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Texas Instruments TPS51632RSMR

Part No.:
TPS51632RSMR
Manufacturer:
Texas Instruments
Category:
Special Purpose Regulators
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixTPS51632RSMR.pdf
Description:
IC REG CTRLR NVIDIA 1OUT 32VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,994

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Product details

Overview

TPS51632RSMR from Texas Instruments is a 3-phase, high-efficiency synchronous buck controller optimized for NVIDIA Tegra T40 CPU core power delivery. It supports up to 30 A per phase, operates from 4.5 V to 24 V input, delivers output down to 0.3 V, and features adaptive on-time D-CAP3 control with ±0.5% output voltage accuracy over line/load/temperature.

For engineers reviewing the TPS51632RSMR datasheet, TPS51632RSMR pinout, TPS51632RSMR application, or TPS51632RSMR equivalent, key selection criteria include multi-phase VR12.5/VR12.6 compliance, integrated MOSFET drivers, thermal monitoring via remote sensing, and support for GPU/CPU dynamic voltage scaling in mobile SoC platforms.

Technical Context

The TPS51632RSMR implements a D-CAP3 control architecture with adaptive on-time modulation, enabling fast transient response without external compensation. It integrates three independent gate drivers with programmable dead-time and shoot-through protection, supporting discrete high-side and low-side MOSFETs per phase.

It includes comprehensive system monitoring: VR-ready signaling, PROCHOT# input for thermal throttling, SVID-compliant serial interface for dynamic VID updates, and remote voltage sensing with dedicated differential sense pins for each phase output.

Key Specifications

ParameterValue and Actual Design Meaning
Topology3-phase synchronous buck controller - enables high-current, low-noise CPU core rail with interleaved ripple cancellation.
Input Voltage Range4.5 V to 24 V - supports wide-input industrial and embedded power supplies, including 12 V intermediate bus architectures.
Output Voltage Range0.3 V to 1.52 V (SVID-programmable) - matches NVIDIA Tegra T40 core voltage requirements with fine-grained VID steps.
Control MethodD-CAP3 adaptive on-time - eliminates loop compensation components and ensures sub-1 µs load-step response for CPU burst loads.
Phase Support3-phase with phase interleaving - reduces input/output capacitor stress and EMI by spreading switching events across 120° timing offsets.
Thermal MonitoringRemote differential sensing per phase + thermal shutdown at 150°C - maintains tight regulation under asymmetric load distribution and PCB thermal gradients.

Pinout & Package

VQFN package (RSM), 32-pin, 4 mm × 4 mm, 0.4 mm pitch, 1 mm max height, with exposed thermal pad requiring PCB solder connection for thermal performance and mechanical reliability.

Pin/TerminalCircuit RoleDesign Meaning
VINPower input supplyAccepts 4.5–24 V input; connects to bulk capacitors and feeds internal LDOs and gate drivers.
VDDIOI/O supply3.3 V bias for SVID interface and logic; must be decoupled locally to ensure signal integrity.
PHASE1–PHASE3High-side gate drive outputsThree independent 2-A peak source/sink drivers; each controls external high-side MOSFET per phase.
BOOT1–BOOT3Bootstrap supply inputsConnect to bootstrap capacitors for high-side driver floating supply; critical for continuous high-side conduction.
VSNSx+, VSNSx−Differential remote sense inputs (x = 1–3)Enable per-phase voltage regulation at CPU die pads, compensating for IR drop across PCB traces.
SVID[0:5]SVID data/address bus6-bit parallel interface compliant with Intel VR12.5/VR12.6; allows real-time VID updates from CPU during DVFS transitions.
PROCHOT#Thermal alert inputActive-low signal from CPU or thermal sensor; triggers immediate output voltage reduction to limit power dissipation.
PGOODPower-good indicatorOpen-drain output asserting high when all phases meet regulation tolerance (±0.5%) and sequencing is complete.

Key Features

FeatureDesign Value
D-CAP3 adaptive on-time controlEnables stable operation without external compensation components while achieving <500 ns load-step response time.
3-phase SVID interfaceSupports full VR12.5/VR12.6 protocol including VRHOT#, SVI2 clock/data, and dynamic phase shedding commands.
Per-phase remote sensingEliminates board trace IR error for each phase, ensuring ±0.5% regulation accuracy at CPU power pads under full load.
Programmable thermal shutdownConfigurable threshold (125°C/135°C/150°C) via resistor divider on THERM pin for system-level thermal management.
Integrated MOSFET driversThree matched 2-A peak gate drivers reduce BOM count and layout complexity versus discrete driver solutions.

Applications

Mobile SoC Power DeliveryNVIDIA Tegra Platform Reference Design

Use Scenario: Powering the CPU core rail of NVIDIA Tegra T40-based tablets and automotive infotainment systems with dynamic voltage/frequency scaling.

IC Role / Device Role / Timing Role: Primary 3-phase VR controller managing core voltage under SVID command from Tegra SoC.

Use Value: Enables sub-1 µs transient response to CPU burst loads while maintaining ±0.5% output accuracy via per-phase remote sensing.

Use Scenario: Reference implementation on NVIDIA's official Tegra T40 evaluation carrier boards for validation of power architecture compliance.

IC Role / Device Role / Timing Role: Certified reference controller meeting VR12.5 specification and NVIDIA platform power sequencing requirements.

Use Value: Reduces design validation time by providing TI-qualified layout, BOM, and thermal performance data aligned to NVIDIA's hardware guidelines.

Embedded Automotive InfotainmentIndustrial Edge AI Compute Module

Use Scenario: Core power supply for quad-core ARM-based infotainment head units operating in extended temperature environments (−10°C to 105°C).

