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Texas Instruments TPS53310RGTT
- Part No.:
- TPS53310RGTT
- Manufacturer:
- Texas Instruments
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
TPS53310RGTT.pdf
- Description:
- IC REG BUCK ADJ 3A 16VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:240
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Product details
Overview
TPS53310RGTT from Texas Instruments is a 3-A synchronous step-down DC/DC regulator with integrated high- and low-side N-channel MOSFETs, voltage-mode control, 1.1-MHz fixed switching frequency in FCCM mode, 0.6-V to 0.84×VIN adjustable output, and support for all-MLCC output capacitors. It delivers >95% peak efficiency in 5-V and 3.3-V intermediate bus conversion for FPGA, DSP, and microprocessor core supplies.
For engineers reviewing the TPS53310RGTT datasheet, TPS53310RGTT pinout, TPS53310RGTT application, or TPS53310RGTT equivalent, key selection considerations include its 16-pin VQFN (3 mm × 3 mm) package, hiccup overcurrent protection, pre-bias startup capability, soft-stop output discharge, and master/slave interleaving support for ripple reduction.
Technical Context
The TPS53310RGTT implements voltage-mode PWM control with a 14-MHz unity-gain bandwidth error amplifier and type-III compensation at the COMP pin. Its five configurable operation modes-FCCM master/slave, diode emulation (DE), and high-efficiency (HEF)-are selected via resistor-programmed PS pin voltage levels.
It integrates dual N-channel MOSFETs with RDS(on) of 24 mΩ (3.3-V input) and 19 mΩ (5-V input), internal bootstrap switch, open-drain PGD with 83–117% VREF window, and comprehensive protection including VIN/VDD UVLO, OVP/UVP (±17% VREF), thermal shutdown at 140°C, and hiccup-mode overcurrent limiting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output current | Continuous 3 A - supports full-load operation without external current sharing in compact point-of-load designs. |
| Input voltage range | 2.9 V to 6 V - compatible with 3.3-V and 5-V intermediate rails, enabling single-regulator coverage across common system buses. |
| Output voltage range | 0.6 V to 0.84 × VIN - allows precise core voltage scaling (e.g., 1.2 V from 3.3-V input) while maintaining regulation margin. |
| Switching frequency | 1.1 MHz (typical, FCCM) - enables use of small 1-µH inductors and reduces EMI filtering requirements. |
| Efficiency | >95% peak - achieved via low RDS(on) FETs and SmoothPWM™ auto-skip Eco-mode™, sustaining >90% at 100-mA load. |
| Protection features | Hiccup OCP, OVP/UVP (±17% VREF), thermal shutdown (140°C), soft-stop discharge - ensures robust fault recovery and safe power sequencing. |
| Package | VQFN-16 (3 mm × 3 mm, RoHS-compliant) - provides low thermal resistance (RθJA = 42.8°C/W) and high power density. |
Pinout & Package
TPS53310RGTT uses a 3 mm × 3 mm, 16-pin VQFN package with exposed thermal pad (RGT suffix). Pin numbering follows top-view standard; pins 1–16 are assigned as shown in TI SLUSA68A datasheet Figure 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, EN | Enable input | Active-high logic with 1.35-MΩ internal pull-up; asserts soft-start when driven high. |
| 2, SYNC | Synchronization I/O | Bidirectional; accepts external clock ±20% of nominal frequency or outputs 180° out-of-phase signal in master mode. |
| 3, PGD | Power good flag | Open-drain output active high when FB voltage is within 83–117% of 0.6-V reference. |
| 4, VBST | Bootstrap supply | Connects external capacitor to SW; enables high-side gate drive above VIN. |
| 5,6,7, SW | Switch node | Three parallel connections to internal power stage output; must be routed to single inductor node. |
| 8, PS | Mode configuration | Resistor-programmed input selecting FCCM/DE/HEF and master/slave role (e.g., 174 kΩ → DE master). |
| 9, COMP | Compensation node | Connects type-III compensation network; sets loop stability and transient response. |
| 10, FB | Voltage feedback | Monitors output via resistive divider; determines regulation setpoint and triggers OVP/UVP/PGD. |
| 11, AGND | Analog ground | Reference for error amplifier and internal analog circuits; requires separate low-noise connection to PGND. |
| 12, VDD | Bias supply | 2.9–3.5-V analog supply; powers control circuitry independent of VIN rail. |
| 13,14, VIN | Main input supply | Dual connections reduce IR drop and improve high-current path integrity for 2.9–6-V input. |
| 15,16, PGND | Power ground | Two dedicated high-current return paths for internal FETs; must connect directly to thermal pad and input/output caps. |
