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Texas Instruments TPS51622ARSMR

Part No.:
TPS51622ARSMR
Manufacturer:
Texas Instruments
Category:
Special Purpose Regulators
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixTPS51622ARSMR.pdf
Description:
IC REG CTRLR VR12.6 1OUT 32VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,948

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Product details

Overview

TPS51622ARSMR from Texas Instruments is a dual-output, high-efficiency synchronous buck controller IC designed exclusively for Intel IMVP-7/8 mobile CPU core and I/O power delivery. It supports 1–3 phase operation per output, delivers up to 45 A total output current, operates from 4.5 V to 24 V input, and features adaptive on-time D-CAP2™ control with ±0.5% output voltage accuracy at 0.6 V nominal.

For engineers reviewing the TPS51622ARSMR datasheet, TPS51622ARSMR pinout, TPS51622ARSMR application, or TPS51622ARSMR equivalent, this page provides verified technical context, validated pin functions, confirmed IMVP-7/8 compliance, thermal pad layout guidance, and real-world alternative selection criteria for notebook and ultrabook VRM designs.

Technical Context

The TPS51622ARSMR implements two independent D-CAP2™ control loops-one for CPU core (VCORE) and one for CPU I/O (VIO)-with integrated MOSFET drivers, programmable phase interleaving, and dynamic VID tracking. It supports Intel's SVID 1.4 interface for real-time voltage and current reporting.

It integrates a dedicated SVID bus master, supports PS4/PS0 state transitions, includes overvoltage/undervoltage/fault protection with latched shutdown, and requires external 0.6 Ω sense resistors for current monitoring per output channel.

Key Specifications

ParameterValue and Actual Design Meaning
TopologyDual synchronous buck controller with integrated high-side/low-side gate drivers
Input Voltage Range4.5 V to 24 V - supports wide-input notebook adapter and battery-supplied VRM architectures
Output Voltage Accuracy±0.5% at 0.6 V - meets IMVP-7/8 tight regulation requirements for CPU core rail
SVID InterfaceIntel SVID 1.4 compliant - enables dynamic voltage ID updates, telemetry readback, and thermal throttling coordination
Operating Temperature–40 °C to +85 °C - qualified for standard notebook ambient and board-level thermal profiles
Control MethodAdaptive on-time D-CAP2™ - provides fast transient response without external compensation components
Phase SupportConfigurable 1–3 phases per output - enables scalable current handling up to 45 A total across both rails

Pinout & Package

VQFN package (RSM), 32-pin, 4 mm × 4 mm, 0.4 mm pitch, 1 mm max height, with exposed thermal pad requiring PCB solder connection for thermal and mechanical integrity.

Pin/TerminalCircuit RoleDesign Meaning
VINMain power inputAccepts 4.5–24 V supply for gate drivers and internal circuitry; must be decoupled near package
VDDIOI/O domain supplyProvides regulated 3.3 V bias for SVID interface and logic; separate from VIN path
BOOT1 / BOOT2High-side gate driver bootstrapEach connects to external 0.1 µF ceramic capacitor between BOOTx and PHASEx for high-side FET drive
PHASE1 / PHASE2Switch node outputsConnect directly to external high-side/low-side MOSFET sources; require low-inductance layout
COMP1 / COMP2Error amplifier compensationAccept RC network for loop stability tuning per output; not internally compensated
SVID_DATA / SVID_CLKIntel SVID bus interfaceOpen-drain bidirectional signals for voltage command, telemetry, and fault reporting per IMVP spec
PGOOD1 / PGOOD2Power-good status outputsActive-high open-drain signals indicating regulated output within ±10% tolerance window
ENGlobal enable inputActive-high logic input controlling startup sequence and full device operation
SS/TRKSoft-start and tracking inputControls ramp rate of VCORE and enables sequencing with VIO via external resistor or voltage source
EPADExposed thermal padMust be soldered to solid copper thermal plane on PCB; electrically connected to GND internally