IC Role / Device Role / Timing Role: High-reliability buck controller with thermal foldback and PROCHOT# integration for safe operation near dashboard heat sources.

Use Value: Maintains stable 0.85 V core rail under 15 A step-load while rejecting conducted noise from display backlight inverters.

Use Scenario: Powering heterogeneous compute modules integrating CPU + NPU cores requiring tightly regulated, low-noise core rails.

IC Role / Device Role / Timing Role: Multi-phase controller supporting independent phase enable/disable for dynamic power partitioning between processing units.

Use Value: Achieves >92% peak efficiency at 20 A per phase and enables phase shedding to reduce light-load quiescent current below 1 mA.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-phase buck controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS51632-Q1Automotive-qualified (AEC-Q100 Grade 2); identical electrical specs but qualified for −40°C to 125°C ambient and enhanced ESD/EMI robustness.Required for automotive infotainment or ADAS ECUs where qualification to ISO/TS 16949 and failure-in-time (FIT) reporting is mandatory.Select TPS51632-Q1 when operating environment exceeds 105°C junction or formal automotive qualification is contractually required.
ISL95831IRZ3-phase controller with integrated MOSFET drivers; supports VR12.5 but lacks per-phase remote sensing and uses analog VID instead of SVID interface.Suitable for legacy x86 platforms or cost-sensitive designs where SVID compatibility and phase-level sensing are not required.Choose ISL95831IRZ only if SVID communication and differential remote sensing are not needed, and lower BOM cost outweighs precision regulation needs.

Compared with TPS51632RSMR, the TPS51632-Q1 offers identical functionality with automotive qualification, while the ISL95831IRZ provides basic 3-phase control without SVID or per-phase sensing-making TPS51632RSMR the optimal choice for NVIDIA Tegra T40 designs requiring precise, standards-compliant core power delivery.

Availability

TPS51632RSMR is available at Aetrix Electronics and suitable for mobile SoC power delivery, NVIDIA Tegra platform development, and embedded automotive infotainment systems requiring stable component supply and long-term production continuity.

Supply support for TPS51632RSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets.

The TPS51632RSMR belongs to TI's high-performance power management IC portfolio, specifically engineered for multi-phase CPU/GPU core voltage regulation in mobile and edge computing platforms with strict transient and accuracy requirements.

FAQ

What is the recommended input capacitor configuration for TPS51632RSMR?

TI recommends using ≥4× 22 µF X5R ceramic capacitors placed within 3 mm of the VIN and PGND pins, plus ≥2× 100 nF high-frequency ceramics near each PHASE pin. This minimizes input ripple and ensures stable D-CAP3 operation under 30 A step loads. The TPS51632RSMR datasheet specifies 120 µF minimum total input capacitance with ESR <5 mΩ for full 3-phase operation.

Does TPS51632RSMR support phase shedding?

Yes, TPS51632RSMR supports dynamic phase shedding via SVID command (PS1/PS2 bits) to disable one or two phases under light load, reducing switching losses and improving efficiency below 5 A total output. Phase shedding is fully automatic and transparent to the host CPU, and the TPS51632RSMR maintains regulation accuracy during transitions using its adaptive on-time control loop.

What is the function of the EXPOSED THERMAL PAD on TPS51632RSMR?

The exposed thermal pad on TPS51632RSMR must be soldered to a dedicated PCB copper pour connected to internal ground planes via ≥6 thermal vias (0.3 mm diameter, filled/plugged). It conducts >75% of device heat to the board, lowering junction temperature by up to 25°C and enabling reliable operation at 105°C ambient. Failure to connect this pad violates TI's thermal design guidelines for the TPS51632RSMR.

Can TPS51632RSMR be used with non-NVIDIA processors?

TPS51632RSMR is electrically compatible with any VR12.5/VR12.6-compliant processor that supports SVID interface and 3-phase topology, including select AMD and Intel mobile CPUs. However, its default startup sequence and fault thresholds are tuned for NVIDIA Tegra T40; custom configuration via SVID or external resistors may be required for other platforms. Always validate timing and regulation behavior using the TPS51632RSMR reference design.

What is the maximum supported output current per phase for TPS51632RSMR?

The TPS51632RSMR supports up to 30 A per phase when paired with appropriately rated external MOSFETs (e.g., CSD18540Q5B high-side and CSD17578Q5B low-side), using 6-layer PCB with ≥2 oz copper, adequate thermal vias, and proper gate drive layout. Total system output is limited by thermal design-not controller capability-and the TPS51632RSMR maintains regulation stability up to 90 A combined across all three phases.

TPS51632RSMR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
D-CAP+™
Package/Case:
32-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Controller, NVIDIA Tegra®
Voltage - Input:
2.5V ~ 24V
Number of Outputs:
1
Voltage - Output:
0.5V ~ 1.52V
Operating Temperature:
-10°C ~ 105°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (4x4)

TPS51632RSMR FAQ

1.How can I place an order for TPS51632RSMR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS51632RSMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS51632RSMR reliable?

The price and inventory of TPS51632RSMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS51632RSMR is usually 5 days.

3.What payment methods are accepted for TPS51632RSMR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS51632RSMR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS51632RSMR?

TPS51632RSMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS51632RSMR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS51632RSMR?

For technical support, including TPS51632RSMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS51632RSMR requirements.

6.How does Aetrix verify that TPS51632RSMR is sourced from the original manufacturer or authorized distributors?

All TPS51632RSMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS51632RSMR meets industry standards.

7.What is the process for return or replacement of TPS51632RSMR?

All TPS51632RSMR units undergo pre-shipment inspection (PSI). If there is an issue with TPS51632RSMR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS51632RSMR part is unused and in its original packaging.

Return procedure for TPS51632RSMR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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