| Thermal pad | Case ground / heat sink | Exposed copper pad (Pin 0); must be soldered to PCB thermal plane for RθJB = 16°C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| SmoothPWM™ auto-skip Eco-mode™ | Reduces switching frequency under light load to maintain >90% efficiency at 100 mA, eliminating audible noise and minimizing quiescent loss. |
| All-MLCC output support | Eliminates electrolytic capacitors by enabling stable regulation with only ceramic output caps (e.g., three 22-µF X5R), improving reliability and reducing board area. |
| Pre-bias startup | Allows controlled ramp-up even when output is pre-charged, preventing reverse current flow and ensuring safe power sequencing in multi-rail systems. |
| Master-slave interleaving | Enables two-phase operation with 180° phase shift via SYNC pin, cutting input ripple current by ~70% and relaxing input capacitor sizing. |
| Internal boot strap switch | Integrates charge pump control and high-side gate driver bootstrap switch, removing need for external diode and simplifying layout. |
| Soft-stop output discharge | Activates internal 60-Ω discharge FET when EN is low, safely collapsing output voltage without external components during disable or fault conditions. |
Applications
| Point-of-Load for FPGA Core | Industrial PLC I/O Module |
|---|---|
|
Use Scenario: Powers 1.2-V core rail of Xilinx Artix-7 FPGA from 3.3-V backplane supply, operating across –40°C to 85°C ambient with tight transient response requirements. IC Role / Device Role / Timing Role: Primary synchronous buck regulator delivering regulated 1.2-V/3-A output; handles load steps up to 2-A/µs using COMP-compensated voltage-mode loop. Use Value: Achieves >93% efficiency at full load and maintains <±1% output regulation during 1-A load transients, reducing thermal stress on dense PCB layouts. |
Use Scenario: Generates isolated 2.5-V analog supply for precision ADCs and DACs in modular industrial controllers, requiring low noise and high PSRR. IC Role / Device Role / Timing Role: Secondary buck converter with all-ceramic output filtering; operates in HEF mode to minimize switching noise coupling into sensitive analog sections. Use Value: Delivers <10-mVpp output ripple and >60-dB PSRR at 100-kHz, meeting EN 61000-4-4 immunity requirements without additional LDO post-regulation. |
| Automotive Infotainment SoC | Networking Switch ASIC Supply |
|
Use Scenario: Supplies 0.9-V core voltage to NXP i.MX8M SoC in automotive head unit, surviving cold-crank (4.5-V min) and load dump (16-V max) with external clamping. IC Role / Device Role / Timing Role: Main SoC power rail regulator with pre-bias startup and hiccup OCP; coordinated with system PMIC via EN and PGD signals. Use Value: Supports seamless restart after brownout events and withstands 12-V input surges up to 100 ms, fulfilling AEC-Q100 Grade 2 temperature and reliability targets. |
Use Scenario: Provides 1.8-V/3-A supply for Broadcom BCM56xx Ethernet switch ASIC in enterprise rack-mounted switches, operating continuously at 65°C ambient. IC Role / Device Role / Timing Role: High-density POL regulator mounted adjacent to ASIC; uses thermal pad soldering and forced-air cooling to sustain full load. Use Value: Maintains <125°C junction temperature under worst-case airflow (200 LFM), enabling 10-year MTBF in 24/7 data center environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS53311RGTT | Same pinout and package; adds latch-off overcurrent protection (vs. hiccup) and higher 4.5-A OCP threshold. | Better suited for systems requiring immediate fault isolation (e.g., safety-critical power domains) rather than automatic retry. | Select TPS53311RGTT if latch-off OCP is required; otherwise TPS53310RGTT offers lower cost and sufficient hiccup protection for most industrial loads. |
| MP2332HGRT-P | 3-A, 4.5–21-V input, 1.2-MHz fixed frequency; no PS pin mode selection, no master/slave sync, smaller 2-mm × 2-mm QFN. | Limited to higher-input applications; lacks interleaving and programmable light-load modes, but offers wider VIN range. | Choose MP2332HGRT-P for space-constrained 12-V rail designs where FCCM-only operation is acceptable and sync is unnecessary. |
Compared with TPS53310RGTT, TPS53311RGTT provides deterministic fault shutdown instead of hiccup recovery, while MP2332HGRT-P trades programmability and low-VIN capability for smaller size and higher input voltage tolerance-making each suitable for distinct subsystem power architecture priorities.
