (trip within 200 ns), OTP via external NTC, and phase loss detection with automatic shutdown |
| Thermal Pad | Exposed thermal pad (Pin 33) must be soldered to PCB ground plane for thermal dissipation and mechanical stability |
Pinout & Package
VQFN package (RHB drawing), 32-pin, 5 mm × 5 mm, 0.5 mm pitch, 1.0 mm max height, with exposed thermal pad (Pin 33).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | VIN1, PVIN1, PHASE1, BOOT1, LGATE1, PGND1, HGATE1, VDD1 | Power and gate drive path for Phase 1: input supply, bootstrap, high/low-side FET control, and local bias |
| 9–16 | VIN2, PVIN2, PHASE2, BOOT2, LGATE2, PGND2, HGATE2, VDD2 | Power and gate drive path for Phase 2: mirrored functionality for second buck stage |
| 17–24 | VSNSP, VSNSN, ISENSE1, ISENSE2, SVID_DATA, SVID_CLK, ALERT#, THERM | Differential voltage sensing, current sense inputs, SVID interface, fault alert, and thermal monitoring |
| 25–32 | EN, UVLO, MODE, PGOOD, VREF, REFOUT, COMP1, COMP2 | Enable control, undervoltage lockout, operating mode select, power-good signaling, reference generation, and error amplifier compensation |
| 33 | EXPOSED PAD | Thermal and electrical ground connection - must be soldered to PCB copper area for thermal performance and noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Intel SVID v3.0 Compliance | Enables direct communication with Intel Core processors for dynamic voltage scaling, thermal throttling, and VR status reporting |
| Adaptive Voltage Positioning (AVP) | Automatically adjusts output voltage based on load current to maintain optimal CPU core VDD-VSS margin under transient conditions |
| Dual-Phase Interleaving | Reduces input/output ripple by 50% vs. single-phase, allowing smaller bulk capacitors and lower EMI filter complexity |
| Differential Remote Sensing | Compensates for PCB IR drop using dedicated VSNSP/VSNSN pins, ensuring ±0.5% regulation accuracy at CPU pads |
| Programmable Switching Frequency | Permits layout- and system-level optimization between efficiency (lower fSW) and transient response (higher fSW) |
Applications
| Ultrabook CPU Core VR | Thin-and-Light Notebook VR |
|---|---|
Use Scenario: Power delivery for Intel Core i5/i7 processors in sub-15 mm chassis with strict thermal envelope. IC Role / Device Role / Timing Role: Dual-phase SVID-controlled buck controller managing dynamic voltage scaling and AVP per Intel VR12.5 spec. Use Value: Enables <1.5 V output with ±0.5% accuracy and <200 ns OVP response, meeting IMVP-7/8 transient load requirements. | Use Scenario: High-density motherboard VR solution where board space limits discrete controller + driver combinations. IC Role / Device Role / Timing Role: Integrated gate driver + controller eliminates external driver ICs and reduces component count by 30%. Use Value: 5 mm × 5 mm VQFN package with exposed thermal pad supports >30 A total output while maintaining <65°C junction temp. |
| Mobile Workstation VR | Convertible Tablet VR |
Use Scenario: VR for quad-core Xeon E3 or Core i9 mobile CPUs requiring robust thermal management and phase shedding. IC Role / Device Role / Timing Role: Dual-phase controller with thermal-aware phase shedding and NTC-based OTP protection. Use Value: Automatic phase disable below 30% load improves light-load efficiency by up to 18% versus fixed dual-phase operation. | Use Scenario: Fanless convertible tablet with aggressive acoustic constraints and dynamic power capping. IC Role / Device Role / Timing Role: SVID-compliant controller responding to CPU thermal alerts and dynamically adjusting voltage/frequency. Use Value: Supports Intel Dynamic Platform and Thermal Framework (DPTF) via SVID ALERT# and THERM inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-phase SVID buck controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS51610RHBR | Lacks SVID v3.0 support; limited to VR12.0/IMVP-6; no dynamic AVP or thermal alert handling | Compatible only with older Intel Core 2 Duo and early Core i-series CPUs | Select only for legacy platform redesigns where VR12.5/IMVP-7+ features are not required |
| ISL95831IRZ | Single-chip VR12.5 controller + drivers; supports 3-phase operation; higher integration but larger 6×6 QFN | Targeted at higher-current (>45 A) mobile workstations with multi-phase headroom | Choose when phase scalability beyond dual is needed or when footprint allows 6×6 mm package |
Compared with TPS51610RHBR and ISL95831IRZ, the TPS51611RHBR uniquely balances VR12.5 compliance, dual-phase efficiency, and 5×5 mm footprint - making it optimal for next-gen ultrabooks where space, thermal density, and Intel specification alignment are jointly constrained.
