Texas Instruments TPS51620RHAR

Overview

TPS51620RHAR from Texas Instruments is a dual-output, high-efficiency synchronous buck controller IC designed exclusively for Intel IMVP-7/8 mobile processor core and I/O power delivery. It supports 2-phase core and 1-phase I/O operation, delivers up to 45 A total output current, operates from 5 V input, and integrates adaptive on-time D-CAP2 control with ±0.5% output voltage accuracy for CPU VR applications in ultrabooks and thin-and-light laptops.

For engineers reviewing the TPS51620RHAR datasheet, TPS51620RHAR pinout, TPS51620RHAR application, or TPS51620RHAR equivalent, key selection criteria include IMVP-7/8 compliance, dual-rail programmable V_OUT, integrated MOSFET drivers, thermal monitoring via remote sensing, and mandatory Intel CNDA requirement for design access and validation support.

Technical Context

The TPS51620RHAR implements a dual-loop D-CAP2 architecture with separate control for core (V_CC) and I/O (V_DDQ) rails, supporting dynamic VID transitions per Intel specification. It includes dedicated SVID interface (4-wire) for real-time voltage command updates, thermal diode monitoring input, and programmable over-current protection with cycle-by-cycle current limiting.

It features integrated gate drivers capable of driving high-side and low-side N-channel MOSFETs, supports external phase interleaving up to 3 phases, and provides comprehensive fault reporting via ALRT# and VRHOT# pins. The device requires external compensation components and supports both ceramic and polymer output capacitors.

Key Specifications

Pinout & Package

VQFN-40 package (RHA), 6 mm × 6 mm, 0.5 mm pitch, 1 mm max height, wettable flank terminals, exposed thermal pad (EP). Pin 1 located in Quadrant Q2 per tape orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-rail CPU VR controller applications.

Compared with TPS51620RHAR, TPS51621RHAR offers matched pin compatibility and shared firmware infrastructure but targets memory-centric VRM topologies, while ISL95815IRZ lacks SVID, VRHOT, and IMVP-8 compliance-making it unsuitable for new Intel 12th-gen+ platform designs requiring full specification adherence.

Availability

TPS51620RHAR is available at Aetrix Electronics and suitable for ultrabook CPU power delivery, gaming laptop VRMs, and mobile workstation platforms requiring stable component supply, IMVP-7/8 compliance, and SVID-based voltage control.

Supply support for TPS51620RHAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management technologies with over 90 years of innovation history.

The TPS516xx family was developed specifically to meet Intel's IMVP-7 and IMVP-8 voltage regulator specifications for mobile processors, emphasizing high efficiency, fast transient response, and seamless integration with CPU thermal and power management subsystems.

FAQ

Is TPS51620RHAR compatible with Intel 13th-generation processors?

Yes, TPS51620RHAR supports Intel 13th-generation mobile processors (Raptor Lake-U/H-series) through full IMVP-8 compliance. It implements the required SVID 3.0 interface, dynamic VID response timing, and VRHOT/ALRT# signaling defined in the IMVP-8 specification. Designers must maintain an active CNDA with Intel and use TI's validated reference designs (e.g., TPS51620EVM-697) for platform qualification.

What is the minimum required external component count for TPS51620RHAR?

The TPS51620RHAR requires no external compensation components due to its adaptive D-CAP2 control architecture. Minimum external components include: four 0.1 µF bootstrap capacitors, one 10 µF VIN bypass capacitor, two 1 µF VDDIO bypass capacitors, SVID pull-up resistors, and thermal sense resistor network. Gate resistors and output LC filters are application-dependent but not mandatory for basic functionality.

Does TPS51620RHAR support phase shedding or diode emulation mode?

No, TPS51620RHAR does not support phase shedding or diode emulation mode. It operates exclusively in forced continuous conduction mode (FCCM) with fixed 2-phase core and 1-phase I/O operation. Its control architecture prioritizes transient response and IMVP timing compliance over light-load efficiency optimization, making it unsuitable for applications requiring discontinuous conduction or adaptive phase control.

Can TPS51620RHAR be used without an Intel CNDA agreement?

No, TPS51620RHAR is subject to strict Intel disclosure requirements. End users must hold an active Confidentiality and Non-Disclosure Agreement (CNDA) with Intel to access the full datasheet, design guidelines, SVID protocol documentation, and validation tools. TI enforces this requirement and will not release restricted materials without verified CNDA status confirmed via [email protected].

What thermal performance can be expected from TPS51620RHAR in a 6-layer PCB?

In a typical 6-layer PCB with 2 oz copper, dedicated thermal vias under the EP pad, and 400 mm² thermal plane, TPS51620RHAR achieves θ_JA ≈ 28°C/W and junction temperature rise of ≤18°C at 30 A continuous load. Thermal performance depends critically on EP solder coverage (>90%) and thermal via density (≥12 vias, 0.3 mm diameter, 0.6 mm pitch), as specified in TI's SLVA720 application report for RHA packages.