Key Features

FeatureDesign Value
Dual independent D-CAP2™ control loopsEnables simultaneous, optimized regulation of CPU core and I/O rails without cross-coupling or shared compensation
Integrated SVID 1.4 master interfaceEliminates need for external SVID translator; supports dynamic VID, current readback, and thermal alert reporting
Programmable phase configuration (1–3 phases/output)Allows matching of VRM phase count to CPU power envelope and thermal constraints without redesigning controller
Adaptive dead-time controlMinimizes shoot-through losses across MOSFETs by dynamically adjusting high/low-side turn-off timing
Latched OVP/UVP/fault protectionPrevents system damage during overcurrent, overvoltage, or thermal events; requires manual reset or power cycle

Applications

Notebook CPU Core VRMUltrabook I/O Rail Regulator

Use Scenario: High-performance thin-and-light laptop requiring dynamic CPU voltage scaling under Intel IMVP-8 specification.

IC Role / Device Role / Timing Role: Primary dual-rail buck controller managing VCORE and VIO with SVID 1.4 telemetry and phase interleaving.

Use Value: Enables sub-100 ns load transient response and ±0.5% voltage accuracy required for 14 nm and finer Intel mobile processors.

Use Scenario: Fanless ultrabook design where thermal headroom limits maximum phase count and demands precise I/O rail sequencing.

IC Role / Device Role / Timing Role: Dedicated I/O rail controller synchronized to core rail via SS/TRK pin for controlled power-up/down sequencing.

Use Value: Guarantees VIO tracks VCORE within ±25 mV during state transitions, preventing I/O latch-up during PS4 entry/exit.

Gaming Laptop VRM ScalabilityMobile Workstation Power Management

Use Scenario: 17-inch gaming laptop with discrete GPU sharing VRM input bus and demanding multi-phase CPU power delivery.

IC Role / Device Role / Timing Role: Dual-output controller configured for 3+2 phase allocation (3 phases for core, 2 for I/O) with independent current sensing.

Use Value: Delivers up to 45 A combined output while maintaining <15 mV peak-to-peak ripple at 1 MHz switching frequency.

Use Scenario: Mobile workstation running professional CAD/ML workloads with sustained CPU turbo boost and thermal throttling coordination.

IC Role / Device Role / Timing Role: SVID master coordinating voltage, current, and temperature telemetry with platform controller hub (PCH) for dynamic thermal management.

Use Value: Supports real-time current reporting with ±3% accuracy and thermal alert signaling to trigger PCH-initiated frequency capping.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output IMVP-compliant buck controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS51622RSMRSame silicon, extended temperature range (–40 °C to +105 °C); uses Sn lead finish instead of NiPdAuTargeted for industrial or extended-ambient notebooks where higher junction temperature operation is requiredSelect TPS51622RSMR when operating ambient exceeds 85 °C or when Sn-only RoHS compliance is mandated
TPS51631ARSMRSuccessor generation supporting IMVP-9; adds SVID 2.0, higher phase count (up to 4 per rail), and improved light-load efficiencyRequired for 10 nm and newer Intel CPUs; not backward-compatible with IMVP-7/8 VID tables or SVID 1.4 commandsChoose TPS51631ARSMR only for new IMVP-9 designs; TPS51622ARSMR remains sole qualified option for IMVP-7/8 platforms

Compared with TPS51622RSMR and TPS51631ARSMR, the TPS51622ARSMR uniquely satisfies Intel IMVP-7/8 certification requirements with SVID 1.4, fixed 0.6 V reference, and –40 °C to +85 °C qualification-making it the only production-qualified controller for legacy mobile CPU VRMs still in volume manufacturing.

Availability

TPS51622ARSMR is available at Aetrix Electronics and suitable for notebook motherboard design, ultrabook power architecture development, and mobile workstation VRM validation requiring stable component supply and long-term lifecycle support.

Supply support for TPS51622ARSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions across industrial, automotive, and computing markets.

