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Texas Instruments TPS51640RSLT

Part No.:
TPS51640RSLT
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
-
Datasheet:
AetrixTPS51640RSLT.pdf
Description:
2+1 IMVP7 CPU CONTROLLER
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,012

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Product details

Overview

TPS51640RSLT from Texas Instruments is a dual-channel IMVP-7-compliant step-down controller with integrated 3-phase CPU and 1-phase GPU FET drivers, supporting SVID interface, D-CAP+™ control architecture, 8-bit DAC (0.250–1.52 V), VCORE overshoot/undershoot reduction (OSR/USR), and voltage positioning for notebook CPU/GPU core power delivery.

For engineers reviewing the TPS51640RSLT datasheet, TPS51640RSLT pinout, TPS51640RSLT application, or TPS51640RSLT equivalent, this page delivers verified technical context, confirmed pin functions, real-world application cards for mobile VCORE systems, and two validated alternative controllers with documented functional differences and selection guidance.

Technical Context

The TPS51640RSLT implements dual independent control loops: a 3-phase CPU channel using D-CAP+™ with overlapping pulse support for undershoot reduction (USR) and fast transient response, and a dedicated 1-phase GPU channel with identical OSR/USR thresholds and shared SVID bus. Both channels feature integrated high-speed gate drivers (DRVH/DRVL) with <25 ns transition times and programmable non-overlap timing.

It supports full IMVP-7 mobile features including dual PGOOD signals, VR_HOT and ALERT outputs, digital current monitoring via CIMON/GIMON analog outputs, adjustable slew rate (via SLEWA pin), and 8-level selectable per-channel current limit (OCP) using external resistors on COCP-I and GOCP-I pins.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Channel PhasesConfigurable 1-, 2-, or 3-phase operation; enables dynamic phase shedding in PS states for light-load efficiency.
GPU Channel PhasesFixed single-phase output; supports discrete GPU or integrated graphics core power with independent feedback loop.
SVID ComplianceFully compliant with Intel IMVP-7 specification; supports dynamic VID updates, thermal reporting (CTHERM/GTHERM), and VR_HOT signaling.
DAC Output Range0.250 V to 1.52 V in 5-mV steps; provides precise VCORE/VGFX voltage setting across processor operating conditions.
Operating Temperature–10°C to +105°C junction; qualified for mobile platform thermal environments including thin-and-light notebooks.
Package48-pin QFN (6 mm × 6 mm, PowerPAD™); thermally enhanced for high-current CPU/GPU power stages.
Input Voltage Range3 V to 28 V (VBAT); supports adapter, battery, NVDC, and 3/5/12-V rail inputs without external regulation.

Pinout & Package

TPS51640RSLT is housed in a 48-pin QFN package (RSL) with exposed thermal pad (PowerPAD™). The package supports high-power dissipation in compact mobile designs and requires PCB thermal vias under the pad for reliable operation at full load.

Pin/TerminalCircuit RoleDesign Meaning
CDH1, CDH2CPU high-side gate drive outputsDrive top N-FETs for phases 1 and 2; each capable of 2.2-A sink/source with <25-ns transitions.
CDL1, CDL2CPU low-side gate drive outputsDrive synchronous rectifiers for phases 1 and 2; include internal non-overlap logic to prevent shoot-through.
CPWM3, CSKIPCPU external driver controlProvide PWM and skip-mode signals for third CPU phase driven by external TPS51601-type driver.
GPWM, GSKIPGPU driver control5-V logic-level outputs to manage external GPU FET driver; enable FCCM/SKIP mode selection.
CVFB, GVFBCPU/GPU voltage sense inputsDirect connection to VCORE/VGFX; integrate soft-stop transistor for controlled shutdown during VR_ON deassertion.
CCSP1–3, CCSN1–3CPU current sense inputsSupport DCR or resistor-based sensing per phase; CCSN1 includes secondary OVP comparator for fault protection.
GCSP, GCSNGPU current sense inputsSingle-phase sensing network; GCSN integrates soft-stop pull-down for safe GPU power removal.
SLEWASlew rate configuration inputAnalog voltage sets 7-step VCORE slew rate (1.25–26 mV/µs); latched at startup for stable voltage ramping.

Key Features

FeatureDesign Value
D-CAP+™ Control ArchitectureEnables zero-external-compensation operation with fast transient response (<10 µs recovery) and minimal output capacitance requirements.
VCORE Overshoot Reduction (OSR)Programmable threshold (106–610 mV) reduces peak voltage excursions during load release, protecting CPU I/O and core logic.
VCORE Undershoot Reduction (USR)Configurable threshold (40–230 mV) minimizes voltage dip during load insertion, preventing processor reset or cache corruption.
AutoBalance™ Phase BalancingPatent-pending algorithm dynamically equalizes current sharing among CPU phases without external current-sense resistors.
Dual Independent Current MonitoringAnalog outputs (CIMON/GIMON) provide real-time current representation for both CPU and GPU channels with ±3% internal tolerance.
Integrated Thermal Sensing InterfaceDedicated CTHERM and GTHERM pins support NTC thermistor networks for accurate die-temperature tracking and VR_HOT assertion.

Applications

Mobile Notebook VCOREGaming Laptop GPU Core

Use Scenario: High-performance ultrabook requiring adaptive CPU voltage scaling across P-states and thermal throttling.

IC Role / Device Role / Timing Role: Dual-channel IMVP-7 controller managing 3-phase CPU core and 1-phase GPU core with synchronized SVID commands and independent PGOOD signaling.

Use Value: Enables dynamic voltage/frequency scaling per Intel specification while maintaining sub-200-mV transient deviation under 66-A load steps.

Use Scenario: Discrete GPU power delivery in thin gaming laptops where space and thermal density constrain external driver count.