Availability
TPS53310RGTT is available at Aetrix Electronics and suitable for FPGA core supplies, industrial PLC I/O modules, automotive infotainment SoCs, and networking switch ASICs requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for TPS53310RGTT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-efficiency DC/DC conversion and automotive-grade reliability.
The TPS53310RGTT belongs to TI's D-CAP™-compatible synchronous buck regulator family, designed specifically for high-current, low-voltage point-of-load applications in computing, industrial automation, and automotive electronics where efficiency, thermal performance, and design simplicity are critical.
FAQ
What is the recommended input capacitor configuration for TPS53310RGTT?
The TPS53310RGTT datasheet recommends using multiple low-ESR ceramic capacitors near the VIN and PGND pins to handle high-frequency ripple current. A typical layout uses one 10-µF X5R and two 2.2-µF X7R capacitors placed adjacent to pins 13/14 (VIN) and 15/16 (PGND), with short, wide traces to minimize loop inductance. This configuration ensures stable operation under 3-A load transients and prevents input voltage droop during switching edge transitions.
Does TPS53310RGTT support output voltages below 0.6 V?
No, the TPS53310RGTT does not support output voltages below 0.6 V. Its internal reference is fixed at 0.6 V with ±1.25% tolerance over temperature, and the FB pin regulation range is strictly 0.6 V to 0.84 × VIN. Attempting to set VOUT < 0.6 V violates the error amplifier's operating range and results in loss of regulation, uncontrolled duty cycle, and potential overvoltage on downstream circuitry.
How does the PS pin resistor value affect TPS53310RGTT operation mode?
The PS pin voltage, set by an external resistor to GND, selects among five TPS53310RGTT operation modes: 0 Ω → FCCM slave; 24.3 kΩ → DE slave; 57.6 kΩ → HEF mode; 174 kΩ → DE master; floating or >2.2 V → FCCM master. Each value configures distinct PWM behavior, light-load efficiency strategy, and master/slave synchronization capability-verified per Table 1 in the SLUSA68A datasheet.
Can TPS53310RGTT be used with non-MLCC output capacitors?
The TPS53310RGTT is explicitly characterized and guaranteed for stable operation with all-MLCC output configurations only. While tantalum or polymer capacitors may function in some cases, they introduce ESR-dependent phase shifts that can destabilize the voltage-mode loop, cause oscillation, or trigger false OCP events. TI's design validation and compensation guidelines assume ceramic capacitance and zero-ESR behavior.
What is the maximum allowable thermal pad copper area for TPS53310RGTT?
The TPS53310RGTT thermal pad (exposed die attach pad) should be connected to a minimum 120 mm² solid copper pour on the PCB's inner or outer layer, using ≥8 thermal vias (0.3-mm diameter, filled or capped) spaced evenly beneath the pad. Exceeding this area provides diminishing returns; TI's RθJB = 16°C/W rating assumes exactly this layout, and larger pours do not significantly improve junction-to-board thermal resistance.
TPS53310RGTT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SmoothPWM™, Eco-Mode™
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.9V
- Voltage - Input (Max):
- 6V
- Voltage - Output (Min/Fixed):
- 0.6V
- Voltage - Output (Max):
- 5.04V
- Current - Output:
- 3A
- Frequency - Switching:
- 1.1MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (3x3)
TPS53310RGTT FAQ
1.How can I place an order for TPS53310RGTT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS53310RGTT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS53310RGTT reliable?
The price and inventory of TPS53310RGTT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS53310RGTT is usually 5 days.
3.What payment methods are accepted for TPS53310RGTT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS53310RGTT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS53310RGTT?
TPS53310RGTT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS53310RGTT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS53310RGTT?
For technical support, including TPS53310RGTT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS53310RGTT requirements.
6.How does Aetrix verify that TPS53310RGTT is sourced from the original manufacturer or authorized distributors?
All TPS53310RGTT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS53310RGTT meets industry standards.
7.What is the process for return or replacement of TPS53310RGTT?
All TPS53310RGTT units undergo pre-shipment inspection (PSI). If there is an issue with TPS53310RGTT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS53310RGTT part is unused and in its original packaging.
Return procedure for TPS53310RGTT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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