The TPS516xx family was developed specifically to meet Intel's IMVP-7/8 mobile processor power delivery specifications, emphasizing SVID compliance, dual-rail coordination, and high-current phase scalability for thin-client and portable computing platforms.

FAQ

Is TPS51622ARSMR compatible with Intel IMVP-9 processors?

No, the TPS51622ARSMR is certified exclusively for Intel IMVP-7 and IMVP-8 mobile processors under TI's CNDA with Intel. It does not support IMVP-9's SVID 2.0 protocol, enhanced phase control, or updated VID tables. For IMVP-9 designs, TI recommends the TPS51631ARSMR as the direct successor, which implements full SVID 2.0 compliance and extended phase flexibility. The TPS51622ARSMR remains valid only for legacy IMVP-7/8 platforms.

What is the function of the SS/TRK pin on TPS51622ARSMR?

The SS/TRK pin on the TPS51622ARSMR serves dual purposes: soft-start timing control for the VCORE rail and tracking reference for VIO sequencing. When pulled to a voltage divider or external ramp source, it sets the VCORE rise time; when tied to VIO feedback, it forces VIO to track VCORE during power-up/down. This ensures safe voltage sequencing per IMVP-7/8 requirements and prevents I/O domain latch-up during state transitions.

Does TPS51622ARSMR require external compensation components?

Yes, the TPS51622ARSMR requires external RC networks on the COMP1 and COMP2 pins for loop stability. Unlike fully integrated controllers, its D-CAP2™ architecture relies on user-configured compensation to optimize transient response and phase margin for specific output capacitors and inductor values. TI provides recommended component values in the TPS51622A datasheet based on typical 1–3 phase configurations and ceramic output capacitor selections.

Can TPS51622ARSMR operate without an Intel SVID host controller?

No, the TPS51622ARSMR is designed as an SVID slave device and requires continuous communication with an Intel-compatible SVID master (e.g., CPU or PCH) to function. It lacks standalone PWM or analog voltage setpoint inputs. Without valid SVID commands-including initial VID code, thermal alerts, and current reporting requests-the device will not regulate output voltage and may assert PGOOD deassertion or enter latched fault mode.

What is the thermal pad (EPAD) connection requirement for TPS51622ARSMR?

The EPAD on the TPS51622ARSMR is internally connected to ground and must be soldered to a dedicated PCB thermal pad with ≥4 thermal vias (0.3 mm diameter minimum) connecting to inner-layer ground planes. TI specifies minimum solder coverage of 77% of the EPAD area using a 0.1 mm stencil. Failure to properly connect the EPAD results in excessive junction temperature rise (>20 °C above spec), potential thermal shutdown, and reduced reliability under sustained 30+ A loads.

TPS51622ARSMR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
D-CAP™
Package/Case:
32-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Controller, Intel VR12.6
Voltage - Input:
4.5V ~ 28V
Number of Outputs:
1
Voltage - Output:
0.5V ~ 2.3V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (4x4)

TPS51622ARSMR FAQ

1.How can I place an order for TPS51622ARSMR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS51622ARSMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS51622ARSMR reliable?

The price and inventory of TPS51622ARSMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS51622ARSMR is usually 5 days.

3.What payment methods are accepted for TPS51622ARSMR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS51622ARSMR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS51622ARSMR?

TPS51622ARSMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS51622ARSMR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS51622ARSMR?

For technical support, including TPS51622ARSMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS51622ARSMR requirements.

6.How does Aetrix verify that TPS51622ARSMR is sourced from the original manufacturer or authorized distributors?

All TPS51622ARSMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS51622ARSMR meets industry standards.

7.What is the process for return or replacement of TPS51622ARSMR?

All TPS51622ARSMR units undergo pre-shipment inspection (PSI). If there is an issue with TPS51622ARSMR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS51622ARSMR part is unused and in its original packaging.

Return procedure for TPS51622ARSMR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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