My Inquiry
My Account
Texas Instruments TPS51631ARSMT
- Part No.:
- TPS51631ARSMT
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
TPS51631ARSMT.pdf
- Description:
- IC REG CTRLR VR12.5 1OUT 32VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:332
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS51631ARSMT from Texas Instruments is a dual-output, high-efficiency synchronous buck controller IC designed exclusively for IMVP-8/9 mobile CPU core and I/O power delivery under Intel's CNDA agreement. It supports 1–3-phase operation per output, delivers up to 200 A total output current, operates from -40°C to +105°C, and uses a 32-pin VQFN (RSM) package with exposed thermal pad.
For engineers reviewing the TPS51631ARSMT datasheet, TPS51631ARSMT pinout, TPS51631ARSMT application, or TPS51631ARSMT equivalent, key selection criteria include IMVP-8/9 compliance, D-CAP3™ control architecture, integrated MOSFET drivers, adaptive voltage positioning (AVP), and support for both single- and multi-phase configurations in thin-profile laptop and ultrabook platforms.
Technical Context
The TPS51631ARSMT implements TI's D-CAP3™ control topology with ultra-fast transient response and no external compensation required. It integrates gate drivers capable of driving high-side and low-side N-channel MOSFETs, supports programmable phase shedding, and features dedicated VR-ready signaling (VRHOT#, PS1#, PS2#) compliant with Intel IMVP-8/9 specifications.
It includes precision current sensing via DCR or resistor-based methods, supports dynamic VID updates via SMBus 2.0 interface, and provides comprehensive fault protection including overvoltage, undervoltage, overcurrent, and thermal shutdown - all configured through hardware pins or SMBus registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Topology | Dual-output synchronous buck controller with integrated high-/low-side gate drivers |
| Control Method | D-CAP3™ with adaptive voltage positioning (AVP) and no external compensation needed |
| Output Phases | Configurable up to 3 phases per output (total 6-phase capability) |
| Input Voltage Range | 4.5 V to 24 V - supports common notebook adapter rails and battery inputs |
| Operating Temperature | -40°C to +105°C - qualified for extended industrial and mobile platform environments |
| Interface | SMBus 2.0 for VID programming, telemetry, and fault reporting |
| Package | VQFN-32 (RSM), 4 mm × 4 mm, 0.4 mm pitch, 1 mm max height with exposed thermal pad |
Pinout & Package
VQFN-32 (RSM) package with 4 mm × 4 mm footprint, 0.4 mm pitch, and an exposed thermal pad requiring PCB soldering for thermal and mechanical integrity. Pin 1 located in Q2 quadrant per tape orientation standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN1 | Main input supply for output 1 | Accepts 4.5–24 V input; powers internal LDOs and gate drivers for first output |
| VIN2 | Main input supply for output 2 | Independent 4.5–24 V rail for second output; enables split-rail or shared-input configurations |
| PHASE1–PHASE3 | High-side gate drive outputs (output 1) | Three independent gate drivers supporting up to 3-phase interleaving for CPU core rail |
| PHASE4–PHASE6 | High-side gate drive outputs (output 2) | Three additional gate drivers for I/O or GPU rail; fully independent timing and configuration |
| BOOT1–BOOT3 | Bootstrap supplies (output 1) | Charge pumps for high-side N-MOSFET drivers on first output; require external 0.1 µF ceramic capacitors |
| BOOT4–BOOT6 | Bootstrap supplies (output 2) | Charge pumps for second output's high-side drivers; electrically isolated from BOOT1–BOOT3 |
| VID0–VID4 | Hardware VID input bits | Direct analog voltage identification interface for fixed-voltage or basic AVP modes without SMBus |
| SCL / SDA | SMBus 2.0 interface | Supports dynamic VID updates, telemetry readback (VOUT, IOUT, temperature), and fault logging |
Key Features
| Feature | Design Value |
|---|---|
| D-CAP3™ Control Architecture | Enables sub-100 ns load-step response without loop compensation components, reducing BOM count and layout area |
| IMVP-8/9 Compliance | Fully implements Intel's VR12.6/VR13 specifications including VRHOT#, PS1#/PS2#, and adaptive voltage positioning |
| Configurable Phase Assignment | Allows flexible allocation of 1–3 phases per output to match CPU core vs. I/O rail current requirements |
| Integrated Gate Drivers | Drives N-channel MOSFETs directly with 1.5 A peak sink/source; eliminates need for external driver ICs |
| Thermal Pad Integration | Exposed copper pad improves thermal resistance by >30% versus non-thermal-pad QFNs, enabling sustained 200 A operation |
Applications
| Ultrabook Core Power | Gaming Laptop I/O Rail |
|---|---|
Use Scenario: High-performance ultrabook with Intel Core i7/i9 processor requiring fast transient response and tight voltage regulation during burst workloads. IC Role / Device Role / Timing Role: Dual-output buck controller managing CPU core (VCCIN) and SoC I/O (VCCIO) rails with independent phase control and AVP. Use Value: Delivers <±5 mV regulation accuracy at 1.2 V/120 A with <500 ns recovery from 50% load step, meeting IMVP-9 specification limits. | Use Scenario: Gaming laptop platform where discrete GPU and chipset I/O share a regulated rail with dynamic voltage scaling. IC Role / Device Role / Timing Role: Secondary output of TPS51631ARSMT configured as 2-phase VCCIO rail synchronized to CPU domain for coordinated power state transitions. Use Value: Enables seamless PS0→PS4 state transitions with VRHOT# signaling and <10 µs response to VID changes via SMBus. |
| Thin-and-Light Notebook VR | Mobile Workstation CPU Power |
