Texas Instruments TPS51678RSMR

Overview

TPS51678RSMR from Texas Instruments is a dual-output, high-efficiency synchronous buck controller IC designed exclusively for IMVP-8/9 mobile CPU core and SoC power delivery under Intel's strict CNDA. It supports 2-phase operation per output, delivers up to 200 A total output current, operates from 4.5 V to 24 V input, and features adaptive on-time D-CAP3™ control with ±0.5% reference accuracy. It is deployed in ultrabook and thin-and-light laptop VRMs.

For engineers reviewing the TPS51678RSMR datasheet, TPS51678RSMR pinout, TPS51678RSMR application, or TPS51678RSMR equivalent, key selection criteria include IMVP-8/9 compliance, dual 2-phase configuration, integrated MOSFET drivers, programmable current sensing, and thermal monitoring via remote diode interface.

Technical Context

The TPS51678RSMR implements a dual-output, interleaved 2-phase per rail architecture with independent voltage regulation loops, supporting dynamic VID updates and seamless transition between C-states. It integrates gate drivers capable of driving 30-A peak current per phase and includes dedicated SVID-compliant serial interface for communication with Intel processors.

It features D-CAP3™ control with built-in ramp compensation, supports external current-sense resistors or lossless inductor DCR sensing, and provides comprehensive fault protection including overvoltage, undervoltage, overcurrent (per-phase and rail), and thermal shutdown with hysteresis.

Key Specifications

Pinout & Package

VQFN package (RSM), 32-pin, 4 mm × 4 mm, 0.4 mm pitch, 1 mm max height, with exposed thermal pad requiring PCB soldering for thermal and mechanical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output SVID buck controller applications.

Compared with ISL95857IRZ-T and RT8806AGQW, the TPS51678RSMR uniquely delivers native dual 2-phase SVID control with D-CAP3™, RDS interface, and full IMVP-8/9 feature set-enabling single-chip, thermally coordinated, high-current mobile CPU/SoC power without external coordination logic.

Availability

TPS51678RSMR is available at Aetrix Electronics and suitable for ultrabook VRM design, thin-and-light laptop power systems, and mobile workstation SoC power delivery requiring stable component supply and long-term lifecycle support.

Supply support for TPS51678RSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions across industrial, automotive, and computing markets.

The TPS51678RSMR belongs to TI's IMVP-compliant power management IC portfolio, engineered specifically to meet Intel's mobile processor voltage regulation specifications, including dynamic VID scaling, phase shedding, and thermal coordination.

FAQ

What is the primary application domain for the TPS51678RSMR?

The TPS51678RSMR is designed exclusively for IMVP-8/9-compliant mobile CPU and SoC power delivery in ultrabooks and thin-and-light laptops. It requires a valid CNDA with Intel Corporation for access to full design documentation and must be used only in systems where the end user holds an active Intel CNDA agreement. The TPS51678RSMR implements dual 2-phase SVID control to meet stringent transient, efficiency, and thermal coordination requirements defined by Intel's mobile processor specification.

Does the TPS51678RSMR support both resistor-based and DCR-based current sensing?

Yes, the TPS51678RSMR supports programmable current sensing using either external sense resistors or lossless inductor DCR sensing. Configuration is performed via pin strapping or SMBus register writes, and gain/filter settings are adjustable to match specific MOSFET R_DS(on) or inductor DCR values. This flexibility allows the TPS51678RSMR to maintain ±2% current measurement accuracy across temperature and load conditions in high-density mobile VRMs.

What package type and thermal requirements apply to the TPS51678RSMR?

The TPS51678RSMR uses a 32-pin VQFN (RSM) package measuring 4 mm × 4 mm with 0.4 mm pitch and 1 mm maximum height. Its exposed thermal pad must be soldered to a dedicated PCB copper pour connected to internal ground and thermal vias for effective heat dissipation. TI recommends ≥77% solder paste coverage on the thermal pad and filling or tenting of thermal vias to ensure mechanical reliability and thermal performance up to 105°C ambient.

How does the TPS51678RSMR handle processor communication and voltage updates?

The TPS51678RSMR implements a full Intel SVID v3.0 interface with five bidirectional lines (VID0–VID4) supporting dynamic voltage identification, telemetry readback (temperature, current, voltage), and fault reporting. It processes VID commands with <50 ns latency and supports automatic phase shedding, C-state coordination, and adaptive voltage positioning-all required for IMVP-8/9 compliance. The TPS51678RSMR executes these functions autonomously without host CPU intervention.

Is the TPS51678RSMR pin-compatible with other members of the TPS5167x family?

No, the TPS51678RSMR is not pin-compatible with earlier TPS5167x variants such as TPS51670 or TPS51677 due to differences in SVID signaling, thermal monitoring pin assignment, and phase driver configuration. While all share the RSM-32 package outline, pin functions-including RDS_IN, PGOOD assignments, and BOOT routing-are unique to the TPS51678RSMR and validated only for IMVP-8/9 implementations. Board-level reuse requires full schematic and layout validation.