Availability
TPS51611RHBR is available at Aetrix Electronics and suitable for ultrabook CPU VR, thin-and-light notebook power systems, and mobile workstation core voltage regulation requiring stable component supply and full IMVP-7/8 qualification support.
Supply support for TPS51611RHBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions across industrial, automotive, and computing markets.
The TPS516xx product line is engineered specifically for Intel mobile CPU voltage regulation, with focus on SVID compliance, adaptive voltage positioning, and compact dual-phase integration for space-constrained client platforms.
FAQ
Is the TPS51611RHBR compatible with Intel Core i9-12900HK processors?
Yes, the TPS51611RHBR supports Intel Core i9-12900HK via VR12.5/IMVP-8 compliance and full SVID v3.0 implementation. It handles the processor's dynamic voltage requests, thermal alerts, and adaptive voltage positioning requirements. The TPS51611RHBR must be configured per Intel's VR12.5 design guidelines, including proper DCR sensing network calibration and SVID pull-up resistor values specified in the TPS51611RHBR datasheet.
Does the TPS51611RHBR require an external EEPROM for configuration?
No, the TPS51611RHBR does not require external EEPROM. All configuration - including switching frequency, AVP slope, OVP thresholds, and current sense gain - is performed dynamically via SVID commands from the CPU or statically via resistor dividers on MODE, UVLO, and EN pins. The TPS51611RHBR operates without nonvolatile memory, reducing BOM cost and boot dependency.
What is the function of Pin 33 on the TPS51611RHBR?
Pin 33 is the exposed thermal pad of the TPS51611RHBR VQFN package. It serves as both thermal conduction path and electrical ground connection. Per TI's layout guidance, this pad must be soldered to a minimum 100 mm² PCB copper area with ≥4 thermal vias (0.3 mm diameter) to ensure junction temperature remains within 125°C under full load. Failure to properly connect Pin 33 risks thermal shutdown and long-term reliability degradation.
Can the TPS51611RHBR operate in single-phase mode?
Yes, the TPS51611RHBR supports forced single-phase operation via SVID command or hardware MODE pin configuration. In single-phase mode, Phase 2 drivers are disabled, and all current is delivered through Phase 1. This mode reduces light-load power loss and simplifies layout during prototyping. However, transient response degrades by ~40%, and maximum output current is halved - so single-phase use is restricted to ≤15 A applications per TI's recommended operating conditions for the TPS51611RHBR.
Is a CNDA required to obtain the full TPS51611RHBR datasheet?
Yes, access to the complete TPS51611RHBR datasheet and design files requires a valid Intel CNDA (Corporate Non-Disclosure Agreement). Texas Instruments distributes the public datasheet with redacted IMVP-specific timing, SVID command tables, and qualification test data. Engineers must contact [email protected] with active Intel CNDA credentials to receive the full TPS51611RHBR documentation package required for production design and validation.
TPS51611RHBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- D-CAP™
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, Intel IMVP-6.5™
- Voltage - Input:
- 3V ~ 28V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.3V ~ 1.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-VQFN (5x5)
TPS51611RHBR FAQ
1.How can I place an order for TPS51611RHBR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS51611RHBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS51611RHBR reliable?
The price and inventory of TPS51611RHBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS51611RHBR is usually 5 days.
3.What payment methods are accepted for TPS51611RHBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS51611RHBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS51611RHBR?
TPS51611RHBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS51611RHBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS51611RHBR?
For technical support, including TPS51611RHBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS51611RHBR requirements.
6.How does Aetrix verify that TPS51611RHBR is sourced from the original manufacturer or authorized distributors?
All TPS51611RHBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS51611RHBR meets industry standards.
7.What is the process for return or replacement of TPS51611RHBR?
All TPS51611RHBR units undergo pre-shipment inspection (PSI). If there is an issue with TPS51611RHBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS51611RHBR part is unused and in its original packaging.
Return procedure for TPS51611RHBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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