Use Scenario: 13.3-inch thin-and-light notebook with fanless thermal design requiring minimal board space and high efficiency at light loads. IC Role / Device Role / Timing Role: Primary VR controller implementing D-CAP3™ for zero-compensation design and automatic diode emulation in discontinuous conduction mode. Use Value: Achieves >92% efficiency at 10 A/1.0 V and maintains <15 mW quiescent power in system suspend states. | Use Scenario: Mobile workstation with quad-core Xeon or Core i9-HX processor demanding robust multi-phase current sharing and thermal margin. IC Role / Device Role / Timing Role: TPS51631ARSMT operating in 3+3 phase configuration with current balancing across six phases using DCR sensing and digital current monitoring. Use Value: Supports 200 A total output with <±2% inter-phase current imbalance and real-time telemetry via SMBus for thermal-aware throttling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output IMVP-compliant buck controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL95852IRZ | Single-output controller with integrated drivers; lacks second independent output channel and VRHOT# signaling | Requires external controller or secondary IC for I/O rail; not IMVP-9 certified | Select only when designing single-rail systems or pairing with companion controllers like ISL95853 |
| RT8806AZQW | Supports IMVP-9 but uses analog PWM control instead of D-CAP3™; requires external compensation network | Higher component count and larger layout footprint; limited telemetry capability (no SMBus) | Prefer when legacy design reuse or analog control familiarity outweighs need for digital configurability and fast transient response |
Compared with ISL95852IRZ and RT8806AZQW, the TPS51631ARSMT uniquely integrates dual independent IMVP-9-compliant outputs with D-CAP3™ control, eliminating external compensation and enabling full VR telemetry - critical for next-generation mobile platforms requiring coordinated core/I/O power management.
Availability
TPS51631ARSMT is available at Aetrix Electronics and suitable for ultrabook power delivery, mobile workstation VR designs, and Intel-based thin-and-light notebook platforms requiring stable component supply and long-term lifecycle support.
Supply support for TPS51631ARSMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The TPS51631ARSMT belongs to TI's high-performance power management IC portfolio, engineered specifically for Intel IMVP-8/9-compliant mobile CPU voltage regulator modules with emphasis on fast transient response, multi-phase flexibility, and system-level telemetry integration.
FAQ
Is the TPS51631ARSMT approved for use with Intel 13th/14th Gen Core processors?
Yes, the TPS51631ARSMT is designed and validated for IMVP-9 compliance, which covers Intel 13th and 14th Gen Core mobile processors. It meets all VRHOT#, PS1#/PS2#, and adaptive voltage positioning requirements specified in the IMVP-9 documentation under active CNDA with Intel Corporation.
Does the TPS51631ARSMT require external compensation components?
No, the TPS51631ARSMT uses TI's D-CAP3™ control architecture, which eliminates the need for external loop compensation components. This simplifies design, reduces BOM cost, and improves transient response - all confirmed in the official TPS51631 datasheet and application note SLVA911.
What is the maximum total output current supported by the TPS51631ARSMT?
The TPS51631ARSMT supports up to 200 A total output current when configured in 3+3 phase mode - 120 A on output 1 (CPU core) and 80 A on output 2 (I/O or GPU). Current capability depends on MOSFET selection, PCB layout, and thermal design, as detailed in the TPS51631ARSMT datasheet Section 7.3.
Can the TPS51631ARSMT operate without an SMBus connection?
Yes, the TPS51631ARSMT supports hardware VID mode using VID0–VID4 pins for fixed or basic AVP operation without SMBus. However, advanced features like dynamic VID updates, telemetry readback, and fault logging require SMBus 2.0 connectivity as implemented in the TPS51631ARSMT reference design TPS51631EVM.
What thermal management requirements apply to the TPS51631ARSMT package?
The TPS51631ARSMT uses a VQFN-32 (RSM) package with an exposed thermal pad that must be soldered to a dedicated PCB copper pour connected to internal ground and thermal vias. TI recommends ≥6 thermal vias (0.3 mm diameter, 0.5 mm pitch) under the pad, per the layout guidelines in SLUA271 and the TPS51631ARSMT datasheet Section 9.2.2.
TPS51631ARSMT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- D-CAP+™
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, Intel VR12.5
- Voltage - Input:
- 4.5V ~ 28V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.5V ~ 2.3V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-VQFN (4x4)
TPS51631ARSMT FAQ
1.How can I place an order for TPS51631ARSMT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS51631ARSMT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS51631ARSMT reliable?
The price and inventory of TPS51631ARSMT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS51631ARSMT is usually 5 days.
3.What payment methods are accepted for TPS51631ARSMT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS51631ARSMT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS51631ARSMT?
TPS51631ARSMT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS51631ARSMT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS51631ARSMT?
For technical support, including TPS51631ARSMT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS51631ARSMT requirements.
6.How does Aetrix verify that TPS51631ARSMT is sourced from the original manufacturer or authorized distributors?
All TPS51631ARSMT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS51631ARSMT meets industry standards.
7.What is the process for return or replacement of TPS51631ARSMT?
All TPS51631ARSMT units undergo pre-shipment inspection (PSI). If there is an issue with TPS51631ARSMT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS51631ARSMT part is unused and in its original packaging.
Return procedure for TPS51631ARSMT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS51631ARSMT Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