IC Role / Device Role / Timing Role: GPU channel operates as standalone 1-phase controller driving external DrMOS or discrete FETs via GPWM/GSKIP signals.

Use Value: Eliminates need for separate GPU controller IC; reduces BOM count and PCB area while retaining IMVP-7 compliance and thermal monitoring.

Convertible Tablet PlatformEmbedded Mobile Workstation

Use Scenario: 2-in-1 device switching between tablet and laptop modes with varying CPU load profiles and battery-only operation.

IC Role / Device Role / Timing Role: Supports NVDC input architecture and seamless transition between adapter/battery rails using wide 3–28-V VBAT range.

Use Value: Maintains stable VCORE regulation during rail switchover with no voltage glitch or PGOOD dropout, ensuring OS continuity.

Use Scenario: Fanless industrial mobile workstation running sustained compute workloads with strict thermal envelope limits.

IC Role / Device Role / Timing Role: Uses CTHERM/GTHERM interfaces with NTC networks to trigger VR_HOT and throttle CPU/GPU before junction exceeds 155°C.

Use Value: Prevents thermal runaway through hardware-latched shutdown-no firmware dependency-ensuring system reliability under extended load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel IMVP-7 controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS59640RSLTRated for –40°C to +105°C operation; VBOOT = 0 V; identical pinout and feature set.Required for extended-temperature industrial or automotive-adjacent notebook designs.Select when ambient operating temperature may fall below –10°C or long-term reliability at cold extremes is critical.
TPS59641RSLTVBOOT = 1.1 V (vs. 0 V); otherwise identical electrical specs, package, and pinout.Necessary when external bootstrap circuitry requires 1.1-V bias reference instead of ground-referenced boot.Choose only if system-level FET driver design mandates 1.1-V bootstrap voltage; not interchangeable with TPS51640RSLT without layout change.

Compared with TPS51640RSLT, TPS59640RSLT extends cold-temperature capability for ruggedized platforms, while TPS59641RSLT addresses specific bootstrap voltage architecture needs-neither offers pin-to-pin compatibility without verifying VBOOT interface requirements.

Availability

TPS51640RSLT is available at Aetrix Electronics and suitable for mobile notebook VCORE, gaming laptop GPU core, and embedded mobile workstation applications requiring stable component supply, IMVP-7 compliance, and thermal-aware power delivery.

Supply support for TPS51640RSLT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management ICs for computing platforms.

The TPS51640RSLT belongs to TI's IMVP-7-compliant dual-channel controller product line, designed specifically for high-efficiency, thermally robust core power delivery in space-constrained mobile processors.

FAQ

What is the operating temperature range specified for the TPS51640RSLT?

The TPS51640RSLT is rated for operation from –10°C to +105°C ambient temperature. This range is defined in the official TI datasheet SLUSAQ2 and applies to the TPS51640A variant, which matches the TPS51640RSLT ordering code. It is suitable for mainstream consumer notebook thermal environments but not for extended industrial or automotive temperature grades.

Does the TPS51640RSLT support both CPU and GPU power delivery simultaneously?

Yes, the TPS51640RSLT integrates dual independent control channels: a 3-phase CPU channel and a dedicated 1-phase GPU channel. Both share the same SVID interface and operate concurrently with separate feedback loops, PGOOD signals (CPGOOD/GPGOOD), and thermal monitoring (CTHERM/GTHERM), enabling true simultaneous core power delivery.

How does the TPS51640RSLT implement overshoot and undershoot reduction?

The TPS51640RSLT provides configurable VCORE Overshoot Reduction (OSR) and Undershoot Reduction (USR) via external resistors on the CSKIP and GSKIP pins. OSR thresholds range from 106 mV to 610 mV; USR from 40 mV to 230 mV. These features activate during load transients to clamp voltage excursions within safe margins without software intervention.

What package type and pin count does the TPS51640RSLT use?

The TPS51640RSLT uses a 48-pin QFN package (RSL variant) measuring 6 mm × 6 mm with an exposed thermal pad (PowerPAD™). This package is thermally optimized for high-current CPU/GPU power stages and requires PCB thermal vias under the pad for optimal junction temperature management.

Can the TPS51640RSLT be used with external DrMOS devices?

Yes, the TPS51640RSLT supports external DrMOS integration via its CPWM3/CSKIP and GPWM/GSKIP outputs. These 5-V logic-level signals drive third-party DrMOS modules for the CPU's third phase and the entire GPU channel, while the internal drivers handle the first two CPU phases-enabling flexible, scalable power stage design.

TPS51640RSLT Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
-
Series:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
-
Core Size:
-
Speed:
-
Connectivity:
-
Peripherals:
-
Number of I/O:
-
Program Memory Size:
-
Program Memory Type:
-
EEPROM Size:
-
RAM Size:
-
Voltage - Supply (Vcc/Vdd):
-
Data Converters:
-
Oscillator Type:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:

TPS51640RSLT FAQ

1.How can I place an order for TPS51640RSLT through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS51640RSLT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS51640RSLT reliable?

The price and inventory of TPS51640RSLT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS51640RSLT is usually 5 days.

3.What payment methods are accepted for TPS51640RSLT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS51640RSLT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS51640RSLT?

TPS51640RSLT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS51640RSLT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS51640RSLT?

For technical support, including TPS51640RSLT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS51640RSLT requirements.

6.How does Aetrix verify that TPS51640RSLT is sourced from the original manufacturer or authorized distributors?

All TPS51640RSLT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS51640RSLT meets industry standards.

7.What is the process for return or replacement of TPS51640RSLT?

All TPS51640RSLT units undergo pre-shipment inspection (PSI). If there is an issue with TPS51640RSLT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS51640RSLT part is unused and in its original packaging.

Return procedure for TPS51640RSLT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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